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PDF LIS302DL Data sheet ( Hoja de datos )

Número de pieza LIS302DL
Descripción MEMS Motion Sensor
Fabricantes ST Microelectronics 
Logotipo ST Microelectronics Logotipo



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No Preview Available ! LIS302DL Hoja de datos, Descripción, Manual

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LIS302DL
MEMS motion sensor
3-axis - ±2g/±8g smart digital output “piccolo” accelerometer
Preliminary Data
Feature
2.16V to 3.6V supply voltage
1.8V compatible IOs
<1mW power consumption
±2g/±8g dynamically selectable Full-Scale
I2C/SPI digital output interface
Programmable multiple interrupt generator
Embedded high pass filter
Embedded self test
10000g high shock survivability
ECOPACK® RoHS and “Green” compliant
(see Section 8)
Description
The LIS302DL is an ultra compact low-power
three axes linear accelerometer. It includes a
sensing element and an IC interface able to
provide the measured acceleration to the external
world through I2C/SPI serial interface.
The sensing element, capable of detecting the
acceleration, is manufactured using a dedicated
process developed by ST to produce inertial
sensors and actuators in silicon.
The IC interface is manufactured using a CMOS
process that allows to design a dedicated circuit
which is trimmed to better match the sensing
element characteristics.
The LIS302DL has dynamically user selectable
full scales of ±2g/±8g and it is capable of
measuring accelerations with an output data rate
of 100Hz or 400Hz.
Order codes
LGA-14 (3x5x0.9mm)
A self-test capability allows the user to check the
functioning of the sensor in the final application.
The device may be configured to generate inertial
wake-up/free-fall interrupt signals when a
programmable acceleration threshold is crossed
at least in one of the three axes. Thresholds and
timing of interrupt generators are completely
programmable by the end user on the fly.
The LIS302DL is available in plastic Thin Land
Grid Array package (TLGA) and it is guaranteed
to operate over an extended temperature range
from -40°C to +85°C.
The LIS302DL belongs to a family of products
suitable for a variety of applications:
– Free-Fall detection
– Motion activated functions
– Gaming and Virtual Reality input
devices
– Vibration Monitoring and Compensation
Part number
LIS302DL
LIS302DLTR
Temp range, °C
-40 to +85
-40 to +85
Package
LGA
LGA
Packing
Tray
Tape and reel
October 2006
Rev 1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
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LIS302DL pdf
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LIS302DL
Block diagram & pin description
Table 1. Pin description
Pin#
Name
Function
1 Vdd_IO Power supply for I/O pins
2
GND
0V supply
3 Reserved Connect to Vdd
4
GND
0V supply
5
GND
0V supply
6 Vdd Power supply
SPI enable
7 CS I2C/SPI mode selection (1: I2C mode; 0: SPI enabled)
8
INT 1
Inertial interrupt 1
9
INT 2
Inertial interrupt 2
10
GND
0V supply
11 Reserved Connect to Gnd
SPI Serial Data Output
12
SDO
I2C less significant bit of the device address
SDA
I2C Serial Data (SDA)
13 SDI SPI Serial Data Input (SDI)
SDO
3-wire Interface Serial Data Output (SDO)
SCL
I2C Serial Clock (SCL)
14
SPC
SPI Serial Port Clock (SPC)
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LIS302DL arduino
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LIS302DL
4 Application hints
Figure 3. LIS302DL electrical connection
Application hints
Vdd
10uF
100nF
6
Top VIEW
8
Vdd_IO
1Z
1
YX
13
6
8
13 TOP VIEW
DIRECTION OF THE
DETECTABLE
ACCELERATIONS
4.1
GND
Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO
The device core is supplied through Vdd line while the I/O pads are supplied through
Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 μF Al) should be
placed as near as possible to the pin 6 of the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to Fig. 3). It is possible to remove Vdd maintaining Vdd_IO without
blocking the communication busses, in this condition the measurement chain is powered off.
The functionality of the device and the measured acceleration data is selectable and
accessible through the I2C/SPI interface.When using the I2C, CS must be tied high while
SDO must be left floating.
The functions, the threshold an the timing of the two interrupt pins (INT 1 and INT 2) can be
completely programmed by the user though the I2C/SPI interface.
Soldering information
The LGA package is compliant with the ECOPACK, RoHS and “green” standard. It is
qualified for soldering heat resistance according to JEDEC J-STD-020C. Pin #1 indicator is
electrically connected to pin 1. Leave pin 1 indicator unconnected during soldering. Land
pattern and soldering recommendation are available at www.st.com/mems.
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