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WF1M32B-XXX3 Schematic ( PDF Datasheet ) - White Electronic

Teilenummer WF1M32B-XXX3
Beschreibung 1Mx32 3.3V Flash Module
Hersteller White Electronic
Logo White Electronic Logo 




Gesamt 13 Seiten
WF1M32B-XXX3 Datasheet, Funktion
www.DataSheet4U.com
White Electronic Designs
WF1M32B-XXX3
1Mx32 3.3V Flash Module
FEATURES
Access Times of 100, 120, 150ns
■ Packaging
• 66 pin, PGA Type, 1.185" square, Hermetic
Ceramic HIP (Package 401)
• 68 lead, Low Profile CQFP (G2T), 4.6mm
(0.180") square (Package 509)
■ 1,000,000 Erase/Program Cycles
■ Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and
fifteen 64kBytes in byte mode
• Any combination of sectors can be concurrently
erased. Also supports full chip erase
■ Organized as 1Mx32
■ Commercial, Industrial and Military Temperature
Ranges
■ 3.3 Volt for Read and Write Operations
■ Boot Code Sector Architecture (Bottom)
■ Low Power CMOS, 1.0mA Standby
■ Embedded Erase and Program Algorithms
■ Built-in Decoupling Caps for Low Noise Operation
■ Erase Suspend/Resume
• Supports reading data from or programing data to
a sector not being erased
■ Low Current Consumption
Typical values at 5MHz:
• 40mA Active Read Current
• 80mA Program/Erase Current
■ Weight
WF1M32B-XG2TX3 -8 grams typical
WF1M32B-XHX3 -13 grams typical
Note: For programming information refer to Flash Programming 8M3 Application Note.
PIN CONFIGURATION FOR WF1M32B-XHX3
Top View
1 12 23
34 45 56
I/O8 RESET# I/O15
I/O24 VCC I/O31
I/O9
CS2#
I/O14
I/O25 CS4#
I/O30
I/O10 GND
I/O13
I/O26 NC I/O29
A14
I/O11
I/O12
A7 I/O27 I/O28
A16 A10
OE#
A12 A4 A1
A11 A9
A17
NC A5 A2
A0 A15 WE#
A13 A6 A3
A18 VCC I/O7
A8 NC I/O23
I/O0
CS1#
I/O6
I/O16 CS3#
I/O22
I/O1 A19
I/O5
I/O17 GND I/O21
I/O2 I/O3
I/O4
11 22
33
I/O18
I/O19
I/O20
44 55 66
Pin Description
I/O0-31 Data Inputs/Outputs
A0-19 Address Inputs
WE# Write Enable
CS1-4# Chip Selects
OE# Output Enable
RESET# Reset
VCC Power Supply
GND Ground
NC Not Connected
RESET#
WE#
OE#
A0-19
Block Diagram
CS1#
CS2#
CS3#
1M x 8
1M x 8
1M x 8
CS4#
1M x 8
8888
I/O0-7
I/O8-15
I/O16-23
I/O24-31
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2006
Rev. 5
1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com






WF1M32B-XXX3 Datasheet, Funktion
White Electronic Designs
WF1M32B-XXX3
AC WAVEFORMS FOR READ OPERATIONS
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2006
Rev. 5
6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

6 Page









WF1M32B-XXX3 pdf, datenblatt
White Electronic Designs
WF1M32B-XXX3
PACKAGE 401: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
30.1 (1.185) ± 0.38 (0.015) SQ
PIN 1 IDENTIFIER
SQUARE PAD
ON BOTTOM
25.4 (1.0) TYP
3.81 (0.150)
± 0.1 (0.005)
2.54 (0.100)
TYP
15.24 (0.600) TYP
25.4 (1.0) TYP
1.27 (0.050) ± 0.1 (0.005)
0.76 (0.030) ± 0.1 (0.005)
1.27 (0.050) TYP DIA
0.46 (0.018) ± 0.05 (0.002) DIA
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2006
Rev. 5
12 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

12 Page





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