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S71PL127N Schematic ( PDF Datasheet ) - SPANSION

Teilenummer S71PL127N
Beschreibung MirrorBit MCPs
Hersteller SPANSION
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Gesamt 14 Seiten
S71PL127N Datasheet, Funktion
www.DataSheet4U.com
S71PL-N MirrorBitTM MCPs
S71PL256N, S71PL127N, S71PL129N
256/128/128 Megabit (16/8/8 M x 16-Bit)
CMOS 3.0 Volt-only Simultaneous Read/Write,
Page Mode Flash Memory
Data Sheet
S71PL-N MirrorBitTM MCPs Cover Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S71PL-N_00
Revision A Amendment 9
Issue Date December 8, 2006






S71PL127N Datasheet, Funktion
4. Block Diagram
F1-CE#
WP#/ACC
RESET#
Flash-only Address
Shared Address
OE#
WE#
Data Sheet
VCCf
VCC
Flash 1
VSS
RY/BY#
CE#s
UB#s
LB#s
CE2
VCCS
VCC
pSRAM/SRAM
IO15-IO0
CE#
UB#
LB#
Notes:
1. RY/BY# is an open drain output.
2. AMAX = A23 (PL256N), A22 (PL127N), A21 (PL129N).
DQ15 to DQ0
4
S71PL-N MirrorBitTM MCPs
S71PL-N_00_A9 December 8, 2006

6 Page









S71PL127N pdf, datenblatt
Data Sheet
0.15 C
(2X)
PIN A1
CORNER
A A2
INDEX MARK
10
Figure 5.6 TLA064 Physical Dimensions
DA
D1
eD
TOP VIEW
10
9
8
7
E6
5
4
eE 3
2
1
B
0.15 C
(2X)
0.20 C
M L K J H G F E DCB A
7
SD
BOTTOM VIEW
A1
6
SIDE VIEW
64X b
0.15 M C A B
0.08 M C
C 0.08 C
SE 7
E1
PIN A1
CORNER
PACKAGE
JEDEC
TLA 064
N/A
DxE
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
n
φb
eE
eD
SD / SE
11.60 mm x 8.00 mm
PACKAGE
MIN
NOM
MAX
NOTE
--- --- 1.20 PROFILE
0.17 ---
--- BALL HEIGHT
0.81 --- 0.97 BODY THICKNESS
11.60 BSC.
BODY SIZE
8.00 BSC.
BODY SIZE
8.80 BSC.
MATRIX FOOTPRINT
7.20 BSC.
MATRIX FOOTPRINT
12 MATRIX SIZE D DIRECTION
10 MATRIX SIZE E DIRECTION
64 BALL COUNT
0.35
0.40
0.45 BALL DIAMETER
0.80 BSC.
BALL PITCH
0.80 BSC
BALL PITCH
0.40 BSC.
SOLDER BALL PLACEMENT
A2,A3,A4,A5,A6,A7,A8,A9 DEPOPULATED SOLDER BALLS
B1,B2,B3,B4,B7,B8,B9,B10
C1,C2,C9,C10,D1,D10,E1,E10,
F1,F5,F6,F10,G1,G5,G6,G10
H1,H10,J1,J10,K1,K2,K9,K10
L1,L2,L3,L4,L7,L8,L9,L10
M2,M3,M4,M5,M6,M7,M8,M9
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9. N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3352 \ 16-038.22a
10
S71PL-N MirrorBitTM MCPs
S71PL-N_00_A9 December 8, 2006

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