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SQ3960F Schematic ( PDF Datasheet ) - Semicoa Semiconductor

Teilenummer SQ3960F
Beschreibung Chip Type 2C3960 Geometry 0003 Polarity NPN
Hersteller Semicoa Semiconductor
Logo Semicoa Semiconductor Logo 




Gesamt 1 Seiten
SQ3960F Datasheet, Funktion
Chip Type 2C3960
Geometry 0003
Polarity NPN
Data Sheet No. 2C3960
Generic Packaged Part:
2N3960
Chip type 2C3960 by Semicoa Semi-
conductors provides performance
similar to these devices.
Part Numbers:
2N3960, 2N3960UB, SD3960F, SQ3960,
SQ3960F
Product Summary:
APPLICATIONS:
Designed for high-speed current-mode
logic switching.
Features:
Metallization
Bonding Pad Size
Die Thickness
Chip Area
Top Surface
Mechanical Specifications
Top Al - 15 kÅ min.
Backside
Au - 6.5 kÅ nom.
Emitter
2.7 mils x 2.7 mils
Base
2.7 mils x 2.7 mils
8 mils nominal
16 mils x 16 mils
Silox Passivated
Electrical Characteristics
TA = 25oC
Parameter
Test conditions
Min Max
Unit
BVCEO
IC = 10.0 mA
12 ---
V dc
BVCBO
IC = 10 µA
20 ---
V dc
BVEBO
IE = 10.0 mA
4.5 ---
V dc
ICEX
VCE = 10 V, VEB = 2.0 V
--- 5.0
nA
hFE1
IC = 1.0 mA dc, VCE = 1.0 V
25
---
---
hFE2
IC = 10 mA dc, VCE = 1.0 V 40 400
---
hFE3
IC = 30 mA dc, VCE = 1.0 V
25
---
---
VCE(sat)
IC = 30 mA dc, IB = 3.0 mA
---
0.3
V dc
Due to limitations of probe testing, only dc parameters are tested. This must be done with pulse width less
than 300 µs, duty cycle less than 2%.





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