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PDF MAX2021 Data sheet ( Hoja de datos )
| Número de pieza | MAX2021 | |
| Descripción | High Dynamic Range Direct Up / Down Conversion Quadrature Mod / Demod | |
| Fabricantes | Maxim Integrated Products | |
| Logotipo |  |
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19-3918; Rev 0; 3/06
EVALUATION KIT AVAILABLE
High-Dynamic-Range, Direct Up-/Downconversion
750MHz to 1200MHz Quadrature Mod/Demod
General Description
The MAX2021 low-noise, high-linearity, direct upcon-
version/downconversion quadrature modulator/demod-
ulator is designed for RFID handheld and portal
readers, as well as single and multicarrier 750MHz to
1200MHz GSM/EDGE, cdma2000®, WCDMA, and
iDEN® base-station applications. Direct conversion
architectures are advantageous since they significantly
reduce transmitter or receiver cost, part count, and
power consumption as compared to traditional IF-based
double conversion systems.
In addition to offering excellent linearity and noise perfor-
mance, the MAX2021 also yields a high level of compo-
nent integration. This device includes two matched
passive mixers for modulating or demodulating in-phase
and quadrature signals, two LO mixer amplifier drivers,
and an LO quadrature splitter. On-chip baluns are also
integrated to allow for single-ended RF and LO connec-
tions. As an added feature, the baseband inputs have
been matched to allow for direct interfacing to the trans-
mit DAC, thereby eliminating the need for costly I/Q
buffer amplifiers.
The MAX2021 operates from a single +5V supply. It is
available in a compact 36-pin thin QFN package (6mm
x 6mm) with an exposed paddle. Electrical perfor-
mance is guaranteed over the extended -40°C to
+85°C temperature range.
Applications
RFID Handheld and Portal Readers
Single and Multicarrier WCDMA 850 Base Stations
Single and Multicarrier cdmaOne™ and cdma2000
Base Stations
GSM 850/GSM 900 EDGE Base Stations
Predistortion Transmitters and Receivers
WiMAX Transmitters and Receivers
Fixed Broadband Wireless Access
Military Systems
Microwave Links
Digital and Spread-Spectrum Communication
Systems
Video-on-Demand (VOD) and DOCSIS Compliant
Edge QAM Modulation
Cable Modem Termination Systems (CMTS)
cdma2000 is a registered trademark of Telecommunications
Industry Association.
iDEN is a registered trademark of Motorola, Inc.
cdmaOne is a trademark of CDMA Development Group.
Features
♦ 750MHz to 1200MHz RF Frequency Range
♦ Scalable Power: External Current-Setting
Resistors Provide Option for Operating Device in
Reduced-Power/Reduced-Performance Mode
♦ 36-Pin, 6mm x 6mm TQFN Provides High Isolation
in a Small Package
Modulator Operation:
♦ Meets 4-Carrier WCDMA 65dBc ACLR
♦ +21dBm Typical OIP3
♦ +58dBm Typical OIP2
♦ +16.7dBm Typical OP1dB
♦ -32dBm Typical LO Leakage
♦ 43.5dBc Typical Sideband Suppression
♦ -174dBm/Hz Output Noise Density
♦ DC to 300MHz Baseband Input Allows a Direct
Launch DAC Interface, Eliminating the Need for
Costly I/Q Buffer Amplifiers
♦ DC-Coupled Input Allows Ability for Customer
Offset Voltage Control
Demodulator Operation:
♦ +35.2dBm Typical IIP3
♦ +76dBm Typical IIP2
♦ > 30dBm IP1dB
♦ 9.2dB Typical Conversion Loss
♦ 9.3dB Typical NF
♦ 0.06dB Typical I/Q Gain Imbalance
♦ 0.15° I/Q Typical Phase Imbalance
Ordering Information
PART
TEMP RANGE PIN-PACKAGE PKG
CODE
MAX2021ETX
MAX2021ETX-T
-40°C to +85°C
-40°C to +85°C
36 Thin QFN-EP* T3666-2
(6mm x 6mm)
36 Thin QFN-EP*
(6mm x 6mm)
T3666-2
MAX2021ETX+
MAX2021ETX+T
-40°C to +85°C
-40°C to +85°C
36 Thin QFN-EP* T3666-2
(6mm x 6mm)
36 Thin QFN-EP*
(6mm x 6mm)
T3666-2
*EP = Exposed paddle. + = Lead free.
-T = Tape-and-reel package.
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1 page  
High-Dynamic-Range, Direct Up-/Downconversion
750MHz to 1200MHz Quadrature Mod/Demod
Typical Operating Characteristics (continued)
(MAX2021 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100Ω DC-coupled
source, 0V common-mode input, PLO = 0dBm, 750MHz ≤ fLO ≤ 1200MHz, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 619Ω,
R3 = 332Ω, TC = -40°C to +85°C. Typical values are at VCC = +5V, VBBI = 1.4VP-P differential, VBBQ = 1.4VP-P differential, fIQ = 1MHz,
fLO = 900MHz, TC = +25°C, unless otherwise noted.)
