|
|
PDF HWD4863 Data sheet ( Hoja de datos )
| Número de pieza | HWD4863 | |
| Descripción | Dual 2.2W Audio Amplifier Plus Stereo Headphone Function | |
| Fabricantes | Chengdu Sino Microelectronics System | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de HWD4863 (archivo pdf) en la parte inferior de esta página. Total 22 Páginas | ||
|
No Preview Available !
www.DataSheet4U.com
HWD4863
Dual 2.2W Audio Amplifier Plus Stereo Headphone
Function
General Description
Key Specifications
TheHWD4863 is a dual bridge-connected audio power ampli- n PO at 1% THD+N
fier which, when connected to a 5V supply, will deliver 2.2W n HWD4863LQ, 3Ω, 4Ω loads
2.5W(typ), 2.2W(typ)
to a 4Ω load (Note 1) or 2.5W to a 3Ω load (Note 2) with less
than 1.0% THD+N. In addition, the headphone input pin
allows the amplifiers to operate in single-ended mode when
driving stereo headphones.
Boomer audio power amplifiers were designed specifically to
provide high quality output power from a surface mount
package while requiring few external components. To sim-
plify audio system design, theHWD4863 combines dual bridge
n HWD4863MTE, 3Ω, 4Ω loads
n HWD4863MTE, 8Ω load
n HWD4863, 8Ω
2.5W(typ), 2.2W(typ)
1.1W(typ)
1.1W(typ)
n Single-ended mode THD+N at 75mW into
32Ω 0.5%(max)
n Shutdown current
0.7µA(typ)
n Supply voltage range
2.0V to 5.5V
speaker amplifiers and stereo headphone amplifiers on one
chip.
Features
TheHWD4863 features an externally controlled, low-power n Stereo headphone amplifier mode
consumption shutdown mode, a stereo headphone amplifier n “Click and pop” suppression circuitry
mode, and thermal shutdown protection. It also utilizes cir- n Unity-gain stable
cuitry to reduce “clicks and pops” during device turn-on.
n Thermal shutdown protection circuitry
Note 1: AnHWD4863MTE or HWD4863LQ that has been properly mounted to n SOIC, DIP, TSSOP and exposed-DAP TSSOP and LLP
a circuit board will deliver 2.2W into 4Ω. The other package options for the
HWD4863 will deliver 1.1W into 8Ω. See the Application Information sections
packages
for further information concerning theHWD4863MTE and HWD4863LQ.
ApplicationsNote 2: AnHWD4863MTE or HWD4863LQ that has been properly mounted to a
circuit board and forced-air cooled will deliver 2.5W into 3Ω.
n Multimedia monitors
n Portable and desktop computers
n Portable televisions
Typical Application
Note: Pin out shown for DIP and SO packages. Refer to the Connection Diagrams for the pinout of the TSSOP, Exposed-DAP TSSOP, and Exposed-DAP
LLP packages.
1
1 page  
www.DataSheet4U.com
Typical Performance Characteristics
MTE Specific Characteristics
HWD4863MTE
THD+N vs Output Power
HWD4863MTE
THD+N vs Frequency
01288197
HWD4863MTE
THD+N vs Output Power
HWD4863MTE
THD+N vs Frequency
01288199
01288196
HWD4863MTE
Power Dissipation vs Power Output
01288198
HWD4863MTE
Power Derating Curve
01288190
5
01288195
5 Page 
www.DataSheet4U.com
External Components Description
(Refer to Figure 1.)
Components
Functional Description
1. Ri The Inverting input resistance, along with Rf, set the closed-loop gain. Ri, along with Ci, form a high pass
filter with fc = 1/(2πRiCi).
2. Ci The input coupling capacitor blocks DC voltage at the amplifier’s input terminals. Ci, along with Ri, create a
highpass filter with fc = 1/(2πRiCi). Refer to the section, SELECTING PROPER EXTERNAL
COMPONENTS, for an explanation of determining the value of Ci.
3. Rf The feedback resistance, along with Ri, set the closed-loop gain.
4. Cs The supply bypass capacitor. Refer to the POWER SUPPLY BYPASSING section for information about
properly placing, and selecting the value of, this capacitor.
5. CB The capacitor, CB, filters the half-supply voltage present on the BYPASS pin. Refer to the SELECTING
PROPER EXTERNAL COMPONENTS section for information concerning proper placement and selecting
CB’s value.
