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PDF TS274 Data sheet ( Hoja de datos )
| Número de pieza | TS274 | |
| Descripción | HIGH SPEED CMOS QUAD OPERATIONAL AMPLIFIERS | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de TS274 (archivo pdf) en la parte inferior de esta página. Total 15 Páginas | ||
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TS274
High performance CMOS quad ooperational amplifiers
■ Output voltage can swing to ground
■ Excellent phase margin on capacitive loads
■ Gain bandwidth product: 3.5MHz
■ Stable and low offset voltage
■ Three input offset voltage selections
Description
The TS274 devices are low cost, quad operational
amplifiers designed to operate with single or dual
supplies. These operational amplifiers use the ST
silicon gate CMOS process allowing an excellent
consumption-speed ration. These series are ideally
suited for low consumption applications.
Three power consumptions are available allowing
to have always the best consumption-speed ratio:
– ICC = 10µA/amp.: TS27L4 (very low power)
– ICC = 150µA/amp.: TS27M4 (low power)
– ICC = 1mA/amp.: TS274 (standard)
These CMOS amplifiers offer very high input
impedance and extremely low input currents. The
major advantage versus JFET devices is the very
low input currents drift with temperature (see
figure 2).
N
DIP-14
(Plastic Package)
D
SO-14
(Plastic Micropackage)
P
TSSOP14
(Thin Shrink Small Outline Package)
Pin connections (top view)
Output 1 1
Inverting Input 1 2
Non-inverting Input 1 3
VCC + 4
Non-inverting Input 2 5
Inverting Input 2 6
Output 2 7
-
+
+
-
14 Output 4
- 13 Inverting Input 4
+ 12 Non-inverting Input 4
11 VCC -
+ 10 Non-inverting Input 3
- 9 Inverting Input 3
8 Output 3
April 2006
Rev. 2
1/15
www.st.com
15
1 page  
TS274
Figure 2. Schematic diagram (for 1/4 TS274)
Typical application information
5/15
5 Page 
TS274
6
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
6.1
DIP14 package
Plastic DIP-14 MECHANICAL DATA
DIM.
a1
B
b
b1
D
E
e
e3
F
I
L
Z
MIN.
0.51
1.39
1.27
mm.
TYP
0.5
0.25
8.5
2.54
15.24
3.3
MAX.
1.65
MIN.
0.020
0.055
20
7.1
5.1
2.54
0.050
inch
TYP.
0.020
0.010
0.335
0.100
0.600
0.130
MAX.
0.065
0.787
0.280
0.201
0.100
P001A
11/15
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet TS274.PDF ] | |
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