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Teilenummer | MOC256 |
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Beschreibung | AC INPUT PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLERS | |
Hersteller | Fairchild Semiconductor | |
Logo | ||
Gesamt 7 Seiten AC INPUT PHOTOTRANSISTOR
SMALL OUTLINE SURFACE MOUNT
OPTOCOUPLERS
MOC256-M
DESCRIPTION
The MOC256-M is an AC input phototransistor optocoupler. The device consists of two infra-
red emitters connected in anti-parallel and coupled to a silicon NPN phototransistor detector.
It is designed for applications requiring the detection or monitoring of AC signals. The device
is constructed with a standard SOIC-8 footprint.
FEATURES
• UL Recognized File (#E90700, Volume 2)
• VDE recognized (File #136616)
- Ordering option V (i.e. MOC256V-M)
• Industry Standard SOIC-8 Surface Mountable Package, with 0.050" lead spacing
• Available in Tape and Reel Option
• Bidirectional AC Input (Protection Against Reversed DC Bias)
• Guaranteed CTR Symmetry of 2:1 Maximum
• High Input-Output Isolation of 2500 Vac (rms) Guaranteed
AC IN 1
AC IN 2
N/C 3
N/C 4
8 N/C
7 BASE
6 COLLECTOR
5 EMITTER
ABSOLUTE MAXIMUM RATINGS (TA = 25°C Unless otherwise specified)
Rating
Symbol
Value
EMITTER
Forward Current - Continuous
Forward Current - Peak (PW = 100 µs, 120 pps)
LED Power Dissipation @ TA = 25°C
Derate above 25°C
DETECTOR
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current-Continuous
Detector Power Dissipation @ TA = 25°C
Derate above 25°C
TOTAL DEVICE
Input-Output Isolation Voltage
(f = 60 Hz, t = 1 min.)
Total Device Power Dissipation @ TA = 25°C
Derate above 25°C
Ambient Operating Temperature Range
Storage Temperature Range
IF
IF (pk)
PD
VCEO
VECO
IC
PD
VISO
PD
TA
Tstg
60
1.0
90
0.8
30
7.0
150
150
1.76
2500
250
2.94
-40 to +100
-40 to +150
Unit
mA
A
mW
mW/°C
V
V
mA
mW
mW/°C
Vac(rms)
mW
mW/°C
°C
°C
© 2003 Fairchild Semiconductor Corporation
Page 1 of 7
4/10/03
Carrier Tape Specifications
3.50 ± 0.20
0.30 MAX
8.3 ± 0.10
AC INPUT PHOTOTRANSISTOR
SMALL OUTLINE SURFACE MOUNT
OPTOCOUPLERS
MOC256-M
8.0 ± 0.10
2.0 ± 0.05
4.0 ± 0.10
Ø1.5 MIN
1.75 ± 0.10
5.5 ± 0.05
5.20 ± 0.20
12.0 ± 0.3
0.1 MAX
6.40 ± 0.20
User Direction of Feed
Ø1.5 ± 0.1/-0
Reflow Profile
300 230°C, 10–30 s
250 245°C peak
200
150
Time above 183°C, 120–180 sec
100
50 Ramp up = 2–10°C/sec
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
Time (Minute)
• Peak reflow temperature: 245°C (package surface temperature)
• Time of temperature higher than 183°C for 120–180 seconds
• One time soldering reflow is recommended
© 2003 Fairchild Semiconductor Corporation
Page 6 of 7
4/10/03
6 Page | ||
Seiten | Gesamt 7 Seiten | |
PDF Download | [ MOC256 Schematic.PDF ] |
Teilenummer | Beschreibung | Hersteller |
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