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PDF LT1207CS Data sheet ( Hoja de datos )
| Número de pieza | LT1207CS | |
| Descripción | Dual 250mA/60MHz Current Feedback Amplifier | |
| Fabricantes | Linear Technology | |
| Logotipo |  |
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FEATURES
s 250mA Minimum Output Drive Current
s 60MHz Bandwidth, AV = 2, RL = 100Ω
s 900V/µs Slew Rate, AV = 2, RL = 50Ω
s 0.02% Differential Gain, AV = 2, RL = 30Ω
s 0.17° Differential Phase, AV = 2, RL = 30Ω
s High Input Impedance: 10MΩ
s Shutdown Mode: IS < 200µA per Amplifier
s
Stable
with
CL
=
10,000pF
U
APPLICATIO S
s ADSL/HDSL Drivers
s Video Amplifiers
s Cable Drivers
s RGB Amplifiers
s Test Equipment Amplifiers
s Buffers
LT1207
Dual 250mA/60MHz
Current Feedback Amplifier
DESCRIPTIO
The LT ®1207 is a dual version of the LT1206 high speed
current feedback amplifier. Like the LT1206, each CFA in
the dual has excellent video characteristics: 60MHz band-
width, 250mA minimum output drive current, 400V/µs
minimum slew rate, low differential gain (0.02% typ) and
low differential phase (0.17° typ). The LT1207 includes a
pin for an optional compensation network which stabi-
lizes the amplifier for heavy capacitive loads. Both ampli-
fiers have thermal and current limit circuits which protect
against fault conditions. ThesecapabilitiesmaketheLT1207
well suited for driving difficult loads such as cables in video
or digital communication systems.
Operation is fully specified from ±5V to ±15V supplies.
Supply current is typically 20mA per amplifier. Two
micropower shutdown controls place each amplifier in a
high impedance low current mode, dropping supply
current to 200µA per amplifier. For reduced bandwidth
applications, supply current can be lowered by adding a
resistor in series with the Shutdown pin.
The LT1207 is manufactured on Linear Technology's
complementary bipolar process and is available in a low
thermal resistance 16-lead SO package.
, LTC and LT are registered trademarks of Linear Technology Corporation.
TYPICAL APPLICATION
VIN
SHDN A
15k 240Ω
HDSL Driver
5V
0.1µF*
+
+
2.2µF**
1/2 LT1207
–
720Ω
62Ω
L1
720Ω
720Ω
SHDN B
15k
–
1/2 LT1207
+
–5V
62Ω
0.1µF*
2.2µF**
* CERAMIC
** TANTALUM
L1 = TRANSPOWER SMPT–308
OR SIMILAR DEVICE
1207 • TA01
1
1 page  
WU
TYPICAL PERFOR A CE CHARACTERISTICS
LT1207
Bandwidth vs Supply Voltage
100
90
PEAKING ≤ 0.5dB
PEAKING ≤ 5dB
AV = 2
RL = 100Ω
80
70 RF = 470Ω
60
RF = 560Ω
RF = 680Ω
50
40 RF = 750Ω
30
20 RF = 1k
10 RF = 1.5k
0
4 6 8 10 12 14 16 18
SUPPLY VOLTAGE (±V)
LT1207 • TPC01
Bandwidth vs Supply Voltage
100
90
PEAKING ≤ 0.5dB
PEAKING ≤ 5dB
AV = 10
RL = 100Ω
80
70
60 RF =390Ω
RF = 330Ω
50
40 RF = 470Ω
30
RF = 680Ω
20
10 RF = 1.5k
0
4 6 8 10 12 14 16 18
SUPPLY VOLTAGE (±V)
LT1207 • TPC04
Differential Phase
vs Supply Voltage
0.50
0.40
RL = 15Ω
0.30
RF = RG = 560Ω
AV = 2
N PACKAGE
0.20
RL = 30Ω
0.10
0
5
RL = 50Ω
RL = 150Ω
7 9 11 13
SUPPLY VOLTAGE (±V)
15
LT1207 • TPC07
Bandwidth vs Supply Voltage
50
PEAKING ≤ 0.5dB
PEAKING ≤ 5dB
AV = 2
RL = 10Ω
40
RF = 560Ω
30 RF = 750Ω
20 RF = 1k
RF = 2k
10
0
4 6 8 10 12 14 16 18
SUPPLY VOLTAGE (±V)
LT1207 • TPC02
Bandwidth vs Supply Voltage
50
PEAKING ≤ 0.5dB
PEAKING ≤ 5dB
AV = 10
RL = 10Ω
40
30 RF = 560Ω
20 RF = 680Ω
RF = 1k
10 RF = 1.5k
0
4 6 8 10 12 14 16 18
SUPPLY VOLTAGE (±V)
LT1207 • TPC05
Differential Gain
vs Supply Voltage
0.10
0.08 RL = 15Ω
RF = RG = 560Ω
AV = 2
N PACKAGE
0.06
0.04
0.02
0
5
RL = 30Ω
RL = 50Ω
RL = 150Ω
7 9 11 13
SUPPLY VOLTAGE (±V)
15
LT1207 • TPC08
Bandwidth and Feedback Resistance
vs Capacitive Load for 0.5dB Peak
10k
BANDWIDTH
100
1k 10
FEEDBACK RESISTOR
AV = 2
RL = ∞
VS = ±15V
