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NX26F011A Schematic ( PDF Datasheet ) - NexFlash

Teilenummer NX26F011A
Beschreibung (NX26F011A / NX26F041A) 1M-BIT AND 4M-BIT SERIAL FLASH MEMORY
Hersteller NexFlash
Logo NexFlash Logo 




Gesamt 14 Seiten
NX26F011A Datasheet, Funktion
www.DataSheet4U.com
NX26F011A
NNXX262F064F1A011A
NX26F041A
1M-BIT AND 4M-BIT SERIAL FLASH MEMORY
WITH 2-PIN NXS INTERFACE
1PRE-RELEASE
MAY 1999
FEATURES
• Tailored for Portable and Mobile Media-Storage
– Ideal for portable/mobile applications that transfer
and store data, audio, or images
– Removable Serial Flash Module package option
NexFlash ™ Non-volatile Memory Technology
– Patented Single-Transistor EEPROM Cell
– High-density, cost-effective, low-voltage/power
– 10K/100K endurance, ten years data retention
• Flash Memory for Battery-Operation
– Single 5V or 3V supply for Read, Erase/Write
– Icc 5 mA active with 1 µA standby power
– 5 ms Erase/Write times for efficient battery use
2
• 1M-bits or 4M-bits of NexFlash Serial Memory
– 512 or 2,048 sectors of 264 bytes each
– Simple commands: Reset, Read, Write,
Ready/Busy
– No pre-erase required, auto-erases before write
• Two-pin NXS Serial Interface
– Saves Microcontroller-pins, simplifies PCB layout,
low switching noise compared to parallel Flash
– Supports clock operation as fast as 16 MHz
– Multi-device cascading, up to 16 devices
3
4
5
• Development Tools and Accessories
– SFK-NXS Serial Flash Development Kit
6
7
Description
The NexFlashNX26F011A and NX26F041A Serial Flash
Memories are tailored for portable/mobile media-storage
applications that transfer and store data, audio and images.
Manufactured using NexFlashs patented single transistor
EEPROM memory cell, the NX26F011A and NX26F041A
provide a high-density, low-voltage, low-power, and cost
effective solution for battery-operated nonvolatile data
storage requirements. The NX26F011A and NX26F041A
can operate with a single 5V or 3V supply for Read, Write,
and Erase. Power consumption is very low due to µA
standby current and fast Erase/Write performance (as fast
as 5 ms per sector) that minimizes power-on time, resulting
in a highly efficient energy-per-transfer ratio. The NX26F011A
8
9and NX26F041A offer 1M-bits and 4M-bits of Flash memory
organized in sectors of 264 bytes each. Each sector is
individually addressable through basic commands or
control functions such as Reset, Read, Erase/Write, and
10Ready/Busy. The NXS (NexFlash Serial) 2-wire serial
interface is ideal for use with microcontrollers since it only
requires two pins. This leaves pins normally used for parallel
Flash free for other uses. The NXS interface supports clock
11ratesasfastas16MHzandallowsformulti-device cascading
of up to 16 devices. It also simplifies PC-board layout and
generates less transient noise than parallel devices. Devel-
opment is supported with the NexFlash Serial Flash
Development Kit.
12
This document contains PRELIMINARY INFORMATION. NexFlash reserves the right to make changes to its product at any time without notice in order to improve design and supply the
best possible product. We assume no responsibility for any errors which may appear in this publication. Copyright 1998, NexFlash Technologies, Inc.
NexFlash Technologies, Inc.
PRELIMINARY NXSF009A-0599
05/05/99 ©
1






NX26F011A Datasheet, Funktion
NX26F011A
NX26F041A
Command
Address
Reserved
Data
Control
INITIAL CLOCK
To wake device from standby
(Data is "Don't Care")
C3-C0 A11-SA0 DA3-0 A15-12 R31-R0 D0 - - - D2112 X15-X0
COMMAND TYPE
2H = Write
MAIN SECTOR ADDRESS
000H-1FF for NX26F011A
000H-7FF for NX26F041A
DEVICE ADDRESS
A0-A3 pins = 0H-FH
AUXILARY SECTOR ADDRESS
0H = main sector address 0-FFF
RESERVED
Use 00 00 00 00H
SECTOR DATA BITS
0-2112 (264 Bytes)
16 EXTRA CLOCKS
(Data is "Don't Care")
Figure 6. Sector Erase/Write Instruction - Sequence and Bit Format
6 NexFlash Technologies, Inc.
PRELIMINARY NXSF009A-0599
05/05/99 ©

6 Page









NX26F011A pdf, datenblatt
NX26F011A
NX26F041A
PACKAGE INFORMATION
Plastic TSOP - 28-pin
Package Code: V (Type I)
1
EH
N
D
SEATING PLANE
A
e
B A1
L
αC
Plastic TSOP (TType I)
Millimeters
Inches
Symbol Min Max
Min Max
Ref. Std.
No. Leads
28
A 1.00 1.20
0.039 0.047
A1 0.05 0.20
0.002 0.008
B 0.15 0.25
0.006 0.010
C 0.10 0.20
0.004 0.008
D 7.90 8.10
0.311 0.319
E 11.60 11.80 0.457 0.465
H 13.30 13.50 0.524 0.531
e 0.55 BSC
0.022 BSC
L 0.50 0.70
α 0° 5°
0.020 0.028
0° 5°
12
Notes:
1. Controlling dimension: millimeters, unless
otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold
flash protrusions and should be measured
from the bottom of the package.
4. Formed leads shall be planar with respect
to one another within 0.004 inches at the
seating plane.
NexFlash Technologies, Inc.
PRELIMINARY NXSF009A-0599
05/05/99 ©

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