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U0805F104ZCT Schematic ( PDF Datasheet ) - Multicomp

Teilenummer U0805F104ZCT
Beschreibung Multilayer Ceramic Capacitors
Hersteller Multicomp
Logo Multicomp Logo 




Gesamt 19 Seiten
U0805F104ZCT Datasheet, Funktion
www.DataSheet4U.com
Nickel Barrier
Multilayer Ceramic Capacitors
Features:
Multilayer ceramic chip capacitor.
Nickel barrier termination.
High performance and reliability.
0603, 0805, and 1206 case size.
Rated Voltage
Code
Rated Voltage
A
B
T
U
Part Dimension
100
16
25
50
Length
(L)
1.6 ±0.1
2.0 ±0.2
3.2 ±0.2
Width
(W)
Maximum
Thickness
(T)
0.8 ±0.1
1.25 ±0.1
1.40
1.60 ±0.2
1.52
Dimensions
Minimum
MB
0.20
0.25
Minimum
G
0.40
0.70
1.40
Voltage
(V)
6.3 ~ 50
6.3 ~ 500
6.3 ~ 1000
Type
0603
0805
1206
Page 1
27/04/06 V1.0






U0805F104ZCT Datasheet, Funktion
www.DataSheet4U.com
Nickel Barrier
Multilayer Ceramic Capacitors
Item
Performance
External
Appearance
No mechanical damage
Capacitance
Change
(C/C)
NPO: ±5% or ±0.5 pF maximum
(Whichever is larger)
X7R/X5R: ±12.5%
Y5V: ±30%
Z5U: ±30%
Humidity
(Steady
State)
and
Humidity
Load
DF
NPO: C 30pF: Q 350
10pFC<30pF:
Q100+2.5°C
C<10pF: 200+10°C
PS: C: Nominal Capacitance (pF)
C<30pF:Q 400 + 20°C
PS: C : Nominal capacitance (pF)
X7R, X5R: Less than 2 times of initial
value
Y5V and Z5U: Less than 1.5 times of
initial value
IR
500Mminimum or 25*F
(Which ever is smaller)
Test or Inspection Method
Humidity load: (Not apply for the product with rated voltage
250V):
Apply the rated voltage at temperature 40 ±2°C and humidity
90 to 95%RH for 1000+48/-0 hours.
Leave the capacitors in ambient condition for the following time
before measurement.
Class 1: 1~2 hours.
Class 2: 24 ±2 hours.
Charge / discharge current shall not exceed 50 mA.
Preconditioning: (only for class 2):
Apply the rated DC voltage for 1hour at 40 ±2°C. Remove and
let sit for 48 ±4 hours at room temperature.
Perform initial measurement.
Humidity (steady state):
The test procedure is same as that in Humidity load but only
without rated voltage applied.
External
Appearance
No mechanical damage
Capacitance
Change
(C/C)
NPO: ±3% or ±0.3 pF maximum
(Whichever is larger)
X7R/X5R: ±12.5%
Y5V: ±30%
Z5U: ±30%
Load Life
DF
NPO: C 30pF : Q 350
30pF>:C 10pF:
Q 275 +205°C
C<10pF: Q 200 + 10°C
PS: C : Nominal capacitance (pF)
X7R, X5R: Less than 2 times of initial
value
Y5V and Z5U : Less than 1.5 times of
initial value
Apply 2 x rated voltage at maximum operating temperature
±2°C for 1000 +48/-10 hours.
Leave the capacitors in ambient condition for the following time
before measurement.
Class I: 1~2 hours
Class II: 24 ±2 hours
Charge / discharge current shall. not exceed 50 mA.
Preconditioning: (only for class 2):
Apply 200% of the rated DC voltage for 1 hour at the maximum
operating temperature ±3°C. Remove and let sit for 24 ±2
hours at room temperature.
Perform initial measurement.
IR
1000Mminimum or 50*F
(Whichever is smaller)
Page 6
27/04/06 V1.0

6 Page









U0805F104ZCT pdf, datenblatt
www.DataSheet4U.com
Nickel Barrier
Multilayer Ceramic Capacitors
Soldering Flux and Solder
(1) Solder Flux:
a. The content of halogen in the soldering shall be 0.2 wt% or less.
b. Rosin-based and non-activated soldering flux is recommended.
(2) Water soluble type Soldering Flux:
In case of water soluble type soldering flux being applied, the flux residue on the surface of PC boards may have influences on the
reliability of the components and cause deterioration and failures of them.
(3) Solder:
An eutectic solder (Sn63:Pb37) is recommended.
Soldering
Since a multilayer ceramic chip capacitor comes into direct contact with melted solder during soldering. It is exposed to potentially
damaging mechanical stress caused by the sudden temperature change. The capacitor may also be subject to silver migration, and
to contamination by the flux. Because of these factors, soldering technique is critical. Adhere to the following guidelines.
Hand soldering
In hand soldering of the Capacitors, large temperature gradient between preheated the capacitors and the tip of soldering iron may
cause electrical failures and mechanical damages such as cracking of breaking of the devices. The soldering shall be carefully
controlled and carried out so that the temperature gradient is kept minimum with following recommended
conditions for hand soldering.
Recommended Soldering Conditions:
(1) Solder:
φ1mm Thread eutectic solder (Sn63:Pb37) with soldering flux *in the core.
*Rosin-based, and mom-activated flux is recommended.
(2) Preheating:
The capacitors shall be preheated so that “Temperature Gradient” between the devices and the tip of soldering iron is 150°C or
below.
(3) Soldering iron:
Rated Power of 20W Max with 3mm soldering tip in diameter.
Temperature of soldering iron tip: 300°C maximum.
(The required amount of solder shall be melted in advance on the soldering tip.)
(4)Cooling:
After soldering, the Capacitors shall cooled gradually at room ambient temperature.
Flow Soldering
In flow soldering process, abnormal and thermal and mechanical stresses, caused by “Temperature Gradient” between the mounted
Capacitors, resulting in failures and damages of the capacitors. So it is essential that the soldering process shall controlled to the
following recommended conditions and precautions. (See Figure 6)
Figure 6 Recommended Soldering Temperature Time Profile (Flow soldering)
Page 12
27/04/06 V1.0

12 Page





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