CCOMP = 0.01µF
100
1 10
100
1000
CAPACITIVE LOAD (pF)
1
10000
LT1207 • TPC03
Bandwidth and Feedback Resistance
vs Capacitive Load for 5dB Peak
10k 100
BANDWIDTH
1k 10
FEEDBACK RESISTOR
AV = +2
RL = ∞
VS = ±15V
CCOMP = 0.01µF
100 1
1 10 100 1k 10k
CAPACITIVE LOAD (pF)
LT1207 • TPC06
Spot Noise Voltage and Current
vs Frequency
100
– in
10
1
10
en
in
100 1k 10k
FREQUENCY (Hz)
100k
LT1207 • TPC09
5
5 Page 
LT1207
APPLICATI S I FOR ATIO
Capacitance on the Inverting Input
Current feedback amplifiers require resistive feedback
from the output to the inverting input for stable operation.
Take care to minimize the stray capacitance between the
output and the inverting input. Capacitance on the invert-
ing input to ground will cause peaking in the frequency
response (and overshoot in the transient response), but it
does not degrade the stability of the amplifier.
RF = 750Ω
RL = 50Ω
LT1207 • F05c
Figure 5c. Large-Signal Response, AV = 2
at this rate is 1mA per picofarad of capacitance, so
10,000pF would require 10A! The photo (Figure 6) shows
the large-signal behavior with CL = 10,000pF. The slew
rate is about 60V/µs, determined by the current limit of
600mA.
VS = ±15V
RF = RG = 3k
RL = ∞
LT1207 • F06
Figure 6. Large-Signal Response, CL = 10,000pF
Differential Input Signal Swing
The differential input swing is limited to about ±6V by an
ESD protection device connected between the inputs. In
normal operation, the differential voltage between the
input pins is small, so this clamp has no effect; however,
in the shutdown mode the differential swing can be the
same as the input swing. The clamp voltage will then set
the maximum allowable input voltage. To allow for some
margin, it is recommended that the input signal be less
than ±5V when the device is shut down.
Power Supplies
The LT1207 will operate from single or split supplies from
±5V (10V total) to ±15V (30V total). It is not necessary to
use equal value split supplies, however the offset voltage
and inverting input bias current will change. The offset
voltage changes about 500µV per volt of supply mis-
match. The inverting bias current can change as much as
5µA per volt of supply mismatch, though typically the
change is less than 0.5µA per volt.
Thermal Considerations
Each amplifier in the LT1207 includes a separate thermal
shutdown circuit which protects against excessive inter-
nal (junction) temperature. If the junction temperature
exceeds the protection threshold, the amplifier will begin
cycling between normal operation and an off state. The
cycling is not harmful to the part. The thermal cycling
occurs at a slow rate, typically 10ms to several seconds,
which depends on the power dissipation and the thermal
time constants of the package and heat sinking. Raising
the ambient temperature until the device begins thermal
shutdown gives a good indication of how much margin
there is in the thermal design.
Heat flows away from the amplifier through the package’s
copper lead frame. Heat sinking is accomplished by using
the heat spreading capabilities of the PC board and its
copper traces. Experiments have shown that the heat
spreading copper layer does not need to be electrically
connected to the tab of the device. The PCB material can
be very effective at transmitting heat between the pad area
attached to the tab of the device and a ground or power
plane layer either inside or on the opposite side of the
board. Although the actual thermal resistance of the PCB
material is high, the length/area ratio of the thermal
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet LT1207CS.PDF ] | |
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