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UDA1431T Schematic ( PDF Datasheet ) - NXP Semiconductors

Teilenummer UDA1431T
Beschreibung low-cost stereo current DAC
Hersteller NXP Semiconductors
Logo NXP Semiconductors Logo 




Gesamt 17 Seiten
UDA1431T Datasheet, Funktion
www.DataSheet4U.com
UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
Rev. 02 — 20 February 2006
Product data sheet
1. General description
The UDA1431T is a 16-bit, 48 kHz, single-chip stereo DAC employing bitstream
conversion techniques.
The UDA1431T supports the I2S-bus data format with word lengths of up to 24 bits,
MSB justified and can be operated with a 256fs master clock mode.
The audio outputs meet the IEC 61938 specification.
2. Features
s Low power consumption
s Analog power supply voltage from 10.8 V to 13.2 V
s Digital power supply voltage from 3.1 V to 3.5 V
s Master clock frequencies of 256fs
s Supports sampling frequencies up to 48 kHz
s Integrated digital filter
s No analog post filtering required for DAC
s Slave mode only applications
s I2S-bus input interface: 16-bit, 18-bit, 20-bit and 24-bit format compatible
s CMOS levels compatible digital inputs and outputs
s Very easy application
s Advanced audio configuration:
x Stereo line output
x High linearity, wide dynamic range and low distortion
s Small package size (SO14)
3. Applications
s PC audio applications
s Car radio applications
s DVD players
s Digital set-top boxes






UDA1431T Datasheet, Funktion
www.DataSheet4U.com
Philips Semiconductors
UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
9. Limiting values
Table 4: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
VDDA
analog supply voltage (for
DAC)
[1] -
VDDD
digital supply voltage
[1] -
Txtal crystal temperature
Tstg storage temperature
-
65
[1] All supply connections must be made to the same power supply.
10. Thermal characteristics
Max Unit
15.2 V
5.5
125
+125
V
°C
°C
Table 5:
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from junction
to ambient
Conditions
in free air
Typ Unit
115 K/W
UDA1431T_2
Product data sheet
Rev. 02 — 20 February 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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UDA1431T pdf, datenblatt
www.DataSheet4U.com
Philips Semiconductors
UDA1431T
16-bit, 48 kHz, low-cost stereo current DAC
16. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
17. Soldering
17.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
17.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225 °C (SnPb process) or below 245 °C (Pb-free process)
for all BGA, HTSSON..T and SSOP..T packages
for packages with a thickness 2.5 mm
for packages with a thickness < 2.5 mm and a volume 350 mm3 so called
thick/large packages.
below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
17.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
UDA1431T_2
Product data sheet
Rev. 02 — 20 February 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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