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QFBR-5204 Schematic ( PDF Datasheet ) - Agilent Technologies

Teilenummer QFBR-5204
Beschreibung (QFBR-5204 / QFBR-5205) ATM Multimode Fiber Transceivers
Hersteller Agilent Technologies
Logo Agilent Technologies Logo 




Gesamt 23 Seiten
QFBR-5204 Datasheet, Funktion
ATM Multimode Fiber
Transceivers for SONET
OC-3/SDH STM-1 in Low
Cost 1x9 Package Style
Data Sheet
HFBR-5204/-5204P/-5204T
1300 nm 500 m
HFBR-5205/-5205A/
-5205AT/-5205P/-5205T/
-5205PE
1300 nm 2 km
Features
• Full Compliance with ATM
Forum UNI SONET OC-3
Multimode Fiber Physical
Layer Specification
These transceivers are all
supplied in the new industry
standard 1x9 SIP package style
with either a duplex SC or a
duplex ST* connector interface.
• Multisourced 1 x 9 Package
Style with Choice of Duplex
SC or Duplex ST* Receptacle
• Wave Solder and Aqueous
Wash Process Compatibility
• Manufactured in an ISO 9002
Certified Facility
Applications
• Multimode Fiber ATM
Backbone Links
• Multimode Fiber ATM Wiring
Closet to Desktop Links
ATM 2000 m Backbone Links
The HFBR-5205/-5205T are
1300 nm products with optical
performance compliant with the
SONET STS-3c (OC-3) Physical
Layer Interface Specification. This
physical layer is defined in the
ATM Forum User-Network Inter-
face (UNI) Specification Version
3.0. This document references the
ANSI T1E1.2 specification for the
details of the interface for 2000
meter multimode fiber backbone
links.
• ATM 155 Mbps/194 MBd
Encoded Links (available
upon special request)
Description
The HFBR-5200 family of trans-
ceivers from Agilent Technologies
provide the system designer with
products to implement a range of
solutions for multimode fiber
SONET OC-3 (SDH STM-1) physical
layers for ATM and other services.
Selected versions of these
transceivers may be used to
implement the ATM Forum UNI
Physical Layer Interface at the
155 Mbps/194 MBd rate.
The ATM 100 Mbps/125 MBd
Physical Layer interface is best
implemented with the HFBR-5100
family of FDDI Transceivers
which are specified for use in this
4B/5B encoded physical layer per
the FDDI PMD standard.
ATM 500 m Backbone and
Desktop Links
The HFBR-5204/-5204T are 1300
nm products which are similar to
the HFBR-5205/5205T except
that they are intended to provide
a lower cost SONET OC-3 link to
distances up to 500 meters in
62.5/125 µm multimode fiber
optic cables.
Transmitter Sections
The transmitter sections of the
HFBR-5204 and HFBR-5205
series utilize 1300 nm InGaAsP
LEDs. These LEDs are packaged
in the optical subassembly portion
of the transmitter section. They
are driven by a custom silicon IC
which converts differential PECL
logic signals, ECL referenced
(shifted) to a +5 Volt supply, into
an analog LED drive current.
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QFBR-5204 Datasheet, Funktion
6
(215.0.40)MAX.
39.6
(1.56)
MAX.
1.01
(0.40)
12.7
(0.50)
AREA
RESERVED
FOR
PROCESS
PLUG
29.7
(1.17)
4.7
(0.185)
12.7
(0.50)
0.25
+0.1
-0.05
( )0.010
+0.004
-0.002
25.8 MAX.
(1.02)
10.2 MAX.
(0.40)
SLOT DEPTH 2.2
(0.09)
SLOT WIDTH 2.0 ± 0.1
(0.079 ± 0.004)
14.4
(0.57)
3.3 ± 0.38
(0.130 ± 0.015)
9.8 MAX.
(0.386)
22.0
(0.87)
( )9x
0.46
+0.25
-0.05
0.018
+0.010
-0.002
20.32
(0.800)
15.8 ± 0.15
(0.622 ± 0.006)
( )2x
1.27
+0.25
-0.05
0.050
+0.010
-0.002
23.8 20.32
(0.937) (0.800)
8x 2.54
(0.100)
AREA
RESERVED
FOR
PROCESS
PLUG
20.32
(0.800)
2x
1.3
(0.051)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 2c. Package Outline Drawing with Mezzanine Height and Flush Shield.
1 = VEE
2 = RD
3 = RD
4 = SD
5 = VCC
6 = VCC
7 = TD
8 = TD
9 = VEE
N/C
N/C
TOP VIEW
Figure 3. Pin Out Diagram.
Rx
Tx

6 Page









QFBR-5204 pdf, datenblatt
12
0.8
2x (0.032)
2x
0.8
(0.032)
9.4
(0.374)
6.35
(0.25)
MODULE
PROTRUSION
27.4 ± 0.50
(1.08 ± 0.02)
+ 0.5
10.9 – 0.25
( )+ 0.02
0.43 – 0.01
PCB BOTTOM VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 8b. Dimensions Shown for Mounting Module with Extended Shield to Panel.
Electromagnetic Interference
(EMI)
Most equipment designs utilizing
these high speed transceivers
from Agilent will be required to
meet the requirements of FCC in
the United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan.
These products are suitable for
use in designs ranging from a
desktop computer with a single
transceiver to a concentrator or
switch product with large number
of transceivers.
In all well-designed chassis, the
two 0.5" holes required for ST
connectors to protrude through,
will provide 4.6 dB more
shielding than one 1.2" duplex SC
rectangular cutout. Thus, in a
well-designed chassis, the duplex
ST 1x9 transceiver emissions will
be identical to the duplex SC 1x9
transceiver emissions.

12 Page





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