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PDF STM-2016 Data sheet ( Hoja de datos )
| Número de pieza | STM-2016 | |
| Descripción | 1800 - 2200 MHz High Linearity Silicon Germanium Active Transmit Mixer | |
| Fabricantes | Stanford Microdevices | |
| Logotipo |  |
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Product Description
The Stanford Microdevices’ STM-2016 is a high linearity
active mixer for use in a wide variety of communication
systems covering the 1800-2200 MHz frequency bands.
This device operates from a single 5V supply and provides
9dB of conversion gain while requiring only 0dBm input to
the integrated LO driver. The STM-2016 also includes an
integrated on chip IF amplifier and is fabricated using sili-
con germanium device technology.
The STM-2016 incorporates internal matching on each RF,
IF, and LO port to enhance ease of use and to reduce the
number of external components required. The IF and LO
ports can be driven differential or single ended. Each
broadband port has been designed to minimize perfor-
mance degradation while operating into highly reactive
components such as SAW filters.
Functional Block Diagram
VEE 1
VCC 2
VEE 3
RFN 4
RFP 5
VEE 6
VCC 7
IFN 8
16 VEE
15 VCC
14 VEE
13 LON
12 LOP
11 VEE
10 VCC
9 IFP
Advanced Data Sheet
STM-2016
1800 - 2200 MHz High Linearity
Silicon Germanium
Active Transmit Mixer
16 pin TSSOP with Exposed Pad
Package Body: 0.20 x 0.17 x 0.04 (inches)
5.0 x 4.4 x 1.0 (mm)
Product Features
• Active mixer with conversion gain
• No need for separate external LO driver
• Low LO drive level required to drive mixer
• IF and LO ports may be driven single-ended
• Single supply operation (+5V)
• Broadband resistive 50Ω impedances on all
three ports
Applications
• Digital and spread spectrum communication
systems
• 1800-2200 MHz transceivers for base station
infrastructure equipment
Key Specifications
Parameters
RF Frequency Range
IF Frequency Range
Output IP3
Output P1dB
Conversion Gain
SSB Noise Figure
Test Conditions (VCC=5.0V, I=190mA, T=25ºC)
IF1 = IF2 = -20 dBm/tone
Unit
MHz
MHz
dBm
dBm
dB
dB
Min.
1800
10
Typ.
200
+15
+3.5
9
9
Max.
2200
300
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions.
Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without
notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices
product for use in life-support devices and/or systems.
Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.
522 Almanor Ave., Sunnyvale, CA 94086
Phone: (800) SMI-MMIC
http://www.stanfordmicro.com
1 05/04/01 rev 1.0
1 page  
Advanced Data Sheet
670 0+] 7UDQVPLW 0L[HU
Caution: ESD Sensitive
Appropriate precaution in handling, packaging
and testing devices must be observed.
Part Number Ordering Information
Part Number
Reel Size
Devices/Reel
STM-2016
TBD
TBD
Part Symbolization
The part will be symbolized with a “TBD” marking
designator on the top surface of the package.
Package Dimensions (“16” Package)
NOTE
1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH
PROTRUSIONS OR GATE BURRS
2. TOLERANCE ±0.1 mm UNLESS OTHERWISE SPECIFIED
3. COPLANARITY : 0.1 mm
4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED
INCH DIMENSIONS ARE NOT NECESSARILY EXACT.
5. FOLLOWED FROM JEDEC MO-153
θ
12°(4X)
SYMBOLS
A
A1
A2
b
C
D
D1
E
E1
E2
e
L
y
θ
DIMENSIONS IN MILLIMETERS
MIN NOM MAX
−−− −−− 1.15
0.00 −−− 0.10
0.80 1.00 1.05
0.19 −−− 0.30
0.09 −−− 0.20
4.90 5.00 5.10
−−− 2.80 −−−
−−− 6.40 −−−
4.30 4.40 4.50
−−− 2.80 −−−
−−− 0.65 −−−
0.45 0.60 0.75
−−− −−− 0.10
0° −−− 8°
DIMENSIONS IN INCHES
MIN NOM MAX
−−−
0.000
0.031
0.007
0.004
−−−
−−−
0.039
−−−
−−−
0.045
0.004
0.041
0.012
0.008
0.193
−−−
−−−
0.169
0.197
0.110
0.252
0.173
0.201
−−−
−−−
0.177
−−−
−−−
0.018
−−−
0°
0.110
0.026
0.024
−−−
−−−
−−−
−−−
0.030
0.004
8°
Test PCB Pad Layout
1.25
0.25
0.4
3.0
0.74
0.74
3.0
φ0.33 via
0.7
0.9
6.9
all units are in mm
- Indicates metalization - vias connect pad to underlying ground plane
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions.
Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without
notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices
product for use in life-support devices and/or systems.
Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.
522 Almanor Ave., Sunnyvale, CA 94086
Phone: (800) SMI-MMIC
http://www.stanfordmicro.com
5 05/04/01 rev 1.0
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet STM-2016.PDF ] | |
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