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PDF STTH810 Data sheet ( Hoja de datos )

Número de pieza STTH810
Descripción Ultrafast recovery - high voltage diode
Fabricantes ST Microelectronics 
Logotipo ST Microelectronics Logotipo



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STTH810
Ultrafast recovery - high voltage diode
Main product characteristics
IF(AV)
VRRM
Tj
VF (typ)
trr (typ)
8A
1000 V
175° C
1.30 V
47 ns
Features and benefits
Ultrafast, soft recovery
Very low conduction and switching losses
High frequency and/or high pulsed current
operation
High reverse voltage capability
High junction temperature
Insulated packages:
– TO-220Ins
– Electrical insulation = 2500 VRMS
Capacitance = 7 pF
– TO-220FPAC
Electrical insulation = 2500 VRMS
Capacitance = 12 pF
Description
The high quality design of this diode has
produced a device with low leakage current,
regularly reproducible characteristics and intrinsic
ruggedness. These characteristics make it ideal
for heavy duty applications that demand long term
reliability.
Such demanding applications include industrial
power supplies, motor control, and similar
mission-critical systems that require rectification
and freewheeling. These diodes also fit into
auxiliary functions such as snubber, bootstrap,
and demagnetization applications.
The improved performance in low leakage
current, and therefore thermal runaway guard
band, is an immediate competitive advantage for
this device.
A
A
K
TO-220AC
STTH810D
K
A
NC
D2PAK
STTH810G
Order codes
Part Number
STTH810D
STTH810G
STTH810G-TR
STTH810FP
STTH810DI
March 2006
Rev 1
K
A
K
TO-220FPAC
STTH810FP
A
K
TO-220Ins
STTH810DI
Marking
STTH810D
STTH810G
STTH810G
STTH810FP
STTH810DI
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STTH810 pdf
STTH810
Characteristics
Figure 11. Forward recovery time versus dIF/dt Figure 12. Junction capacitance versus
(typical values)
reverse voltage applied (typical
values)
tfr(ns)
600
550
500
IF = IF(AV)
VFR = 1.5 x VF max.
Tj=125°C
C(pF)
100
F=1MHz
Vosc=30mVRMS
Tj=25°C
450
400 10
350
300
250
200
0
dIF/dt(A/µs)
100 200 300 400 500
1
1
VR(V)
10 100
1000
Figure 13. Thermal resistance junction to
ambient versus copper surface
under tab (Epoxy printed circuit
board FR4, ecu = 35 µm)
Rth(j-a)(°C/W)
80
70
D²PAK
60
50
40
30
20
10
SCU(cm²)
0
0 5 10 15 20 25 30 35 40
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STTH810 arduino
STTH810
Please Read Carefully:
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right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
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liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
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liability of ST.
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Information in this document supersedes and replaces all information previously supplied.
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STMicroelectronics group of companies
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