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PDF MPXHZ6116A Data sheet ( Hoja de datos )
| Número de pieza | MPXHZ6116A | |
| Descripción | Media Resistant Integrated Silicon | |
| Fabricantes | Motorola Semiconductor Products | |
| Logotipo |  |
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Freescale Semiconductor
Technical Data
www.DataSheet4U.com
Media Resistant Integrated Silicon
Pressure Sensor for Measuring
Absolute Pressure, On-Chip Signal
Conditioned, Temperature
Compensated and Calibrated
The MPXHZ6116A series pressure sensor integrates on-chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The sensor’s packaging has been designed to
provide resistance to high humidity conditions as well as common automotive
media. The small form factor and high reliability of on-chip integration make this
sensor a logical and economical choice for the system designer.
The MPXHZ6116A series pressure sensor is a state-of-the-art, monolithic,
signal conditioned sensor designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D inputs.
This piezoresistive transducer combines advanced micromachining techniques,
thin–film metallization, and bipolar processing to provide an accurate, high level
analog output signal that is proportional to the applied pressure.
MPXHZ6116A
Rev 1, 05/2009
MPXHZ6116A
Series
INTEGRATED PRESSURE SENSOR
20 to 116 kPa (2.9 to 16.8 PSI)
0.399 to 4.645 V Output(
SUPER SMALL OUTLINE PACKAGE
MPXHZ6116A6U/6T1 MPXHZ6116AC6U/C6T1
CASE 1317-04
CASE 1317A-03
Features
• Resistant to High Humidity and Common Automotive Media
• 1.43% Maximum Error over 0 to 85C
• Temperature Compensated from -40°C to +125°C
• Durable Thermoplastic (PPS) Surface Mount Package (SSOP) with Optional
Axial Port
• Ideally Suited for Microprocessor or Microcontroller–Based Systems
SUPER SMALL OUTLINE PACKAGE
PIN NUMBERS(1)
1
N/C 5
N/C
2
VSS 6
N/C
3
GND
7
N/C
4
VOUT
8
N/C
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external circuitry
or ground. Pin 1 is denoted by the notch in the
lead.
Device Type
Options
SUPER SMALL OUTLINE PACKAGE
Basic Element Absolute, Element Only
Absolute, Element Only
Ported Element Absolute, Axial Port
Absolute, Axial Port
ORDERING INFORMATION
Case No. MPX Series Order No.
Packing Options Device Marking
1317
1317
1317A
1317A
MPXHZ6116A6U
MPXHZ6116A6T1
MPXHZ6116AC6U
MPXHZ6116AC6T1
Rails
Tape & Reel
Rails
Tape & Reel
MPXHZ6116A
MPXHZ6116A
MPXHZ6116A
MPXHZ6116A
This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2009. All rights reserved.
1 page  
www.DataSheeTte4Um.cpoemrature Error Band
4.0
3.0
2.0
MPXHZ6116A SERIES
Break Points
Temp Multiplier
- 40
0 to 85
125
2.85
0.96
1.66
1.0
0.0
-40 -20 0 20 40 60 80 100 120 140
Temperature in Cº
NOTE: The Temperature Multiplier is a linear response from 0ºC to -40ºC and from 85ºC to 125ºC
Pressure Error Band
3.0
2.0
1.0
0.0
-1.0
-2.0
-3.0
Error Limits for Pressure
20 40 60 80 100 120
Pressure (in kPa)
Pressure Error (Max)
20 to 115 (kPa) ±1.5 (kPa)
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.050
1.27
TYP
0.387
9.83
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 5. SSOP Footprint (Case 1317 and 1317A)
Sensors
Freescale Semiconductor
Preliminary
MPXHZ6116A
5
5 Page 
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Information in this document is provided solely to enable system and software
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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc., 2009. All rights reserved.
MPXHZ6116A
Rev. 1
05/2009
RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical
characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further
information, see http:/www.freescale.com or contact your Freescale sales representative.
For information on Freescale’s Environmental Products program, go to http://www.freescale.com/epp.
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