Application Information
EXPOSED-DAP PACKAGE PCB MOUNTING
CONSIDERATIONS
The HWD4863’s exposed-DAP (die attach paddle) packages
(MTE and LQ) provide a low thermal resistance between the
die and the PCB to which the part is mounted and soldered.
This allows rapid heat transfer from the die to the surround-
ing PCB copper traces, ground plane and, finally, surround-
ing air. The result is a low voltage audio power amplifier that
produces 2.2W at ≤ 1% THD with a 4Ω load. This high power
is achieved through careful consideration of necessary ther-
mal design. Failing to optimize thermal design may compro-
mise the HWD4863’s high power performance and activate
unwanted, though necessary, thermal shutdown protection.
The MTE and LQ packages must have their DAPs soldered
to a copper pad on the PCB. The DAP’s PCB copper pad is
connected to a large plane of continuous unbroken copper.
This plane forms a thermal mass and heat sink and radiation
area. Place the heat sink area on either outside plane in the
case of a two-sided PCB, or on an inner layer of a board with
more than two layers. Connect the DAP copper pad to the
inner layer or backside copper heat sink area with 32(4x8)
(MTE) or 6(3x2) (LQ) vias. The via diameter should be
0.012in - 0.013in with a 1.27mm pitch. Ensure efficient ther-
mal conductivity by plating-through and solder-filling the
vias.
Best thermal performance is achieved with the largest prac-
tical copper heat sink area. If the heatsink and amplifier
share the same PCB layer, a nominal 2.5in2 (min) area is
necessary for 5V operation with a 4Ω load. Heatsink areas
not placed on the same PCB layer as the HWD4863 should be
5in2 (min) for the same supply voltage and load resistance.
The last two area recommendations apply for 25˚c ambient
temperature. Increase the area to compensate for ambient
temperatures above 25˚c. In systems using cooling fans, the
HWD4863MTE can take advantage of forced air cooling. With
an air flow rate of 450 linear-feet per minute and a 2.5in2
exposed copper or 5.0in2 inner layer copper plane heatsink,
theHWD4863MTE can continuously drive a 3Ω load to full
power. The HWD4863LQ achieves the same output power
level without forced air cooling. In all circumstances and
conditions, the junction temperature must be held below
150˚C to prevent activating the HWD4863’s thermal shutdown
protection. The HWD4863’s power de-rating curve in the Typi-
cal Performance Characteristics shows the maximum
power dissipation versus temperature. Example PCB layouts
for the exposed-DAP TSSOP and LLP packages are shown
in the Demonstration Board Layout section. Further de-
tailed and specific information concerning PCB layout, fabri-
cation, and mounting an LLP package is available from
Chengdu SinoMicroelectronics package Engineering Group.
When contacting them, ask for ’Preliminary Application Note
for the Assembly of the LLP Package on a Printed Circuit
Board, Revision A dated 7/14/00.’
PCB LAYOUT AND SUPPLY REGULATION
CONSIDERATIONS FOR DRIVING 3Ω AND 4Ω LOADS
Power dissipated by a load is a function of the voltage swing
across the load and the load’s impedance. As load imped-
ance decreases, load dissipation becomes increasingly de-
pendent on the interconnect (PCB trace and wire) resistance
between the amplifier output pins and the load’s connec-
tions. Residual trace resistance causes a voltage drop,
which results in power dissipated in the trace and not in the
load as desired. For example, 0.1Ω trace resistance reduces
the output power dissipated by a 4Ω load from 2.1W to 2.0W.
This problem of decreased load dissipation is exacerbated
as load impedance decreases. Therefore, to maintain the
highest load dissipation and widest output voltage swing,
PCB traces that connect the output pins to a load must be as
wide as possible.
Poor power supply regulation adversely affects maximum
output power. A poorly regulated supply’s output voltage
decreases with increasing load current. Reduced supply
voltage causes decreased headroom, output signal clipping,
and reduced output power. Even with tightly regulated sup-
plies, trace resistance creates the same effects as poor
supply regulation. Therefore, making the power supply
traces as wide as possible helps maintain full output voltage
swing.
11
11 Page | ||
| Páginas | Total 22 Páginas | |
| PDF Descargar | [ Datasheet HWD4863.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| HWD4863 | Dual 2.2W Audio Amplifier Plus Stereo Headphone Function | Chengdu Sino Microelectronics System |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |