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PDF MW5IC2030GMBR1 Data sheet ( Hoja de datos )

Número de pieza MW5IC2030GMBR1
Descripción RF LDMOS Wideband Integrated Power Amplifiers
Fabricantes Motorola Semiconductors 
Logotipo Motorola Semiconductors Logotipo



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MOTOROLA
Freescale Semiconductor, Inc.
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MW5IC2030M/D
The Wideband IC Line
RF LDMOS Wideband Integrated
Power Amplifiers
The MW5IC2030 wideband integrated circuit is designed for base station
applications. It uses Motorola’s newest High Voltage (26 to 28 Volts) LDMOS IC
technology and integrates a multi - stage structure. Its wideband On - Chip
design makes it usable from 1930 to 1990 MHz. The linearity performances
cover all modulations for cellular applications: GSM, GSM EDGE, TDMA, PHS,
CDMA and W - CDMA.
Final Application
Typical CDMA Performance: VDD = 27 Volts, IDQ1 = 160 mA,
IDQ2 = 230 mA, Pout = 5 Watts Avg., Full Frequency Band, IS - 95 CDMA
(Pilot, Sync, Paging, Traffic Codes 8 Through 13)
Power Gain — 23 dB
Drain Efficiency — 20%
ACPR @ 885 kHz Offset — - 49 dBc @ 30 kHz Channel Bandwidth
Driver Application
Typical CDMA Performance: VDD = 27 Volts, IDQ1 = 200 mA, IDQ2 =
550 mA, Pout = 1 Watt Avg., Full Frequency Band, IS - 95 CDMA (Pilot,
Sync, Paging, Traffic Codes 8 Through 13)
Power Gain — 24 dB
ACPR @ 885 kHz Offset — - 64 dBc @ 30 kHz Channel Bandwidth
On - Chip Matching (50 Ohm Input, >4 Ohm Output)
Integrated Temperature Compensation Capability with Enable/Disable
Function
On - Chip Current Mirror gm Reference FET for Self Biasing Application (1)
Integrated ESD Protection
Designed for Lower Memory Effects and Wide Instantaneous Bandwidth
Applications
Also Available in Gull Wing for Surface Mount
In Tape and Reel. R1 Suffix = 500 Units per 44 mm, 13 inch Reel
VDS1
VRD2
VRG2
RFin
VRD1
VDS2/RFout
VRG1/VGS1
VGS2
Quiescent Current
Temperature Compensation
Functional Block Diagram
MW5IC2030MBR1
MW5IC2030GMBR1
1930 - 1990 MHz, 30 W, 26 V
GSM/GSM EDGE, W - CDMA, PHS
RF LDMOS WIDEBAND
INTEGRATED POWER AMPLIFIERS
CASE 1329 - 09
TO - 272 WB - 16
PLASTIC
MW5IC2030MBR1
CASE 1329A - 03
TO - 272 WB - 16 GULL
PLASTIC
MW5IC2030GMBR1
PIN CONNECTIONS
GND
VDS1
VRD2
VRG2
GND
RFin
VRD1
VRG1/VGS1
VGS2
NC
GND
1
2
3
4
5
6
7
8
9
10
11
16 GND
15 NC
14
VDS2/
RFout
13 NC
12 GND
(Top View)
NOTE: Exposed backside flag is source
terminal for transistors.
(1) Refer to AN1987/D, Quiescent Current Control for the RF Integrated Circuit Device Family. Go to http://www.motorola.com/semiconductors/rf .
Select Documentation/Application Notes - AN1987.
REV 2
MMoOtorToOla,RInOc.L2A00R4 F DEVICE DATA
MW5IC2030MBR1 MW5IC2030GMBR1
For More Information On This Product,
Go to: www.freescale.com
1

1 page




MW5IC2030GMBR1 pdf
Freescale Semiconductor, Inc.
RD2
VD1
RG2
C19
MW5IC2030M
Rev 3
VD2 C20
C9
R3
C6
C12
R6
C13
C7
C17
C18
C15
C16
C14
R4
R5
C10
C8
C5
C3
C2
C1
C4
RD1
C11
R1
R2
VG2
VG1RG1
VD1
Figure 2. MW5IC2030MBR1(GMBR1) Test Circuit Component Layout
MOTOROLA RF DEVICE DATA
MW5IC2030MBR1 MW5IC2030GMBR1
For More Information On This Product,
Go to: www.freescale.com
5

5 Page





MW5IC2030GMBR1 arduino
2X r1
aaa M C A B
PIN ONE
INDEX
6X
e1
4X
e2
e
D1
b2
aaa M C A
Freescale Semiconductor, Inc.
E1 B
A
4X b1
aaa M C A
2X
e3
b3
aaa M C A D M
10X b
aaa M C A
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ NOTE6
DATUM
PLANE
H
c1
E
DETAIL Y
A A2
E2
YY
C
SEATING
PLANE
tL
L1
GAGE
PLANE
DETAIL Y
A1
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M−1994.
3. DATUM PLANE −H− IS LOCATED AT TOP OF LEAD
AND IS COINCIDENT WITH THE LEAD WHERE THE
LEAD EXITS THE PLASTIC BODY AT THE TOP OF
THE PARTING LINE.
4. DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE PROTRUSION
IS .006 (0.15) PER SIDE. DIMENSIONS "D" AND "E1"
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE −H−.
5. DIMENSIONS "b", "b1", "b2" AND "b3" DO NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE .005 (0.13)
TOTAL IN EXCESS OF THE "b", "b1", "b2" AND "b3"
DIMENSIONS AT MAXIMUM MATERIAL CONDITION.
6. HATCHING REPRESENTS THE EXPOSED AREA OF
THE HEAT SINK.
CASE 1329A - 03
ISSUE B
TO - 272 WB - 16 GULL
PLASTIC
MW5IC2030GMBR1
N
E2
VIEW Y - Y
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A .100 .104 2.54 2.64
A1 .001 .004 0.02 0.10
A2 .099 .110 2.51 2.79
D .928 .932 23.57 23.67
D1 .810 BSC
20.57 BSC
E .429 .437 10.90 11.10
E1 .353 .357 8.97 9.07
E2 .346 .350 8.79 8.89
L .018 .024 4.90 5.06
L1 .01 BSC
0.25 BSC
M .600 −−− 15.24 −−−
N .270 −−− 6.86 −−−
b .011 .017 0.28 0.43
b1 .037 .043 0.94 1.09
b2 .037 .043 0.94 1.09
b3 .225 .231 5.72 5.87
c1 .007 .011 .18 .28
e .054 BSC
1.37 BSC
e1 .040 BSC
1.02 BSC
e2 .224 BSC
5.69 BSC
e3 .150 BSC
3.81 BSC
r1 .063 .068
t 2° 8 °
1.6 1.73
2° 8°
aaa .004
.10
MOTOROLA RF DEVICE DATA
MW5IC2030MBR1 MW5IC2030GMBR1
For More Information On This Product,
Go to: www.freescale.com
11

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