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PI3012A Schematic ( PDF Datasheet ) - AMI SEMICONDUCTOR

Teilenummer PI3012A
Beschreibung 300DPI CIS Sensor Chip
Hersteller AMI SEMICONDUCTOR
Logo AMI SEMICONDUCTOR Logo 




Gesamt 7 Seiten
PI3012A Datasheet, Funktion
www.DataSheet4U.com
Peripheral
Imaging
Corporation
PI3012A
300DPI CIS Sensor Chip
Engineering Data Sheet
Description:
Peripheral Imaging Corporation PI3012A CIS sensor chip is a 300 dot per inch resolution
linear array image sensor chip which utilizes PIC’s proprietary CMOS Image Sensing
Technology. This image sensor is to be used for butting end-to-end on a printed circuit board
(PCB) using chip-on-board technology to form a scanning array with various lengths.
Applications for the sensor array are facsimile, scanner, check reader, and office automation
equipment.
Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 96 detector elements,
8080µm
1
23
4 ROW OF 96 SENSORS 93 94 95 96
AND VIDEO SIGNAL
LINE MULTIPLEXER
READOUT SHIFT REGISTER
380µm
BUFFER
SP
BUFFER
CP VDD DGND
CHIP
SELECT
IOUT
PI3012A SENSOR CHIP
FIGURE 1 BLOCK DIAGRAM
BUFFER
EOS
their associated multiplexing switches, buffers, and a chip selector. The detector element-to-element
spacing is approximately 84.6 µm. The size of each chip without scribe lines is 8080 µm by 380 µm.
Each sensor chip has 6 bonding pads. The pad symbols and functions are described in Table 1.
PAGE 1 of 7 PI3012A6, 6/9/99






PI3012A Datasheet, Funktion
www.DataSheet4U.com
1. Clock pulse width varies with frequency, as it was explained foregoing paragraphs. The
number given in table is the minimum value regardless of the clock frequency.
2. Prohibit crossing time to insure that two start pulses are not locked into the shift register in
any single scan time.
3. Pixel delay times and settling time depend on the output amplifier, which is employed. The
numbers, which are given, are measured with an EL2044 amplifier. Note the impulse signal
current out of the device is within 10 ns. Hence, the faster the amplifier with a quick settling
time and with a lower input capacitance will allow the signal to rise and settle quickly with
speeds greater than those given above.
Output Circuits for Video Signal
The circuit, attached on this document as separate page, is a recommended module circuit for
operating the sensors. It was also used in the forgoing characterization of the sensor’s signal
output. See page 7.
Optional Wafer Probe Classification
An optional wafer classification is available for users of the PI3012A devices. To achieve the
highest degree of amplitude uniformity, the wafers are sorted and classified. The wafers are rank
in accordance to their output amplitudes. Accordingly the users are assured of a greater uniform
output from a CIS module when the sensors are selected from the same wafer.
©1999 Peripheral Imaging Corporation. Printed in USA. All rights reserved. Specifications
are subject to change without notice. Contents may not be reproduced in whole or in part without
the express prior written permission of Peripheral Imaging Corporation. Information furnished
herein is believed to be accurate and reliable. However, no responsibility is assumed by Peripheral
Imaging Corporation for its use nor for any infringement of patents or other rights granted by
implication or otherwise under any patent or patent rights of Peripheral Imaging Corporation.
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