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Teilenummer | S71GL128NB0 |
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Beschreibung | (S71GLxxxNB0) Stacked Multi-chip Product (MCP) | |
Hersteller | SPANSION | |
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Gesamt 30 Seiten www.DataSheet4U.com
S71GL512NB0/S71GL256NB0/
S71GL128NB0
Stacked Multi-chip Product (MCP)
512/256/128 Megabit (32/16/8 M x 16-bit) CMOS 3.0 Volt-only
MirrorBitTM Page-mode Flash Memory with
32 Megabit (2M x 16-bit) pSRAM
Distinctive Characteristics
ADVANCE
INFORMATION
MCP Features
Power supply voltage of 2.7 to 3.1V
High Performance
90 ns access time (S71GL128N, S71GL256N)
100 ns access time (S71GL512N)
25 ns page read times
Packages:
— 9.0 x 12.0 mm x 1.2 mm FBGA (TLD084) (S71GL512N)
— 8.0 x 11.6 mm x 1.2 mm FBGA (TLA084) (S71GL128N, S71GL256N)
Operating Temperature
— -25°C to +85°C (Wireless)
— -40°C to +85°C (Industrial)
General Description
The S71GL Series is a product line of stacked Multi-chip Product (MCP) packages
and consists of
One Flash memory die
one pSRAM
The products covered by this document are listed in the table below. For details
about their specifications, please refer to the individual constituent datasheets
for further details.
pSRAM Density
128 Mb
64 Mb
32 Mb
16 Mb
512 Mb
Flash Memory Density
256 Mb
128 Mb
S71GL512NB0 S71GL256NB0 S71GL128NB0
Publication Number S71GL512_256_128NB0_00 Revision A Amendment 1 Issue Date December 7, 2004
This document contains information on a product under development at Spansion LLC. The information is intended to help you evaluate this product. Spansion LLC
reserves the right to change or discontinue work on this proposed product without notice.
Advance Information
MCP Block Diagram (512Mb Flash + 32Mb pSRAM)
VCCf
Flash-only Address
Shared Address
WP#/ACC
CE#F1
OE#
WE#
RESET#
VCCs
UB#s
LB#s
CE2s
CE1#s
4
21
VCC VID
DQ15 to DQ0
WP#/ACC
CE#
Flash
OE#
WE#
RESET# RY/BY#
16
21 VCC VCCQ
I/O15 to I/O0
WE#
OE#
UB#
LB#
CE2s
CE1#s
pSRAM
VSSQ
16
DQ15 to DQ0
RY/BY#
VSS
6 S71GL512_256_128NB0_00_A1 December 7, 2004
6 Page Advance Information
Ordering Information
The order number (Valid Combination) is formed by the following:
S71GL 512 N B0 BA W A B 0
PACKING TYPE
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER
B = Refer to the Valid Combinations Table
PACKAGE MODIFIER
A = 1.2 mm height, 8 x 11.6 mm, 84 balls FBGA
E = 1.2 mm height, 9 x 12.0 mm, 84 balls FBGA
9 = 1.2 mm height, 8 x 11.6 mm, 64 balls FBGA
TEMPERATURE RANGE
W = Wireless (-25°C to +85°C)
I = Industrial (-40°C to +85°C)
PACKAGE TYPE
BA = Very Thin Fine-pitch BGA Lead (Pb)-free compliant package
BF = Very Thin Fine-pitch BGA Lead (Pb)-free package
pSRAM DENSITY
B0 = 32 Mb pSRAM
PROCESS TECHNOLOGY
N = 110 nm, MirrorBitTM Technology
FLASH DENSITY
512 = 512 Mb
256 = 256 Mb
128 = 128 Mb
PRODUCT FAMILY
S71GL Multi-chip Product (MCP)
3.0 Volt-only Uniform Sector Page Mode Flash Memory
12 S71GL512_256_128NB0_00_A1 December 7, 2004
12 Page | ||
Seiten | Gesamt 30 Seiten | |
PDF Download | [ S71GL128NB0 Schematic.PDF ] |
Teilenummer | Beschreibung | Hersteller |
S71GL128NB0 | (S71GLxxxNB0) Stacked Multi-chip Product (MCP) | SPANSION |
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