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PDF MN101CP66G Data sheet ( Hoja de datos )
| Número de pieza | MN101CP66G | |
| Descripción | MN101CP66x | |
| Fabricantes | Panasonic Semiconductor | |
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MN101C66D, MN101C66G
Type
Internal ROM type
ROM (byte)
RAM (byte)
Package (Lead-free)
Minimum Instruction
Execution Time
MN101C66D
MN101C66G
MN101CF66G
MN101CP66D
Mask ROM
FLASH
EPROM
64K 128K 64K
2K 4K 2K
LQFP080-P-1414A,
QFP084-P-1818E
LQFP080-P-1414A
(ES (Engineering Sample) available),
QFP084-P-1818E
LQFP080-P-1414A, QFP084-P-1818E
0.1 µs (at 4.5 V to 5.5 V, 20 MHz)
0.25 µs (at 2.7 V to 5.5 V, 8 MHz)
62.5 µs (at 2.0 V to 5.5 V, 32 kHz)*
* The lower limit for operation guarantee for flash memory built-in type is 2.5 V.
* The lower limit for operation guarantee for EPROM built-in type is 2.3 V.
Interrupts
RESET, Watchdog, External 0 to 2, External 3 (LQFP080-P-1414A : Not mounted), External 4 (key interrupt dedicated), Timer 0 to 3,
Timer 6, Timer 7 (2 systems), Timer 8 (2 systems), Time base, Serial 0 (2 systems), Serial 2, A/D conversion finish
Timer Counter
Timer counter 0 : 8-bit × 1
(square-wave/8-bit PWM output, event count, generation of remote control carrier, simple pulse width measurement)
(square-wave/PWM output to large current terminal P50 possible)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 0
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Timer counter 1 : 8-bit × 1
(square-wave output, event count, synchronous output event)
Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/8192, 1/32768 of OSC oscillation clock frequency;
1/1 of XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 1
Timer counter 0, 1 can be cascade-connected.
Timer counter 2 : 8-bit × 1
(square-wave output, additional pulse type 10-bit PWM output, event count, synchronous output event, simple pulse
width measurement)
(square-wave/PWM output to large current terminal P52 possible)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 2
Timer counter 3 : 8-bit × 1
(square-wave output, event count, generation of remote control carrier, serial 0 baud rate timer)
Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 3
Timer counter 2, 3 can be cascade-connected.
Timer counter 6 : 8-bit freerun timer
Clock source................ 1/1 of system clock frequency; 1/1, 1/4096, 1/8192 of OSC oscillation clock frequency; 1/1, 1/4096,
1/8192 of XI oscillation clock frequency
Interrupt source ........... coincidence with compare register 6
Timer counter 7 : 16-bit × 1
(square-wave output, IGBT/16-bit PWM output (cycle / duty continuous variable), event count, synchronous output
evevt, pulse width measurement, input capture)
(square-wave/PWM output to large current terminal P51 possible)
Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1,
1/2, 1/4, 1/16 of external clock input frequency
Interrupt source ........... coincidence with compare register 7 (2 lines)
MAD00017HEM
1 page  
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd. Industrial Co., Ltd.
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| PDF Descargar | [ Datasheet MN101CP66G.PDF ] | |
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