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Teilenummer | SO14 |
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Beschreibung | SO 14 | |
Hersteller | ST Microelectronics | |
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Gesamt 2 Seiten ® Thermal Data
SO 14
14 leads
item #
PACKAGE MATERIAL LIST
material
thickness
leadframe
die attach
molding
compound
copper
epoxy glue
( silver filler )
epoxy resin
0.20 mm
10-40 µm
1.65 mm
thermal
conductivity
2.61 W/cm°C
0.01 W/cm°C
0.0063W/cm°C
Charts enclosed :
1) Rth(j-a) vs power dissipation
2) Zth(j-a) vs time width and die size
February 1998
1/2
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Seiten | Gesamt 2 Seiten | |
PDF Download | [ SO14 Schematic.PDF ] |
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