Datenblatt-pdf.com


V048G015T80 Schematic ( PDF Datasheet ) - Vicor Corporation

Teilenummer V048G015T80
Beschreibung Voltage Transformation Module
Hersteller Vicor Corporation
Logo Vicor Corporation Logo 




Gesamt 20 Seiten
V048G015T80 Datasheet, Funktion
www.DataSheet4U.com
V•I ChipTM – VTM
Voltage Transformation Module
• 48V to 1.5V V•I Chip Converter
• 80 A (120 A for 1 ms)
• High density – up to 320 A/in3
• Small footprint – 80 A/in2
• Low weight – 0.4 oz (12 g)
• Pick & Place / SMD
• >92% efficiency at 1.5V
• 125°C operation
• 1 µs transient response
• >3.5 million hours MTBF
• No output filtering required
• V•I Chip BGA package
V048K015T801
Vf = 32 - 57.6 V
VOUT = 1.0 - 1.8 V
IOUT = 80 A
K = 1/32
ROUT = 1.5 mmax
©
Actual size
Product Description
Absolute Maximum Ratings
The V048K015T80 VI Chip Voltage Transformation
Module (VTM) breaks records for speed, density and
Parameter
Values
Unit
Notes
efficiency to meet the demands of advanced DSP,
FPGA, ASIC, processor cores and microprocessor
applications at the point of load (POL) while providing
+In to -In
+In to -In
-1.0 to 60.0
Vdc
100 Vdc For 100 ms
isolation from input to output. It achieves a response
PC to -In
-0.3 to 7.0
Vdc
time of less than 1 µs and delivers up to 80A in a
TM to -In
-0.3 to 7.0
Vdc
volume of less than 0.25 in3 while converting 48 V to
1.5 V with unprecedented efficiency. It may be
paralleled to deliver hundreds of amps at an output
voltage settable from 1.0 to 1.8 Vdc.
P R E L I M I N A RYThe VTM V048K015T80’s nominal output voltage is
1.5 Vdc from a 48 Vdc input factorized bus, Vf, and is
controllable from 1.0 to 1.8 Vdc at no load, and from
0.9 V to 1.7 V at full load, over a Vf input range of 32 to
57.6 Vdc. It can be operated either open- or closed-loop
depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K=1/32, and an output resistance, ROUT =1.3 milliohm,
to enable applications requiring a programmable low
output voltage at high current and high efficiency.
SG to -In
+Out to -Out
Isolation voltage
Operating junction temperature
Output current
Peak output current
Case temperature during reflow
Storage temperature
Output power
Peak output power
Thermal Resistance
500
-0.5 to 5.0
1500
-40 to 125
80
120
208
-40 to 150
144
216
mA
Vdc
Vdc Input to Output
°C See note 2
A Continuous
A For 1 ms
°C
°C
W Continuous
W For 1 ms
Closing the loop back to an input Pre-Regulation
Module (PRM) or DC-DC converter may be used to
Symbol Parameter
Typ Max Units
compensate for ROUT.
RθJC
Junction-to-case
1.1 1.5 °C/W
The 1.5V VTM achieves break-through current density
of 320 A/in3 in a VI Chip package compatible with
standard pick-and-place and surface mount assembly
processes. The VI Chip BGA package supports in-board
mounting with a low profile of 0.16" (4mm) over the
board. A J-lead package option supports on-board
surface mounting with a profile of only 0.25" (6mm)
over the board. The VTM’s fast dynamic response and
low noise eliminate the need for bulk capacitance at the
load, substantially increasing the POL density while
improving reliability and decreasing cost.
RθJB
RθJA
RθJA
Junction-to-BGA
Junction-to-ambient 3
Junction-to-ambient 4
2.1 2.5 °C/W
6.5 7.2 °C/W
5.0 5.5 °C/W
Notes
1. For complete product matrix, see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature. This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
3. V048K015T80 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
4. V048L015T80 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.
45 Vicor Corporation Tel: 800-735-6200 vicorpower.com
V•I Chip Voltage Transformation Module Rev. 1.6
Page 1 of 20






