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XL1004 Schematic ( PDF Datasheet ) - Mimix Broadband

Teilenummer XL1004
Beschreibung 35.0-45.0 GHz GaAs MMIC Low Noise Amplifier
Hersteller Mimix Broadband
Logo Mimix Broadband Logo 




Gesamt 6 Seiten
XL1004 Datasheet, Funktion
www.DataSheet4U.com
35.0-45.0 GHz GaAs MMIC
Low Noise Amplifier
May 2006 - Rev 10-May-06
Features
Balanced Design
Excellent Input/Output Match
Self-biased Architecture
17.0 dB Small Signal Gain
1.8 dB Noise Figure
100% On-Wafer RF, DC and Noise Figure Testing
100% Visual Inspection to MIL-STD-883
Method 2010
Chip Device Layout
L1004
General Description
Mimix Broadband’s three stage balanced 35.0-45.0
GHz GaAs MMIC low noise amplifier has a small signal
gain of 17.0 dB with a noise figure of 1.8 dB across the
Absolute Maximum Ratings
band.This MMIC uses Mimix Broadband’s 0.15 µm
Supply Voltage (Vd)
+5.5 VDC
GaAs PHEMT device model technology, and is based
Supply Current (Id)
130 mA
upon electron beam lithography to ensure high
Input Power (Pin)
-5.0/-1.0 dBm
repeatability and uniformity.The chip has surface
Storage Temperature (Tstg) -65 to +165 OC
passivation to protect and provide a rugged part with
Operating Temperature (Ta) -55 to MTTF Table1
backside via holes and gold metallization to allDoawtaSheet4U.coCmhannel Temperature (Tch) MTTF Table1
either a conductive epoxy or eutectic solder die
(1) Channel temperature affects a device's MTTF. It is
attach process.This device is well suited for
recommended to keep channel temperature as low as
possible for maximum life.
Millimeter-wave Point-to-Point Radio, LMDS, SATCOM
and VSAT applications.
Electrical Characteristics (Ambient Temperature T = 25 oC)
Parameter
Frequency Range (f )
Input Return Loss (S11)
Output Return Loss (S22)
Small Signal Gain (S21)
Gain Flatness ( S21)
Reverse Isolation (S12)
Noise Figure (NF)
Output Power for 1 dB Compression (P1dB)
Output Third Order Intercept Point (OIP3)
Drain Bias Voltage (Vd)
Supply Current (Id)
Units
GHz
dB
dB
dB
dB
dB
dB
dBm
dBm
VDC
mA
Min.
35.0
8.0
15.0
15.0
-
-
-
-
-
-
-
Typ.
-
16.0
18.0
17.0 2
+/-2.0
-
1.8
+6.0
-
+4.0
85
Max.
40.0
-
-
-
-
-
3.0
-
-
-
-
Min.
40.0
15.0
15.0
10.0
-
-
-
-
-
-
-
(2) See plots for additional information.
Typ.
-
17.0
18.0
14.0 2
+/-2.0
-
2.0
+6.0
-
+4.0
85
Max.
45.0
-
-
-
-
-
3.0
-
-
-
-
DataShee
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Page 1 of 6
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
DataSheet4U.com
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
DataSheet4 U .com
DataSheet4U.com






XL1004 Datasheet, Funktion
www.DataSheet4U.com
35.0-45.0 GHz GaAs MMIC
Low Noise Amplifier
May 2006 - Rev 10-May-06
L1004
Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the
human body and the environment. For safety, observe the following procedures:
Do not ingest.
Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this product.This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support
devices or systems without the express written approval of the President and General Counsel of Mimix
Broadband. As used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for
surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be reasonably expected to result in a
significant injury to the user. (2) A critical component is any component of a life support device or system whose
failure to perform can be reasonably expected to cause the failure of the life support device or system, or to
affect its safety or effectiveness.
et4U.com
ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied
in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded anti-
static workstation. Devices need careful handling usDinagtacSorhreeecttl4yUd.ecsoigmned collets, vacuum pickups or, with care,
sharp tweezers.
Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the
backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as
possible.The mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are
Ablestick 84-1LMI or 84-1LMIT cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy
sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total
die periphery. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.0012
thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated
collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere
is recommended.The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximately 280 C (Note: Gold
Germanium should be avoided).The work station temperature should be 310 C+- 10 C. Exposure to these
extreme temperatures should be kept to minimum.The collet should be heated, and the die pre-heated to avoid
excessive thermal shock. Avoidance of air bridges and force impact are critical during placement.
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to
the die's gold bond pads.The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x
0.0005") 99.99% pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm
(0.001") diameter wedge or ball bonds are acceptable for DC Bias connections. Aluminum wire should be
avoided.Thermo-compression bonding is recommended though thermosonic bonding may be used providing
the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters.
Bonds should be made from the bond pads on the die to the package or substrate. All bonds should be as short
as possible.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Page 6 of 6
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
DataSheet4U.com
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
DataSheet4 U .com
DataSheet4U.com

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