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BCM61B Schematic ( PDF Datasheet ) - NXP

Teilenummer BCM61B
Beschreibung NPN/NPN matched double transistor
Hersteller NXP
Logo NXP Logo 



Gesamt 13 Seiten
		
BCM61B Datasheet, Funktion
BCM61B
NPN/NPN matched double transistor
Rev. 02 — 28 August 2009
Product data sheet
1. Product profile
1.1 General description
NPN/NPN matched double transistor in a SOT143B small Surface-Mounted Device (SMD)
plastic package. Matched version of BCV61.
PNP/PNP equivalent: BCM62B
1.2 Features
I Current gain matching
1.3 Applications
I Current mirror
I Differential amplifier
1.4 Quick reference data
Table 1. Quick reference data
Symbol Parameter
Per transistor TR1
VCEO
hFE
collector-emitter voltage
DC current gain
Per transistor
IC collector current
Per device
IC1/IE2
current matching
Conditions
open base
VCE = 5 V;
IC = 2 mA
VCE1 = 5 V;
IE2 = 0.5 mA;
Tamb 25 °C
Min Typ Max Unit
- - 45 V
200 290 450
- - 100 mA
[1] 0.92 1.02 1.12
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.






BCM61B Datasheet, Funktion
NXP Semiconductors
BCM61B
NPN/NPN matched double transistor
0.20
IC
(A)
0.16
IB (mA) = 4.5
4.05
3.6
006aaa822
0.12
0.08
0.04
3.15
2.7
2.25
1.8
1.35
0.9
0.45
0
0 2 4 6 8 10
VCE (V)
Tamb = 25 °C
Fig 1. Collector current as a function of
collector-emitter voltage; typical values
1.3
VBEsat
(V)
0.9
0.5
(1)
(2)
(3)
006aaa824
600
hFE
400
200
006aaa823
(1)
(2)
(3)
0
102
101
1
10 102 103
IC (mA)
VCE = 5 V
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = 55 °C
Fig 2. DC current gain as a function of collector
current; typical values
10
VCEsat
(V)
006aaa825
1
101
(1)
(2)
(3)
0.1
101
1
10 102 103
IC (mA)
IC/IB = 20
(1) Tamb = 55 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
Fig 3. Base-emitter saturation voltage as a function
of collector current; typical values
102
101
1
10 102 103
IC (mA)
IC/IB = 20
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = 55 °C
Fig 4. Collector-emitter saturation voltage as a
function of collector current; typical values
BCM61B_2
Product data sheet
Rev. 02 — 28 August 2009
© NXP B.V. 2009. All rights reserved.
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BCM61B pdf, datenblatt
NXP Semiconductors
BCM61B
NPN/NPN matched double transistor
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet Development
Preliminary [short] data sheet Qualification
Product [short] data sheet
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BCM61B_2
Product data sheet
Rev. 02 — 28 August 2009
© NXP B.V. 2009. All rights reserved.
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