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JS28F008 Schematic ( PDF Datasheet ) - Intel

Teilenummer JS28F008
Beschreibung (JS28Fxxx) Advanced Boot Block Flash Memory
Hersteller Intel
Logo Intel Logo 




Gesamt 70 Seiten
JS28F008 Datasheet, Funktion
www.DataSheet4U.com
Intel® Advanced Boot Block Flash
Memory (B3)
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Datasheet
Product Features
Flexible SmartVoltage Technology
— 2.7 V – 3.6 V read/program/erase
— 12 V VPP fast production programming
1.65 V – .5 V or 2.7 V – 3.6 V I/O option
— Reduces overall system power
High Performance
— 2.7 V – 3.6 V: 70 ns max access time
Optimized Block Sizes
— Eight 8-KB blocks for data, top or
bottom locations
— Up to 127 x 64-KB blocks for code
Block Locking
— VCC-level control through Write Protect
WP#
Low Power Consumption
— 9 mA typical read current
Absolute Hardware-Protection
— VPP = GND option
— VCC lockout voltage
Extended Temperature Operation
— –40 °C to +85 °C
Automated Program and Block Erase
— Status registers
Intel® Flash Data Integrator Software
—Flash Memory Manager
—System Interrupt Manager
—Supports parameter storage, streaming
data (for example, voice)
Extended Cycling Capability
—Minimum 100,000 block erase cycles
Automatic Power Savings Feature
—Typical ICCS after bus inactivity
Standard Surface Mount Packaging
—48-Ball CSP packages
—40-Lead and 48-Lead TSOP packages
Density and Footprint Upgradeable for
common package
—8-, 16-, 32-, and 64-Mbit densities
ETOX™ VIII (0.13 µm) Flash
Technology
—16-Mbit and 32-Mbit densities
ETOX™ VII (0.18 µm) Flash Technology
—16-, 32-, and 64-Mbit densities
ETOX ™ VI (0.25µm) Flash Technology
—8-, 16-, and 32-Mbit densities
Bo not use the x8 option for new designs
The Intel® Advanced Boot Block Flash Memory (B3) device, manufactured on the Intel 0.13 µm
and 0.18 µm technologies, is a feature-rich solution at a low system cost. The B3 device in x16 is
available in 48-lead TSOP and 48-ball CSP packages. The x8 option of this product family is
available only in 40-lead TSOP and 48-ball µBGA* packages. For additional information about
this product family, see the Intel website: http://www.intel.com/design/flash.
Notice: This specification is subject to change without notice. Verify with your local Intel sales
office that you have the latest datasheet before finalizing a design.
Order Number: 290580, Revision: 020
18 Aug 2005






JS28F008 Datasheet, Funktion
www.DataSheet4U.com
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Revision
Number
-007
-008
-009
-010
-011
-012
-013
-014
-015
-016
-017
-018
-019
-020
Description
Corrected RP# pin description in Table 2, 3 Volt Advanced Boot Block Pin Descriptions
Corrected typographical error fixed in Ordering Information
4-Mbit packaging and addressing information corrected throughout document
Corrected 4-Mbit memory addressing tables in Appendices D and E
Max ICCD changed to 25 µA
VCCMax on 32 M (28F320B3) changed to 3.3 V
Added 64-Mbit density and faster speed offerings
Removed access time vs. capacitance load curve
Changed references of 32Mbit 80ns devices to 70ns devices to reflect the faster product
offering.
Changed VccMax=3.3V reference to indicate the affected product is the 0.25µm 32Mbit
device.
Minor text edits throughout document.
Added New Pin-1 indicator information on 40 and 48Lead TSOP packages.
Minor text edits throughout document.
Added specifications for 0.13 micron product offerings throughout document
Minor text edits throughout document.
Adjusted ordering information.
Adjusted specifications for 0.13 micron product offerings.
Revised and corrected DC Characteristics Table.
Adjusted package diagram information.
Minor text edits throughout document.
Updated ordering information.
Adjusted specifications for 0.13 micron product offerings.
Updated AC/DC Characteristics Table.
Added TSOP and µBGA* package diagram information.
Minor text edits throughout document.
Updated the layout of the datasheet.
Added line items to Table 34 “Ordering Information: Valid Combinations” on page 70.
Removed all x8 products from ordering information, page 70
18 Aug 2005
6
Intel® Advanced Boot Block Flash Memory (B3)
Order Number: 290580, Revision: 020
Datasheet

6 Page









JS28F008 pdf, datenblatt
www.DataSheet4U.com
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Table 4.
Size
(KW)
4
4
4
4
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
16-Mbit and 32-Mbit Word-Wide Memory Addressing Map (Sheet 2 of 4)
16-Mbit and 32-Mbit Word-Wide Memory Addressing
Top Boot
Bottom Boot
16 Mbit
32 Mbit
Size
(KW)
FB000-FBFFF 1FB000-1FBFFF 32
FA000-FAFFF 1FA000-1FAFFF 32
F9000-F9FFF 1F9000-1F9FFF 32
F8000-F8FFF 1F8000-1F8FFF 32
F0000-F7FFF 1F0000-1F7FFF 32
E8000-EFFFF 1E8000-1EFFFF 32
E0000-E7FFF 1E0000-1E7FFF 32
D8000-DFFFF 1D8000-1DFFFF
D0000-D7FFF
C8000-CFFFF
C0000-C7FFF
B8000-BFFFF
B0000-B7FFF
A8000-AFFFF
A0000-A7FFF
98000-9FFFF
90000-97FFF
88000-8FFFF
80000-87FFF
78000-7FFFF
70000-77FFF
68000-6FFFF
60000-67FFF
58000-5FFFF
50000-57FFF
48000-4FFFF
40000-47FFF
38000-3FFFF
30000-37FFF
28000-2FFFF
1D0000-1D7FFF
1C8000-1CFFFF
1C0000-1C7FFF
1B8000-1BFFFF
1B0000-1B7FFF
1A8000-1AFFFF
1A0000-1A7FFF
198000-19FFFF
190000-197FFF
188000-18FFFF
180000-187FFF
178000-17FFFF
170000-177FFF
168000-16FFFF
160000-167FFF
158000-15FFFF
150000-157FFF
148000-14FFFF
140000-147FFF
138000-13FFFF
130000-137FFF
128000-12FFFF
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
8 Mbit
16 Mbit
32 Mbit
F8000-FFFFF
F0000-F7FFF
1D8000-
1DFFFF
1D0000-
1D7FFF
1C8000-
1CFFFF
1C0000-
1C7FFF
1B8000-
1BFFFF
1B0000-
1B7FFF
1A8000-
1AFFFF
1A0000-
1A7FFF
198000-19FFFF
190000-197FFF
188000-18FFFF
180000-187FFF
178000-17FFFF
170000-177FFF
168000-16FFFF
160000-167FFF
158000-15FFFF
150000-157FFF
148000-14FFFF
140000-147FFF
138000-13FFFF
130000-137FFF
128000-12FFFF
120000-127FFF
118000-11FFFF
110000-117FFF
108000-10FFFF
100000-107FFF
0F8000-0FFFFF
0F0000-0F7FFF
18 Aug 2005
12
Intel® Advanced Boot Block Flash Memory (B3)
Order Number: 290580, Revision: 020
Datasheet

12 Page





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