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Teilenummer | 74LVT16374 |
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Beschreibung | Low Voltage 16-Bit D-Type Flip-Flop with 3-STATE Outputs | |
Hersteller | Fairchild Semiconductor | |
Logo | ||
Gesamt 8 Seiten January 1999
Revised June 2005
74LVT16374 • 74LVTH16374
Low Voltage 16-Bit D-Type Flip-Flop
with 3-STATE Outputs
General Description
The LVT16374 and LVTH16374 contain sixteen non-invert-
ing D-type flip-flops with 3-STATE outputs and is intended
for bus oriented applications. The device is byte controlled.
A buffered clock (CP) and Output Enable (OE) are com-
mon to each byte and can be shorted together for full 16-bit
operation.
The LVTH16374 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These flip-flops are designed for low-voltage (3.3V) VCC
applications, but with the capability to provide a TTL inter-
face to a 5V environment. The LVT16374 and LVTH16374
are fabricated with an advanced BiCMOS technology to
achieve high speed operation similar to 5V ABT while
maintaining a low power dissipation.
Features
s Input and output interface capability to systems at
5V VCC
s Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH16374),
also available without bushold feature (74LVT16374)
s Live insertion/extraction permitted
s Power Up/Power Down high impedance provides
glitch-free bus loading
s Outputs source/sink 32 mA/64 mA
s Functionally compatible with the 74 series 16374
s Latch-up performance exceeds 500 mA
s ESD performance:
Human-body model ! 2000V
Machine model ! 200V
Charged-device model ! 1000V
s Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Ordering Code:
Order Number Package Number
Package Description
74LVT16374G
(Note 1)(Note 2)
BGA54A
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
(Preliminary)
74LVT16374MEA
(Note 2)
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVT16374MTD
(Note 2)
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
74LVTH16374G
(Note 1)(Note 2)
BGA54A
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LVTH16374MEA
(Note 2)
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVTH16374MTD
(Note 2)
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 1: Ordering code “G” indicates Trays.
Note 2: Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbol
© 2005 Fairchild Semiconductor Corporation DS012022
www.fairchildsemi.com
Physical Dimensions inches (millimeters) unless otherwise noted
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
Package Number BGA54A
www.fairchildsemi.com
6
6 Page | ||
Seiten | Gesamt 8 Seiten | |
PDF Download | [ 74LVT16374 Schematic.PDF ] |
Teilenummer | Beschreibung | Hersteller |
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