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PDF MSM5052 Data sheet ( Hoja de datos )
| Número de pieza | MSM5052 | |
| Descripción | Built-in Temperature Circuit and LCD Driver 4-Bit Microcontroller | |
| Fabricantes | OKI electronic componets | |
| Logotipo |  |
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E2E0008-38-94
¡¡SemicondSucetormiconductor
MSM5052
This version: SMepS.M19590852
Previous version: Mar. 1996
Built-in Temperature Circuit and LCD Driver 4-Bit Microcontroller
GENERAL DESCRIPTION
The MSM5052 is a low-power microcontroller manufactured in complementary metal-oxide
semiconductor technology. Integrated into a single chip are ROM, RAM, crystal oscillator, voltage
doubler, timer, LCD driver, input port, output port, and thermistor-based temperature measuring
circuit.
Using an on-chip ROM reduces power consumption.
The MSM5052 is widely used in electronic products requiring low-power operation, for
example, thermometer and clinical thermometer.
FEATURES
• Low power consumption
• Internal ROM
: 1280 ¥ 14 bits
• Internal RAM
: 62 ¥ 4 bits
• I/O port
Input port
: 2 ports ¥ 4 bits
Output port
: 1 port ¥ 4 bits
1 port ¥ 1 bit
• 4 ¥ 4 key matrix input is available by using K1 to K4 and M1 to M4
• 26 LCD drivers (1/2 duty, 1/2 bias, 52 segments)
• 42 instructions
• Minimum instruction execution time : 122.1 ms (Display instruction cycle: 244.2 ms)
• 1.5 V operating voltage (Built-in LCD drive voltage doubler)
• Buzzer function
• Built-in thermistor-based temperature measuring circuit
• Crystal oscillator
: 32.768 kHz
• Package options:
56-pin plastic QFP (QFP56-P-910-0.65-K) : (Product name : MSM5052-¥¥¥GS-K)
56-pin plastic QFP (QFP56-P-910-0.65-2K) : (Product name : MSM5052-¥¥¥GS-2K)
80-pin plastic QFP (QFP80-P-1420-0.80-BK): (Product name : MSM5052-¥¥¥GS-BK)
Chip (Chip size 4.77 mm ¥ 4.36 mm)
: (Product name : MSM5052-¥¥¥)
¥¥¥ indicates a code number.
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¡ Semiconductor
PAD CONFIGURATION
Pad Layout
MSM5052
SEG24
SEG25
SEG26
COM2
XT
NC
XT
VDD
RESET
VCP
VCM
S1
S2
S3
S4
SEG3
SEG2
SEG1
COM1
T3
T1
T2
T4
T5
BD
VDD
VSS2
VSS1
M1 M2 M3 M4 LD K1 K2 K3 K4 OSC OSC OSC OSC
C IN R TH
Chip size 4.77 ¥ 4.36 (mm)
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¡ Semiconductor
QFP56-P-910-0.65-2K
MSM5052
(Unit : mm)
Mirror finish
Notes for Mounting the Surface Mount Type Package
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.43 TYP.
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet MSM5052.PDF ] | |
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