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PDF MD4832-Dxx Data sheet ( Hoja de datos )
| Número de pieza | MD4832-Dxx | |
| Descripción | Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk | |
| Fabricantes | M-Systems | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MD4832-Dxx (archivo pdf) en la parte inferior de esta página. Total 30 Páginas | ||
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Mobile DiskOnChip G3
512Mbit/1Gbit Flash Disk with MLC NAND and
M-Systems’ x2 Technology
Preliminary Data Sheet, June 2003
www.DataSheet4UH.ciogmhlights
Mobile DiskOnChip G3 is one of the industry’s
most efficient storage solutions, using
Toshiba’s 0.13 µm Multi-Level Cell (MLC)
NAND flash technology and x2 technology
from M-Systems®. MLC NAND flash
technology provides the smallest die size by
storing 2 bits of information in a single memory
cell. x2 technology enables MLC NAND to
achieve highly reliable, high-performance data
and code storage with a specially designed error
detection and correction mechanism, optimized
file management, and proprietary algorithms for
enhanced performance.
Further cost benefits derive from the
cost-effective architecture of Mobile
DiskOnChip G3, which includes a boot block
that can replace expensive NOR flash, and
incorporates both the flash array and an
embedded thin controller in a single die.
Mobile DiskOnChip G3 provides:
Flash disk for both code and data storage
Low voltage: 1.8V or 3.3 I/O (auto-detect),
3V Core
Hardware protection and security-enabling
features
High capacity: single die - 512Mb (64MB),
dual die - 1Gb (128MB)
Device cascade capacity: up to 2Gb
(256MB)
Enhanced Programmable Boot Block
enabling eXecute In Place (XIP)
functionality using 16-bit interface
Small form factors:
512Mb (64MB) capacity (single die):
48-pin TSOP-I package
85-ball FBGA 7x10 mm package
1Gb (128MB) capacity (dual die):
69-ball FBGA 9x12 mm package
Enhanced performance by implementation
of:
Multi-plane operation
DMA support
MultiBurst operation
Turbo operation
Unrivaled data integrity with a robust Error
Detection Code/Error Correction Code
(EDC/ECC) tailored for MLC NAND flash
technology
Maximized flash endurance with TrueFFS®
6.1 (and higher)
Support for major mobile operating systems
(OSs), including Symbian OS, Pocket PC
2002/3, Smartphone 2002/3, Palm OS,
Nucleus, Linux, Windows CE, and more.
Compatible with major mobile CPUs,
including TI OMAP, XScale, Motorola
DragonBall MX1 and Qualcomm
MSMxxxx.
1
Preliminary Data Sheet, Rev. 1.0
91-SR-011-05-8L
1 page  
Mobile DiskOnChip G3
3.8 Data Pipeline .................................................................................................................... 33
3.9 Control and Status............................................................................................................ 33
3.10 Flash Architecture............................................................................................................. 34
4. x2 Technology ......................................................................................................................... 36
4.1 MultiBurst Operation......................................................................................................... 36
4.2 DMA Operation................................................................................................................. 38
4.3 Combined MultiBurst Mode and DMA Operation ............................................................. 39
www.DataSheet4U.com
4.4 Turbo Operation ............................................................................................................... 39
5. Hardware Protection ............................................................................................................... 40
5.1 Method of Operation......................................................................................................... 40
5.2 Low-Level Structure of the Protected Area....................................................................... 41
6. Modes of Operation................................................................................................................. 43
6.1 Normal Mode .................................................................................................................... 44
6.2 Reset Mode ...................................................................................................................... 44
6.3 Deep Power-Down Mode ................................................................................................. 44
7. TrueFFS Technology............................................................................................................... 46
7.1 General Description.......................................................................................................... 46
7.1.1
7.1.2
7.1.3
7.1.4
7.1.5
7.1.6
7.1.7
7.1.8
7.1.9
Built-In Operating System Support..................................................................................... 47
TrueFFS Software Development Kit (SDK)........................................................................ 47
File Management................................................................................................................ 47
Bad Block Management ..................................................................................................... 47
Wear-Leveling .................................................................................................................... 47
Power Failure Management ............................................................................................... 48
Error Detection/Correction.................................................................................................. 48
Special Features Through I/O Control (IOCTL) Mechanism.............................................. 49
Compatibility ....................................................................................................................... 49
7.2 8KB Memory Window ....................................................................................................... 49
8. Register Descriptions ............................................................................................................. 50
8.1 Definition of Terms ........................................................................................................... 50
8.2 Reset Values .................................................................................................................... 50
8.3 No Operation (NOP) Register........................................................................................... 51
8.4 Chip Identification (ID) Register [0:1]................................................................................ 51
8.5 Test Register .................................................................................................................... 51
8.6 Bus Lock Register ............................................................................................................ 52
8.7 Endian Control Register ................................................................................................... 53
2
Data Sheet, Rev. 1.0
91-SR-011-05-8L
5 Page 
Mobile DiskOnChip G3
7x10 FBGA Package
12345678
A MM
MM
B M M MM MMM M
www.DataSheet4U.com C
D
A
A7
RSRVD
RSRVD
WE#
A8
A11
A3
A6
RSRVD
RSTIN#
RSRVD
RSRVD
A12
RSRVD
E A2
A5
RSRVD
BUSY#
RSRVD
A9
LOCK#
RSRVD
F A1 A4 IF_CFG M
M A10 ID0 IRQ#
G A0/
DPD
VSS
D1
M
M D6 DMARQ# ID1
H CE# OE# D9 D3
D4 D13 D15 RSRVD
J RSRVD
D0
D10
VCC
VCCQ
D12
D7
VSS
K D8 D2 D11 CLK D5 D14
L M M MM MMM M
M MM
MM
Figure 2: 7x10 FBGA Ballout for Standard Interface (Mobile DiskOnChip G3 512Mb)
8
Data Sheet, Rev. 1.0
91-SR-011-05-8L
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet MD4832-Dxx.PDF ] | |
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