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Número de pieza | LBWA18HEPZ | |
Descripción | Wlan 802.11b/g Module | |
Fabricantes | Sychip | |
Logotipo | ||
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Features and Benefits
• Thin package:1.3mm
typ, 1.4mm max.
• Small footprint:8.2mm x
8.4mm
• Multiple power-save
modes to maximize
battery life
• Advanced Security
• Bluetooth active
signaling interface for
optimum packet
efficiency
• QoS Packet
prioritization for time
sensitive payload
• OS Support for
Windows Mobile, Linux
• WLAN SDIO / SPI Host
Interfaces
WLAN Product Brief
LBWA18HEPZ
WLAN 802.11b/g module
The LBWA18HEPZ is an IEEE 802.11b/g wireless LAN module
requiring just 64 square millimeters of host PCB area.
Integrated within the module are a host of active and passive
components resulting in a single simple package for the customer.
On module components include the WLAN chip, EEPROM, LDO
regulator, driver and power amplifier, crystal, balun, and SPDT
switch,
The feature set for WLAN includes IEEE 802.11i security, Quality
of Service (QoS) traffic prioritization for VoIP and multimedia
applications, an ultra low power sleep mode. An internal Bluetooth
signaling interface along with AFH is utilized for enhanced co-
existence for the two radios who share the same 2.4 GHz spectrum.
This module is targeted to consumer electronics where high
integration, proven coexistence, and fast design cycles are highly
valued.
The module integrates the latest silicon technology for mobile client
Wireless LAN offering the best feature set while minimizing space
and power consumption.
This module utilizes a QFN package and allows direct attachment
to the main Printed Circuit board utilizing industry standard surface
mount technology processing for high volume production.
Verion
Corporate Headquarters
Parkway Centre II
2805 North Dallas Parkway, Suite 400
Plano, TX 75093 U. S. A.
Tel: (1) 972-202-8888 • Fax: (1) 972-633-V03e2r7on0.1
1 page |
Páginas | Total 2 Páginas | |
PDF Descargar | [ Datasheet LBWA18HEPZ.PDF ] |
Número de pieza | Descripción | Fabricantes |
LBWA18HEPZ | Wlan 802.11b/g Module | Sychip |
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