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NS6A083T Schematic ( PDF Datasheet ) - NICHIA CORPORATION

Teilenummer NS6A083T
Beschreibung TYPE AMBER LED
Hersteller NICHIA CORPORATION
Logo NICHIA CORPORATION Logo 




Gesamt 14 Seiten
NS6A083T Datasheet, Funktion
No. STSE-CC7101A
<Cat.No.070615>
www.DataSheet4U.com
SPECIFICATIONS FOR NICHIA CHIP TYPE AMBER LED
MODEL : NS6A083T
NICHIA CORPORATION
-0-






NS6A083T Datasheet, Funktion
Nichia STSE-CC7101A
<Cat.No.070615>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Reflow Soldering
Hand Soldering
Lead Solder
Lead-free Solder
Pre-heat
Pre-heat time
Peak
temperature
120 ~ 150°C
120 sec. Max.
240°C Max.
180 ~ 200°C
120 sec. Max.
260°C Max.
Temperature 350°C Max.
Soldering time 3 sec. Max.
(one time only)
Soldering time 10 sec. Max.
10 sec. Max.
Condition
refer to
refer to
Temperature - profile 1. Temperature - profile 2.
(N2 reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow or hand
www.DataSheseolt4dUer.icnogmat the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure.
<1 : Lead Solder>
<2 : Lead-free Solder>
2.5 ~ 5°C / sec.
240°C Max.
1 ~ 5°C / sec.
260°C Max.
2.5 ~ 5°C / sec.
Pre-heating
10sec. Max.
120 ~ 150°C 60sec.Max.
Above 200°C
1 ~ 5°C / sec.
Pre-heating
10sec. Max.
180 ~ 200°C 60sec.Max.
Above 220°C
120sec.Max.
[Recommended soldering pad design]
Thin line boxesSolder resist opening
Thick line boxesLand pattern
Make sure the die heat sink is electrically
connected to the cathode(K).
120sec.Max.
Use the following conditions shown in the figure.
(9.5)
Die Heat Sink
2.05
1.05
K 1.1 A
4.5
8
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow. It is recommended that the User use the nitrogen reflow method.
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
top of package. The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.
· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a hot plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs
will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· Die Heat sink is to be soldered. If not, please use the heat conductive adhesive.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
-5-

6 Page









NS6A083T pdf, datenblatt
Internal Circuit
AK
Protection device
Die Heatsink
4.3
3.2
Cathode
Die Heatsink
Cathode mark
6.5 C 1.5
5
3.4
0.6
4.85
Anode
ITEM
PACKAGE
ENCAPSULATING RESIN
ELECTRODES
MATERIALS
Heat-Resistant Polymer
Silicone Resin (with Phosphor)
Ag Plating Copper Alloy
½ NS6x083 has a protection device built in as a protection
circuit against static electricity.
Model
NS6x083
Unit
mm
NICHIA CORPORATION Title OUTLINE DIMENSIONS 7/1
Scale
No. 061026652612
Allow
±0.2

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