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PDF XM1003-BD Data sheet ( Hoja de datos )

Número de pieza XM1003-BD
Descripción GaAs MMIC Image Reject Mixer
Fabricantes Mimix Broadband 
Logotipo Mimix Broadband Logotipo



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No Preview Available ! XM1003-BD Hoja de datos, Descripción, Manual

32.0-42.0 GHz GaAs MMIC
Image Reject Mixer
February 2007 - Rev 16-Feb-07
Features
Sub-harmonic Image Reject Mixer
GaAs HBT Technology
9.0 dB Conversion Loss
18.0 dB Image Rejection
100% On-Wafer RF Testing
100% Visual Inspection to MIL-STD-883
Method 2010
M1003-BD
Chip Device Layout
XM1003-BD
General Description
Mimix Broadband’s 32.0-42.0 GHz GaAs MMIC
sub-harmonic image reject mixer can be used as an up-
or down-converter.The device has a conversion loss of
9.0 dB with 18.0 dB image rejection across the band. I and
Q mixer outputs are provided and an external 90 degree
hybrid is required to select the desired sideband.This
MMIC uses Mimix Broadband’s 2 µm GaAs HBT device
model technology, and is based upon electron beam
lithography to ensure high repeatability and uniformity.
The chip has surface passivation to protect and provide a
www.DataSheet4U.com rugged part with backside via holes and gold
metallization to allow either a conductive epoxy or
eutectic solder die attach process.This device is well
suited for Millimeter-wave Point-to-Point Radio, LMDS,
SATCOM and VSAT applications.
Absolute Maximum Ratings
Input Power (RF Pin)
Input Power (IF Pin)
Storage Temperature (Tstg)
Operating Temperature (Ta)
+20 dBm
+20 dBm
-65 to +165 OC
-55 to +125 OC
Electrical Characteristics (Ambient Temperature T = 25o C)
Parameter
Units Min. Typ. Max.
Frequency Range (RF) Upper Side Band
GHz 34.0 - 42.0
Frequency Range (RF) Lower Side Band
GHz 32.0 - 42.0
Frequency Range (LO)
GHz 15.0 - 23.0
Frequency Range (IF)
GHz DC - 4.0
RF Return Loss (S11)
dB - 10.0 -
IF1/IF2 Return Loss (S22)
dB - TBD -
LO Return Loss (S33)
dB - TBD -
Conversion Loss (S21)
dB - 9.0 -
LO Input Drive (PLO)
dBm - +12.0 -
Image Rejection
dBc - 18.0 -
Isolation LO/RF
dBc - -40.0 -
Isolation LO/IF
dB - TBD -
Isolation RF/IF
dB - TBD -
Input Third Order Intercept (IIP3)
dBm - +14.0 -
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 1 of 7
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.

1 page




XM1003-BD pdf
32.0-42.0 GHz GaAs MMIC
Image Reject Mixer
February 2007 - Rev 16-Feb-07
Mechanical Drawing
1.800
(0.071)
1.080
(0.043)
2
M1003-BD
0.564
(0.022)
1
XM1003-BD
3
0.900
(0.035)
0.0 4
0.0 1.080 1.500
(0.043) (0.059)
(Note: Engineering designator is 38IRM0363)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.674 mg.
Bond Pad #1 (RF)
Bond Pad #2 (IF1)
Bond Pad #3 (LO)
Bond Pad #4 (IF2)
RF Arrangement
IF1
2
RF 1
XM1003-BD
3 LO
4
IF2
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 5 of 7
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.

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