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AD8003 Schematic ( PDF Datasheet ) - Analog Devices

Teilenummer AD8003
Beschreibung 1.5 GHz Op Amp
Hersteller Analog Devices
Logo Analog Devices Logo 




Gesamt 17 Seiten
AD8003 Datasheet, Funktion
Data Sheet
FEATURES
High speed
1650 MHz (G = +1)
730 MHz (G = +2, VO = 2 V p-p)
4300 V/µs (G = +2, 4 V step)
Settling time 12 ns to 0.1%, 2 V step
Excellent for QXGA resolution video
Gain flatness 0.1 dB to 190 MHz
0.05% differential gain error, RL = 150 Ω
0.01° differential phase error, RL = 150 Ω
Low voltage offset: 0.7 mV (typical)
Low input bias current: 7 µA (typical)
Low noise: 1.8 nV/√Hz
Low distortion over wide bandwidth: SFDR −73 dBc @ 20 MHz
High output drive: 100 mA output load drive
Supply operation: +5 V to ±5 V voltage supply
Supply current: 9.5 mA/amplifier
APPLICATIONS
High resolution video graphics
Professional video
Consumer video
High speed instrumentation
Muxing
GENERAL DESCRIPTION
The AD8003 is a triple ultrahigh speed current feedback amplifier.
Using ADI’s proprietary eXtra Fast Complementary Bipolar
(XFCB) process, the AD8003 achieves a bandwidth of 1.5 GHz
and a slew rate of 4300 V/µs. Additionally, the amplifier provides
excellent dc precision with an input bias current of 50 µA
maximum and a dc input voltage of 0.7 mV.
The AD8003 has excellent video specifications with a frequency
response that remains flat out to 190 MHz and 0.1% settling within
12 ns to ensure that even the most demanding video systems
maintain excellent fidelity. For applications that use NTSC video,
as well as high speed video, the amplifier provides a differential
gain of 0.05% and a differential gain of 0.01°.
The AD8003 has very low spurious-free dynamic range (SFDR)
(−73 dBc @ 20 MHz) and noise (1.8 nV/√Hz). With a supply
range between 5 V and 11 V and ability to source 100 mA of
output current, the AD8003 is ideal for a variety of applications.
Rev. C
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibilityisassumedbyAnalogDevices for itsuse,nor foranyinfringementsofpatentsor other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
Triple, 1.5 GHz Op Amp
AD8003
CONNECTION DIAGRAM
+VS1 1
FEEDBACK 1 2
–IN 1 3
+IN 1 4
POWER DOWN 1 5
–VS1 6
24 23 22 21 20 19
18 +VS3
17 FEEDBACK 3
16 –IN 3
15 +IN 3
14 POWER DOWN 3
13 –VS3
7 8 9 10 11 12
NOTES
1. NC = NO CONNECT.
2. EXPOSED PAD (LFCSP ONLY): THE EXPOSED PAD CAN BE CONNECTED TO GND
OR POWER PLANES, OR IT CAN BE LEFT FLOATING.
Figure 1. 24-Lead, 4 mm × 4 mm LFCSP_WQ (CP-24)
The AD8003 operates on only 9.5 mA of supply current per
amplifier. The independent power-down function of the AD8003
reduces the quiescent current even further to 1.6 mA.
The AD8003 amplifier is available in a compact 4 mm × 4 mm,
24-lead LFCSP_WQ. The AD8003 is rated to work over the
industrial temperature range of −40°C to +85°C.
3
VS = ±5V
2
G = +1, RF = 432
G = +2, +5, RF = 464
1
RL = 150
VOUT = 2V p-p
0
G = +2
G = +1
–1
–2
G = +5
–3
–4
–5
–6
–7
1 10 100 1000
FREQUENCY (MHz)
Figure 2. Large Signal Frequency Response for Various Gains
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2005–2014 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com






AD8003 Datasheet, Funktion
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
Power Dissipation
Common-Mode Input Voltage
Differential Input Voltage
Exposed Paddle Voltage
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering 10 sec)
11 V
See Figure 3
−VS − 0.7 V to +VS + 0.7 V
±VS
−VS
−65°C to +125°C
−40°C to +85°C
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is specified
for device soldered in circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
24-Lead LFCSP_WQ
θJA
70
Unit
°C/W
Maximum Power Dissipation
The maximum safe power dissipation for the AD8003 is limited
by the associated rise in junction temperature (TJ) on the die. At
approximately 150°C, which is the glass transition temperature,
the plastic changes its properties. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the AD8003. Exceeding a junction temperature of 175°C for
an extended period can result in changes in silicon devices,
potentially causing degradation or loss of functionality.
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the die
due to the AD8003 drive at the output. The quiescent power is
the voltage between the supply pins (VS) times the quiescent
current (IS).
PD = Quiescent Power + (Total Drive Power Load Power)
( )PD = VS × I S
+

VS
2
×
VOUT
RL

VOUT
RL
2
AD8003
RMS output voltages should be considered. If RL is referenced to
−VS, as in single-supply operation, the total drive power is VS ×
IOUT. If the rms signal levels are indeterminate, consider the
worst case, when VOUT = VS/4 for RL to midsupply.
PD
= (VS
×IS )+
(VS / 4)2
RL
In single-supply operation with RL referenced to −VS, worst case
is VOUT = VS/2.
Airflow increases heat dissipation, effectively reducing θJA.
In addition, more metal directly in contact with the package
leads and exposed paddle from metal traces, through holes,
ground, and power planes reduce θJA.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the exposed paddle,
4 mm × 4 mm LFCSP_WQ (70°C/W) package on a JEDEC
standard 4-layer board. θJA values are approximations.
3.0
2.5
2.0
1.5
1.0
0.5
0
–55 –35 –15 5 25 45 65 85
AMBIENT TEMPERATURE (°C)
105 125
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
Rev. C | Page 5 of 16

6 Page









AD8003 pdf, datenblatt
Data Sheet
1000 VS = ±5V
RF = 1kΩ
100
10
1
10 100 1k 10k 100k 1M
FREQUENCY (Hz)
Figure 34. Input Voltage Noise vs. Frequency
10M
0 G = +2
–10
RL = 150
DRIVING: CH1 AND CH3
–20 RECEIVING: CH2
–30
–40
–50
–60
–70
–80
–90
–100
0.1
1 10
FREQUENCY (MHz)
VS = ±5V
VS = +5V
100 1000
Figure 35. Worst-Case Crosstalk
10000
VS = ±5V
1000
AD8003
100
I–
10
I+
1
10 100 1k 10k 100k 1M
FREQUENCY (Hz)
Figure 36. Input Current Noise vs. Frequency
10M
1M
100k
10k
1k
100
1k
10k 100k 1M 10M 100M
FREQUENCY (Hz)
Figure 37. Transimpedance
200
180
160
140
120
100
80
60
40
20
0
1G
Rev. C | Page 11 of 16

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