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PDF XE1000-BD Data sheet ( Hoja de datos )
| Número de pieza | XE1000-BD | |
| Descripción | GaAs MMIC Frequency Divider | |
| Fabricantes | Mimix Broadband | |
| Logotipo |  |
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2.0-16.0 GHz GaAs MMIC
Frequency Divider
April 2007 - Rev 17-Apr-07
Features
Divide-by-Four
+5.0 dBm Output Power
-30 dBc Fundamental Leakage
Single-ended or Differential Input & Output
100% On-Wafer, DC and Output Power Testing
100% Visual Inspection to MIL-STD-883
Method 2010
E1000-BD
Chip Device Layout
XE1000-BD
General Description
Mimix Broadband's 2.0-16.0 GHz GaAs MMIC freqency
divider is an ECL (Emitter Coupled Logic) static frequency
divider (divide-by-four) consisting of two cascaded
divide-by-two circuits. Even-order harmonic levels are
minimized by driving the inputs with a balanced input
signal, and by taking the output differentially, but the circuit
can be operated in a single-ended fashion with unused
inputs & outputs open circuit.This MMIC uses Mimix
Broadband's 2 um GaAs HBT device model technology to
ensure high reliability and uniformity.The chip has surface
www.DataSheet4U.compassivation to protect and provide a rugged part with
backside via holes and gold metallization to allow either a
conductive epoxy or eutectic solder die attach process.This
device is well suited for Millimeter-wave Point-to-Point
Radio, LMDS, SATCOM and VSAT applications.
Absolute Maximum Ratings
Supply Voltage (Vcc)
+7.0 VDC
Supply Current (Icc)
150 mA
Input Power (Pin)
+15 dBm
Storage Temperature (Tstg)
Operating Temperature (Ta)
Junction Temperature (Tch)
-65 to +165 OC
-55 to MTTF Table1
MTTF Table1
(1) Junction temperature affects a device's MTTF. It is
recommended to keep channel temperature as low as
possible for maximum life.
o
Electrical Characteristics (Ambient Temperature T = 25 C)
Parameter
Units Min. Typ. Max.
Input Frequency Range (f )
GHz 2.0
- 16.0
Output Frequency Range (f )
GHz 0.5 - 4.0
Input Power (Pin)
dBm -20.0 - +5.0
Output Power (Pout)
dBm - +5.0 -
Fin Suppression
dBc - -30.0 -
Fin/2 Suppression
dBc - -25.0 -
3*Fin/4 Suppression
dBc - -15.0 -
2*Fin Suppression
dBc - -35.0 -
Supply Voltage (Vcc)
VDC +4.0 +5.0 +6.0
Supply Current (Icc) (Vcc=5.0V Typical)
mA - 110 130
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 1 of 5
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
1 page  
2.0-16.0 GHz GaAs MMIC
Frequency Divider
April 2007 - Rev 17-Apr-07
E1000-BD
Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the
human body and the environment. For safety, observe the following procedures:
Do not ingest.
Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this product.This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support
devices or systems without the express written approval of the President and General Counsel of Mimix
Broadband. As used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for
surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be reasonably expected to result in a
significant injury to the user. (2) A critical component is any component of a life support device or system whose
failure to perform can be reasonably expected to cause the failure of the life support device or system, or to
affect its safety or effectiveness.
ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied
in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded anti-
static workstation. Devices need careful handling using correctly designed collets, vacuum pickups or, with care,
sharp tweezers.
Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the
backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as
possible.The mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka
TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure schedule.
Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the
total die periphery. For additional information please see the Mimix "Epoxy Specifications for Bare Die" application note.
If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.0012 thick, placed between
the die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing
action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended.The gold-tin
eutectic (80% Au 20% Sn) has a melting point of approximately 280 ºC (Note: Gold Germanium should be avoided).The
work station temperature should be 310 ºC +/- 10 ºC. Exposure to these extreme temperatures should be kept to
minimum.The collet should be heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air
bridges and force impact are critical during placement.
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to
the die's gold bond pads.The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x
0.0005") 99.99% pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm
(0.001") diameter wedge or ball bonds are acceptable for DC Bias connections. Aluminum wire should be
avoided.Thermo-compression bonding is recommended though thermosonic bonding may be used providing
the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters.
Bonds should be made from the bond pads on the die to the package or substrate. All bonds should be as short
as possible.
Part Number for Ordering
XE1000-BD-000V
XE1000-BD-EV1
Description
Where “V” is RoHS compliant die packed in vacuum release gel paks
XE1000 die evaluation module
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 5 of 5
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet XE1000-BD.PDF ] | |
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