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PDF LT3011 Data sheet ( Hoja de datos )
| Número de pieza | LT3011 | |
| Descripción | 3V to 80V Low Dropout Micropower Linear Regulator | |
| Fabricantes | Linear Technology | |
| Logotipo |  |
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FEATURES
n Wide Input Voltage Range: 3V to 80V
n Low Quiescent Current: 46μA
n Low Dropout Voltage: 300mV
n Output Current: 50mA
n PWRGD Flag with Programmable Delay
n No Protection Diodes Needed
n Adjustable Output from 1.24V to 60V
n 1μA Quiescent Current in Shutdown
n Stable with 1μF Output Capacitor
n Stable with Ceramic, Tantalum, and Aluminum
Capacitors
n Reverse-Battery Protection
n No Reverse Current Flow from Output to Input
n Thermal Limiting
n Thermally Enhanced 12-Lead MSOP and
10-Pin (3mm × 3mm) DFN Packages
APPLICATIONS
n Low Current High Voltage Regulators
n Regulator for Battery-Powered Systems
n Telecom Applications
n Automotive Applications
LT3011
50mA, 3V to 80V Low
Dropout Micropower Linear
Regulator with PWRGD
DESCRIPTION
The LT®3011 is a high voltage, micropower, low dropout
linear regulator. The device is capable of supplying 50mA of
output current with a dropout voltage of 300mV. Designed
for use in battery-powered high voltage systems, the low
quiescent current (46μA operating and 1μA in shutdown)
is well controlled in dropout, making the LT3011 an ideal
choice.
The LT3011 includes a PWRGD flag to indicate output
regulation. The delay between regulated output level and
flag indication is programmable with a single capacitor.
The LT3011 also has the ability to operate with very small
output capacitors; it is stable with only 1μF on the output.
Small ceramic capacitors can be used without the addition
of any series resistance (ESR) as is common with other
regulators. Internal protection circuitry includes reverse-
battery protection, current limiting, thermal limiting, and
reverse current protection.
The LT3011 features an adjustable output with a 1.24V
reference voltage. The device is available in the thermally
enhanced 12-lead MSOP and the low profile (0.75mm)
10-pin (3mm × 3mm) DFN package, both providing excel-
lent thermal characteristics.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
TYPICAL APPLICATION
5V Supply with Shutdown
VIN
3V TO
80V
VSHDN
<0.3V
>2.0V
1μF 1.6M
POWER GOOD
OUTPUT
OFF
ON
IN OUT
LT3011
SHDN ADJ
PWRGD
GND CT
750k
249k
1000pF
VOUT
5V
50mA
1μF
3011 TA01
350
300
250
200
150
100
50
0
0
Dropout Voltage
10 20 30 40
OUTPUT CURRENT (mA)
50
3011 TA02
3011f
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LT3011
TYPICAL PERFORMANCE CHARACTERISTICS TJ = 25°C, unless otherwise noted.
Dropout Voltage
400
350
TJ 125oC
300
250 TJ 25oC
200
150
100
50
0
0 10 20 30 40 50
OUTPUT CURRENT (mA)
3011 G01
Guaranteed Dropout Voltage
600
= TEST POINTS
500
400
TJ b 125oC
300
TJ b 25oC
200
100
0
0 5 10 15 20 25 30 35 40 45 50
OUTPUT CURRENT (mA)
3011 G02
Dropout Voltage
400
350 IL = 50mA
300
250
IL = 10mA
200
150
IL = 1mA
100
50
0
–50 –25
0 25 50 75 100 125 150
TEMPERATURE (°C)
3011 G03
Quiescent Current
80
VIN = 6V
70
RL = ∞
IL = 0
60
VSHDN = VIN
50
40
30
20
10
0
–50 –25
VSHDN = GND
0 25 50 75 100 125 150
TEMPERATURE (°C)
3011 G04
ADJ Pin Voltage
1.250
IL = 1mA
1.248
1.246
1.244
1.242
1.240
1.238
1.236
1.234
1.232
1.230
–50 –25
0 25 50 75 100 125 150
TEMPERATURE (°C)
3011 G05
Quiescent Current
80
TJ = 25°C
70 RL = d
60
50 VSHDN = VIN
40
30
20
10
0
0 1 2 3 4 5 6 7 8 9 10
INPUT VOLTAGE (V)
3011 G06
GND Pin Current
2.0
1.8
1.6
RL = 24.8Ω
IL = 50mA*
1.4
1.2
1.0
RL = 49.6Ω
IL = 25mA*
0.8
0.6 RL = 124Ω
IL = 10mA*
0.4
0.2 RL = 1.24k, IL = 1mA*
0
0 1 2 3 4 5 6 7 8 9 10
INPUT VOLTAGE (V)
TJ = 25°C
*FOR VOUT = 1.24V
3011 G07
GND Pin Current vs IOUT
2.0
VIN = VOUT(NOMINAL) +1V