V048G015T80 Datasheet, Funktion
Specifications, continued
THERMAL
PRELIMINARY
Symbol
RθJC
RθJB
RθJA
RθJA
Parameter
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance
Junction-to-BGA thermal impedance
Junction-to-ambient 1
Junction-to-ambient 2
Min
125
Typ Max
130 135
0.61
1.1
2.1
6.5
5.0
Unit
°C
Ws/°C
°C/W
°C/W
°C/W
°C/W
Notes
1. V048K015T80 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
2. V048L015T80 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.
Note
Junction temperature
V•I CHIP STRESS DRIVEN PRODUCT QUALIFICATION PROCESS
Test
High Temperature Operational Life (HTOL)
Temperature cycling
High temperature storage
Moisture resistance
Temperature Humidity Bias Testing (THB)
Pressure cooker testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent resistance/marking permanency
Mechanical vibration
Mechanical shock
Electro static discharge testing – human body model
Electro static discharge testing – machine model
Highly Accelerated Life Testing (HALT)
Dynamic cycling
Standard
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
EIA/JESD22-A115-A
Per Vicor Internal
Test Specification
Per Vicor internal
test specification
Environment
125°C, Vmax, 1,008 hrs
-55°C to 125°C, 1,000 cycles
150°C, 1,000 hrs
Moisture sensitivity Level 4
85°C, 85% RH, Vmax, 1,008 hrs
121°C, 100% RH, 15 PSIG, 96 hrs
130°C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Meets or exceeds 200 Volts
Operation limits verified, destruct margin determined
Constant line, 0-100% load, -20°C to 125°C
V•I CHIP BALL GRID ARRAY INTERCONNECT QUALIFICATION
Test
BGA Daisy-Chain thermal cycling
Ball shear
Bend test
Standard
IPC-SM-785
IPC-9701
IPC-9701
IPC J-STD-029
IPC J-STD-029
Environment
TC3, -40 to 125°C at <10 °C/min,
10 min dwell time
No failure through intermetallic
Deflection through 4 mm
45 Vicor Corporation Tel: 800-735-6200 vicorpower.com
V•I Chip Voltage Transformation Module Rev. 1.6
Page 6 of 20

6 Page









V048G015T80 pdf, datenblatt
Application Note (continued)
PRELIMINARY
Thermal Management
The high efficiency of the VTM results in low power
dissipation minimizing temperature rise, even at full output
current. The heat generated within the internal semiconductor
junctions is coupled through very low thermal resistances, RθJC
and RθJB (see Figure 25), to the PC board allowing flexible
thermal management.
CASE 1 Convection via optional Pin Fins to air (Pin Fins
available mounted to the V•I Chip or as a separate item.)
CASE 3 Combined direct convection to the air and conduction
to the PC board.
A combination of cooling techniques that utilize the power
planes and dissipation to the air will also reduce the total
thermal impedance. This is the most effective cooling
method.To estimate the total effect of the combination, treat
each cooling branch as one leg of a parallel resistor network.
In an environment with forced convection over the surface of a
PCB with 0.4" of headroom, a VTM with Pin Fins offers a
simple thermal management option. The total Junction to
Ambient thermal resistance of a surface mounted
V048L015T80 is 5 ºC/W in 300 LFM airflow, (see Figure 26).
At full rated current (80A) the VTM dissipates approximately
11 W. Power dissipation curves in Figure 6 show typical
dissipation at different output currents.
CASE 2 Conduction to the PC board
Figure 25—Thermal resistance
The low thermal resistance, Junction to BGA, allows the use of
the PC board as a means of removing heat from the VTM.
Convection from the PC board to ambient, or conduction to a
cold plate, enable flexible thermal management options. In this
case, the VTM can be used without the Pin Fin option, allowing
a system designer to take full advantage of the VTM’s low profile.
With a VTM mounted on a 2.0 in2 area of a multi-layer PC
board with appropriate power planes resulting in 8 oz of
effective copper weight, the Junction-to-ambient thermal
resistance, RθJA, is 6.5 ºC/W in 300 LFM of air. With a
maximum junction temperature of 125ºC and 11 W of
dissipation at full current of 80 A, the resulting temperature rise
of 72ºC allows the VTM to operate at full rated current up to a
53ºC ambient temperature. See thermal resistance table on page
1 for additional details on this thermal management option.
Adding low-profile heat sinks to the PC board can lower the
thermal resistance of the PC board surrounding the VTM. This
option is useful in environments that cannot accommodate the
height of the Pin Fin option.
Additional cooling may be added by coupling a cold plate to
the PC board with low thermal resistance stand offs.
10
9
8
7
6
5
4
3
0
VTM with optional 0.25'' Pin Fins
100 200 300 400 500 600
Airflow (LFM)
Figure 26—Junction-to-ambient thermal resistance of VTM
with 0.25" Pin Fins. (Pin Fins are available as an option for
the V•I Chip package.)
45 Vicor Corporation Tel: 800-735-6200 vicorpower.com
V•I Chip Voltage Transformation Module Rev. 1.6
Page 12 of 20

12 Page





SeitenGesamt 20 Seiten
PDF Download[ V048G015T80 Schematic.PDF ]

Link teilen




Besondere Datenblatt

TeilenummerBeschreibungHersteller
V048G015T80Voltage Transformation ModuleVicor Corporation
Vicor Corporation

TeilenummerBeschreibungHersteller
CD40175BC

Hex D-Type Flip-Flop / Quad D-Type Flip-Flop.

Fairchild Semiconductor
Fairchild Semiconductor
KTD1146

EPITAXIAL PLANAR NPN TRANSISTOR.

KEC
KEC


www.Datenblatt-PDF.com       |      2020       |      Kontakt     |      Suche