MODULATOR
OUTPUT IP3 vs. LO FREQUENCY
30
TC = +25°C
PLO = -3dBm
25 PLO = +3dBm
OUTPUT IP3
vs. COMMON-MODE VOLTAGE
26
fLO = 900MHz, PLO = 0dBm
25
24
OUTPUT IP3
vs. COMMON-MODE VOLTAGE
26
fLO = 1000MHz
25
24
20 23
23
15 PLO = 0dBm
PLO = -6dBm
22
21
22
21
10
750
825 900 975 1050 1125 1200
LO FREQUENCY (MHz)
OUTPUT IP2 vs. LO FREQUENCY
80
TC = -40°C
70
20
-3.50
-1.75 0 1.75
COMMON-MODE VOLTAGE (V)
3.50
OUTPUT IP2 vs. LO FREQUENCY
80
VCC = 5.25V
70
20
-3.50
-1.75 0 1.75
COMMON-MODE VOLTAGE (V)
3.50
OUTPUT IP2 vs. LO FREQUENCY
80
PLO = +3dBm
70
TC = +25°C
60 60
VCC = 5.0V
60
PLO = -6dBm
50
TC = +85°C
40
750
80
825 900 975 1050 1125
LO FREQUENCY (MHz)
OUTPUT IP2
vs. COMMON-MODE VOLTAGE
fLO = 900MHz
1200
75
70
65
60
50
VCC = 4.75V
40
750
70
825 900 975 1050 1125
LO FREQUENCY (MHz)
OUTPUT IP2
vs. COMMON-MODE VOLTAGE
fLO = 1000MHz
1200
65
60
55
50 PLO = 0dBm
PLO = -3dBm
40
750
825 900 975 1050 1125 1200
LO FREQUENCY (MHz)
MODULATOR OUTPUT POWER
vs. INPUT POWER
20
INPUT SPLIT BETWEEN I AND Q,
fIF = 25MHz, fLO = 900MHz
15
10
5
VCC = 4.75V, 5.0V, 5.25V
0
55
-3.50
-1.75 0 1.75
COMMON-MODE VOLTAGE (V)
3.50
50
-3.50
-1.75 0 1.75
COMMON-MODE VOLTAGE (V)
3.50
-5
10
13 16 19 22 25
INPUT POWER (dBm)
28
_______________________________________________________________________________________ 5
5 Page 
High-Dynamic-Range, Direct Up-/Downconversion
750MHz to 1200MHz Quadrature Mod/Demod
Table 1. Typical Performance Trade-Offs as a Function of Current Draw—Modulator Mode
LO FREQ RF FREQ
R1
R2
R3
ICC
OIP3
LO LEAK IMAGE REJ OIP2
(MHz)
(MHz)
(Ω)
(Ω)
(Ω)
(mA)
(dBm)
(dBm)
(dBc)
(dBm)
420 620 330 271 19.6 -32.1 23.9 50.5
453 665 360 253 21.9 -32.7 34.0 51.0
800 801.8
499
698
402
229 18.9 -33.7 30.0
52.6
549 806 464 205 15.7 -34.4 23.7 46.0
650 1000 550
173 13.6 -34.2 23.3
32.3
900 901.8
420
453
499
549
650
620
665
698
806
1000
330
360
402
464
550
271 20.7 -31.4 43.4
253 21.6 -31.6 42.4
229 20.6 -31.8 42.7
205 19.0 -31.9 40.3
173 14.9 -30.5 25.0
54.0
55.4
59.8
50.7
34.6
1000
1001.8
420
453
499
549
650
620
665
698
806
1000
330
360
402
464
550
271 22.4 -32.8 39.3
253 22.2 -33.2 39.1
229 19.9 -33.8 43.5
205 17.6 -34.8 40.5
173 14.6 -33.9 36.8
55.5
56.3
55.0
51.4
32.8
Note: VCC = 5V, PLO = 0dBm, TA = +25°C, I/Q voltage levels = 1.4VP-P differential.
R2, and R3. Tables 1 and 2 outline the performance
trade-offs that can be expected for various combina-
tions of these bias resistors. As noted within the tables,
the performance trade-offs may be more pronounced
for different operating frequencies. Contact the factory
for additional details.
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
tance. For the best performance, route the ground pin
traces directly to the exposed pad under the package.
The PC board exposed paddle MUST be connected to
the ground plane of the PC board. It is suggested that
multiple vias be used to connect this pad to the lower-
level ground planes. This method provides a good
RF/thermal conduction path for the device. Solder the
exposed pad on the bottom of the device package to
the PC board. The MAX2021 evaluation kit can be used
as a reference for board layout. Gerber files are avail-
able upon request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass all VCC_ pins with
33pF and 0.1µF capacitors placed as close to the pins
as possible. The smallest capacitor should be placed
closest to the device.
To achieve optimum performance, use good voltage-
supply layout techniques. The MAX2021 has several RF
processing stages that use the various VCC_ pins, and
while they have on-chip decoupling, off-chip interaction
between them may degrade gain, linearity, carrier sup-
pression, and output power-control range. Excessive
coupling between stages may degrade stability.
Exposed Pad RF/Thermal Considerations
The EP of the MAX2021’s 36-pin thin QFN-EP package
provides a low thermal-resistance path to the die. It is
important that the PC board on which the IC is mounted
be designed to conduct heat from this contact. In addi-
tion, the EP provides a low-inductance RF ground path
for the device.
The exposed paddle (EP) MUST be soldered to a
ground plane on the PC board either directly or through
an array of plated via holes. An array of 9 vias, in a 3 x
3 array, is suggested. Soldering the pad to ground is
critical for efficient heat transfer. Use a solid ground
plane wherever possible.
______________________________________________________________________________________ 11
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet MAX2021.PDF ] | |
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