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PDF SMLW010 Data sheet ( Hoja de datos )
| Número de pieza | SMLW010 | |
| Descripción | Single-Output Low-Profile Power Modules | |
| Fabricantes | Tyco | |
| Logotipo |  |
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Data Sheet
January 2002
SMLW010 Single-Output Low-Profile
Power Modules: 36 Vdc to 75 Vdc Input; 10 W
The SMLW010 Single-Output, Low-Profile, PCB Mount Power
Modules use advanced, surface-mount technology and
deliver high-quality, compact, dc-dc conversion at an eco-
nomical price.
Applications
■ Communications equipment
■ Computer equipment
■ Distributed power architectures
■ Surface-mount applications
Features
■ Low profile: 8.2 mm x 22.6 mm x 47.8 mm
(0.323 in. x 0.89 in. x 1.88 in.)
■ Wide input voltage range: 36 Vdc to 75 Vdc
■ Input-to-output isolation: 1500 V
■ Operating case temperature range: –40 °C to
+105 °C
■ Overcurrent protection, unlimited duration
■ Positive remote on/off logic
■ Output voltage adjustment: 90% to 110% of VO, nom
■ Output overvoltage protection
■ Undervoltage lockout
■ UL* 60950 Recognized, CSA† C22.2 No. 60950-00
Certified, VDE 0805 (EN60950) Licensed
■ CE mark meets 73/23/EEC and 93/68/EEC
directives‡
■ Within FCC Class A radiated limits
Options
■ Synchronization
Description
The SMLW010 Single-Output, Low-Profile, PCB Mount Power Modules are low-profile, dc-dc converters that
operate over an input voltage range of 36 Vdc to 75 Vdc and provide a precisely regulated output. The output is
isolated from the input, allowing versatile polarity configurations and grounding connections. Built-in filtering for
both input and output minimizes the need for external filtering. These modules are designed and manufactured
to be gull-winged surface-mounted power modules that are reflowed with other surface-mount components in a
typical surface-mount fashion.
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipmentshould
be followed. (The CE mark is placed on selected products.)
1 page  
Data Sheet
January 2002
SMLW010 Single-Output Low-Profile
Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Electrical Specifications (continued)
Table 5. Feature Specifications
Parameter
Device Code
or Suffix
Symbol
Min
Typ Max
Unit
Remote On/Off Signal Interface
(VI = VI, min to VI, max; open collector or
equivalent compatible; signal referenced to
VI(–) terminal. See Figure 4 and Feature
Descriptions.):
Logic Low—Module Off
Logic High—Module On
Module Specifications:
On/Off Current—Logic Low
On/Off Voltage:
Logic Low
Logic High (I on/off = 0 mA)
Open Collector Switch Specifications:
Leakage Current During Logic High
(Von/off = 6 V)
Output Low Voltage During Logic Low
(Ion/off = 1 mA)
Turn-on Delay and Rise Times
(at 80% of IO, max; TA = 25 °C):
Case 1: On/Off Input Is Set for Logic High and
then Input Power Is Applied (Delay from
Point at Which VI = VI, min until VO = 10% of
VO, nom).
Case 2: Input Power Is Applied for at Least
One Second, and then the On/Off Input Is
Set to Logic High (Delay from Point at Which
Von/off = 0.9 V until VO = 10% of VO, nom).
Output Voltage Rise Time (Time for VO to
Rise from 10% of VO, nom to 90% of VO, nom)
Output Voltage Overshoot (at 80% of IO, max;
TA = 25 °C)
Output Voltage Set Point Adjustment Range
Output Overvoltage Protection (clamp)
Undervoltage Lockout
All
All
All
All
All
All
All
All
All
A
G
G
A
All
Ion/off
Von/off
Von/off
Ion/off
Von/off
—
–0.7
—
—
—
—
—
—
—
—
1.0
1.2
6
50
1.2
mA
V
V
µA
V
Tdelay
— 15 60
ms
Tdelay — 4 10
ms
Trise — 2 10 ms
—
——
5
%
Vtrim
Vtrim
90 — 110 %VO, nom
60 — 110 %VO, nom
VO, clamp 3.0 — 5.7
VO, clamp 5.6 — 7.7
V
V
— 20 27 —
V
Tyco Electronics Corp.
5
5 Page 
Data Sheet
January 2002
SMLW010 Single-Output Low-Profile
Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Surface-Mount Power Module Solder Reflow Recommendation (continued)
There are several types of SMT reflow technologies currently used in the industry. These surface-mount power
modules can be adequately soldered using natural convection, IR (radiant infrared), convection/IR, or forced con-
vection technologies. The surface-mount power module solder reflow profile is established by accurately measur-
ing the module gull-wing lead surface temperature.
The maximum oven temperature and conveyor speed should prevent the lead temperature from exceeding the
maximum thermal profile limits as shown in Figure 11. The lead temperature during a typical reflow profile is shown
in Figure 12. Failure to observe these maximum lead temperatures and duration may result in permanent damage
to the power module.
Relative temperatures of the module gull-wing leads vary according to many factors, including surrounding compo-
nents, internal paths, and connecting paths. Typically, pin 1 is a good choice for a conservative measurement since
it is usually connected to heavy paths for current conduction which also tend to heat the lead faster. These vari-
ables make it difficult to compare various types of surface-mount modules; however, the unit has been found to be
more robust during temperature profiles compared with other SMT modules available in the industry.
230˚C MAX
(PEAK)
183 ˚C
150 ˚C
120 ˚C
90 s MAX
6 MINUTES MAX
4 ˚C/s MAX
TIME (s)
Figure 11. Maximum Thermal Profile Limits
250
200
150
100
50
Tyco Electronics Corp.
MELTING POINT
(60/40 SOLDER)
2:30
5:00
TIME (min.)
7:30
10:00
Figure 12. Typical Reflow Soldering Profile
8-2275
8-2274a
11
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