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Número de pieza | MPC947 | |
Descripción | LOW VOLTAGE 1:9 CLOCK DISTRIBUTION CHIP | |
Fabricantes | Motorola Semiconductors | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de MPC947 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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SEMICONDUCTOR TECHNICAL DATA
Low Voltage 1:9 Clock
Distribution Chip
MPC947
The MPC947 is a 1:9 low voltage clock distribution chip. The device
features the capability to select between two LVTTL compatible inputs
and fans the signal out to 9 LVCMOS or LVTTL compatible outputs.
These 9 outputs were designed and optimized to drive 50Ω series
terminated transmission lines. With output–to–output skews of 500ps, the
MPC947 is ideal as a clock distribution chip for synchronous systems
www.DataSheweth4iUc.hconmeed a tight level of skew at a relatively low cost. For a similar
product targeted at a higher price/performance point, consult the
MPC948 data sheet.
LOW VOLTAGE
1:9 CLOCK
DISTRIBUTION CHIP
• Clock Distribution for PowerPC™ 620 L2 Cache
• 2 Selectable LVCMOS/LVTTL Clock Inputs
• 500ps Maximum Output–to–Output Skew
• Drives Up to 18 Independent Clock Lines
• Maximum Output Frequency of 110MHz
• Synchronous Output Enable
• Tristatable Outputs
• 32–Lead TQFP Packaging
• 3.3V VCC Supply Voltage
FA SUFFIX
32–LEAD TQFP PACKAGE
CASE 873A–02
With an output impedance of approximately 7Ω, in both the HIGH and
LOW logic states, the output buffers of the MPC947 are ideal for driving
series terminated transmission lines. More specifically, each of the 9
MPC947 outputs can drive two series terminated 50Ω transmission lines.
With this capability, the MPC947 has an effective fanout of 1:18 in
applications using point–to–point distribution schemes. With this level of
fanout, the MPC947 provides enough copies of low skew clocks for high
performance synchronous systems, including use as a clock distribution
chip for the L2 cache of a PowerPC 620 based system.
Two independent LVCMOS/LVTTL compatible clock inputs are available. Designers can take advantage of this feature to
provide redundant clock sources or the addition of a test clock into the system design. With the select input pulled HIGH, the
TTL_CLK1 input will be selected.
All of the control inputs are LVCMOS/LVTTL compatible. The MPC947 provides a synchronous output enable control to allow
for starting and stopping of the output clocks. A logic high on the Sync_OE pin will enable all of the outputs. Because this control
is synchronized to the input clock, potential output glitching or runt pulse generation is eliminated. In addition, for board level test,
the outputs can be tristated via the tristate control pin. A logic LOW applied to the Tristate input will force all of the outputs into
high impedance. Note that all of the MPC947 inputs have internal pullup resistors.
The MPC947 is fully 3.3V compatible. The 32–lead TQFP package was chosen to optimize performance, board space and
cost of the device. The 32–lead TQFP has a 7x7mm body size with a conservative 0.8mm pin spacing.
PowerPC is a trademark of International Business Machines Corporation.
1/97
© Motorola, Inc. 1997
1
REV 3
1 page OUTLINE DIMENSIONS
FA SUFFIX
TQFP PACKAGE
CASE 873A–02
ISSUE A
MPC947
A1
32
A
4X
0.20 (0.008) AB T–U Z
25
1
–T–
www.DataSheet4U.com B
B1
8
DETAIL Y
–U–
V
17 V1
9
–Z– 4X
9 S1
0.20 (0.008) AC T–U Z
S
–AB–
SEATING
PLANE
–AC–
G
0.10 (0.004) AC
8X M_
CE
R
DETAIL AD
BASE
METAL
FÉÉÉÉJNÉÉÉÉ D
SECTION AE–AE
W
H
K
X
Q_
DETAIL AD
AE
P
DETAIL Y
AE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
MILLIMETERS
DIM MIN MAX
A 7.000 BSC
A1 3.500 BSC
B 7.000 BSC
B1 3.500 BSC
C 1.400 1.600
D 0.300 0.450
E 1.350 1.450
F 0.300 0.400
G 0.800 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
M 12_ REF
N 0.090 0.160
P 0.400 BSC
Q 1_ 5_
R 0.150 0.250
S 9.000 BSC
S1 4.500 BSC
V 9.000 BSC
V1 4.500 BSC
W 0.200 REF
X 1.000 REF
INCHES
MIN MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055 0.063
0.012 0.018
0.053 0.057
0.012 0.016
0.031 BSC
0.002 0.006
0.004 0.008
0.020 0.028
12_ REF
0.004 0.006
0.016 BSC
1_ 5_
0.006 0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
TIMING SOLUTIONS
BR1333 — Rev 6
5
MOTOROLA
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet MPC947.PDF ] |
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