1.8 TJ = 25°C
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0 5 10 15 20 25 30 35 40 45 50
OUTPUT CURRENT (mA)
3011 G08
SHDN Pin Threshold
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
–50 –25
0 25 50 75 100 125 150
TEMPERATURE (°C)
3011 G09
3011f
5
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LT3011
APPLICATIONS INFORMATION
During normal operation, an internal glitch filter will ignore
short transients (<15μs). Longer transients below the 90%
threshold will reset the JK flip-flop. This flip-flop ensures
that the capacitor on the CT pin is quickly discharged all
the way to the VCT(LOW) threshold before restarting the
time delay. This provides a consistent time delay after the
ADJ pin is within 10% of the regulated voltage before the
PWRGD pin switches to high impedance.
Thermal Considerations
The power handling capability of the device will be limited by
the maximum rated junction temperature (125°C, LT3011E/
LT3011I or 150°C, LT3011H). The power dissipated by the
device will be made up of two components:
1. Output current multiplied by the input/output voltage
differential: IOUT • (VIN – VOUT) and,
2. GND pin current multiplied by the input voltage:
IGND • VIN
The GND pin current is found by examining the GND pin
current curves in the Typical Performance Characteristics
section. Power dissipation will be equal to the sum of the
two components listed above.
The LT3011 series regulators have internal thermal limiting
designed to protect the device during overload conditions.
For continuous normal conditions, the maximum junction
temperature rating of 125°C (LT3011E/ LT3011I) or 150°C
(LT3011H) must not be exceeded. It is important to give
careful consideration to all sources of thermal resistance
from junction to ambient. Additional heat sources mounted
nearby must also be considered.
ICT 3μA
CT
PWRGD
ADJ +
VREF • 90% –
JQ
K
VCT(HIGH)
– VBE
(z1.1V)
VCT(LOW)
z0.1V
Figure 4. PWRGD Circuit Block Diagram
3011 F04
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat gener-
ated by power devices.
The following table lists thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 board with one ounce
copper.
Table 1. MSOP Measured Thermal Resistance
COPPER AREA
THERMAL RESISTANCE
TOPSIDE BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
2500 sq mm 2500 sq mm 2500 sq mm
52°C/W
1000 sq mm 2500 sq mm 2500 sq mm
54°C/W
225 sq mm 2500 sq mm 2500 sq mm
58°C/W
100 sq mm 2500 sq mm 2500 sq mm
64°C/W
Table 2. DFN Measured Thermal Resistance
COPPER AREA
THERMAL RESISTANCE
TOPSIDE BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
2500 sq mm 2500 sq mm 2500 sq mm
52°C/W
1000 sq mm 2500 sq mm 2500 sq mm
54°C/W
225 sq mm 2500 sq mm 2500 sq mm
58°C/W
100 sq mm 2500 sq mm 2500 sq mm
64°C/W
The thermal resistance junction-to-case (θJC), measured
at the Exposed Pad on the back of the die, is 16°C/W.
Continuous operation at large input/output voltage dif-
ferentials and maximum load current is not practical due
to thermal limitations. Transient operation at high input/
output differentials is possible. The approximate thermal
time-constant for a 2500sq mm 3/32" FR-4 board, with
maximum topside and backside area for one ounce cop-
per, is three seconds. This time-constant will increase as
more thermal mass is added (i.e., vias, larger board and
other components).
For an application with transient high power peaks, average
power dissipation can be used for junction temperature
calculations as long as the pulse period is significantly less
than the thermal time constant of the device and board.
3011f
11
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| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet LT3011.PDF ] | |
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