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PDF STK400-490 Data sheet ( Hoja de datos )

Número de pieza STK400-490
Descripción 3ch AF Power Amplifier
Fabricantes Sanyo Semicon Device 
Logotipo Sanyo Semicon Device Logotipo



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No Preview Available ! STK400-490 Hoja de datos, Descripción, Manual

Ordering number:ENN5247
Thick Film Hybrid IC
STK400-490
3ch AF Power Amplifier (Split Power Supply)
(25W + 50W + 25W, THD = 0.4%)
Overview
The STK400-490 is an audio power amplifier IC for multi-
channel speaker applications. It comprises two 25W chan-
nels (left and right) and a 50W channel (center) in a single
package. It is fully pin compatible with the 3-channel out-
put devices (STK400-×00 series) and 2-channel output de-
vices (STK401-×00 series). In addition, it supports 6/3
output load impedance.
Package Dimensions
unit:mm
4086A
[STK400-490]
78.0
70.0
Features
• Pin compatible with the 3-channel output devices
(STK400-×00 series) and 2-channel output devices
(STK401-×00 series)
• Output load impedance RL=6/3supported
• Pin configuration grouped into individual blocks of
inputs, outputs and supply lines to minimize the
adverse effects of pattern layout on operating character-
istics.
• Few external components
3.6
(8.33)
1 22
2.54 0.5
21×2.54=53.34
9.0
2.9
0.4
5.5
SANYO : SIP22
Specifications
Maximum Ratings at Ta = 25˚C
Parameter
Maximum supply voltage
Thermal resistance
Junction temperature
Operating substrate temperature
Storage temperature
Available time for load short-circuit
Channel
L, R
C
L, R
C
L, R
C
Symbol
Conditions
VCC max1
VCC max2
θ j-c1
θ j-c2
Per power transistor
Per power transistor
Tj
Tc
Tstg
ts1 VCC=±25V, RL=6, f=50Hz, PO=25W
ts2 VCC=±32V, RL=6, f=50Hz, PO=50W
Ratings
±36
±47
2.1
1.7
150
125
–30 to +125
1
1
Unit
V
V
˚C/W
˚C/W
˚C
˚C
˚C
s
s
Any and all SANYO products described or contained herein do not have specifications that can handle
applications that require extremely high levels of reliability, such as life-support systems, aircraft’s
control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your SANYO representative nearest you before using
any SANYO products described or contained herein in such applications.
SANYO assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges,or other
parameters) listed in products specifications of any and all SANYO products described or contained
herein.
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
91799TH (KT)/D1295HA (ID) No.5247–1/8

1 page




STK400-490 pdf
STK400-490
Heatsink Design Considerations
The heatsink thermal resistance, θc-a, required to dissipate
the STK400-490 device total power dissipation, Pd, is de-
termined as follows :
Condition 1: IC substrate temperature not to exceed 125°C
Pd (total)×θc-a+Ta<125°C ................................. (1)
Pd (total)=Pd (L)+Pd (R)+Pd (C)
Where Ta is the guaranteed maximum ambient tempera-
ture, Pd (total) is the total power dissipation, Pd (L) is the
left-channel power dissipation, Pd (R) is the right-channel
power dissipation and Pd (C) is the center-channel power
dissipation.
Condition 2: Power transistor junction temperature, Tj, not
to exceed 150°C
Pd (total)×θc-a+[Pd (L)+Pd (R)]/N
×θj-c+Ta<150°C ................................................. (2)
Pd (total)×θc-a+Pd (C)/N
×θj-c+Ta<150°C ................................................ (3)
where N is the left and right-channel number of power tran-
sistors, Nis the center-channel number of power transis-
tors, θj-c is the left and right-channel power transistor ther-
mal resistance per transistor, and θj-cis the center-chan-
nel power transistor thermal resistance per transisttor. Note
that the power dissipated per transistor is the total, Pd,
devided evenly among the N power transistors.
When estimating the power dissipation for an actual audio
signal input, the rule of thumb is to select Pd correspond-
ing to (1/10) × PO max (within safe limits) for a continuous
sine wave input. For example,
Pd (L)+Pd (R)=25W [for (1/10) × PO max=2.5W]
Pd (C)=21.6W [for (1/10) × PO max=5W]
Pd (total)=Pd (L)+Pd (R)+Pd (C)=46.6W
The STK400-490 has 4 left + right-channel power transis-
tors (N), 2 center-channel power transistors (N), left + right-
channel thermal resistance per transistor j-c) is 2.1°C/W,
and center-channel thermal resistance per transistor j-c)
is 1.7°C/W. If the guaranteed maximum ambient tempera-
ture, Ta, is 50°C, then the required heatsink thermal resis-
tance, θc-a, is :
From expression (1):
θc-a < (12550)/46.6
< 1.60
From expression (2):
θc-a < (15050)/46.625×2.1/(46.6×4)
< 1.86
From expression (3):
θc-a < (15050)/46.621.6×1.7/(46.6×2)
< 1.75
Therefore, to satisfy all three expressions, the required
heatsink must have a thermal resistance less than 1.6°C/W.
Expressions (1), (2) and (3) can be rewritten making θc-a Similarly, when STK400-490 VCC (1)=±21V, VCC
the subject.
(2)=±26V and RL=3,
θc-a< (125Ta)/Pd (total) ................................. (1)
θc-a< (150Ta)/Pd (total)[Pd (L)+Pd (R)]
×θj-c/[Pd (total)×N] .......................................... (2)
θc-a< (150Ta)/Pd (total)Pd (C)×
θj-c/[Pd (total)×N] ......................................... (3)
The heatsink required must have a thermal resistance that
simultaneously satisfies all three expressions.
The heatsink thermal resistance can be determined from
(1), (2)and (3)once the following parameters have been
defined.
Supply voltage : VCC
Load resistance : RL
Guaranteed maximum ambient temperature : Ta
The total device power dissipation when STK400-490
VCC (1)=±25V, VCC (2)=±32V and RL=6, for a con-
tinuous sine wave signal, is a maximum of 42.5W
(left+righ channels) and 34.3W (center channel), as
shown in the PdPOcharacteristics graphs.
Pd (L)+Pd (R)=30W [for (1/10) × PO max=2.5W]
Pd (C)=25.5W [for (1/10) × PO max=5W]
Pd (total)=Pd (L)+Pd (R)+Pd (C)=55.5W
From expression (1):
θc-a < (12550)/55.5
< 1.35
From expression (2):
θc-a < (15050)/55.530×2.1/(55.5×4)
< 1.51
From expression (3):
θc-a < (15050)/55.525.5×1.7/(55.5×2)
< 1.41
Therefore, to satisfy all three expressions, the required
heatsink must have a thermal resistance less than 1.35°C/
W.
This heatsink design example is based on a constant-volt-
age supply, and should be verified within your specific set
environment.
No.52475/8

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