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PDF MMQA20VT1 Data sheet ( Hoja de datos )
| Número de pieza | MMQA20VT1 | |
| Descripción | SC-59 QUAD TRANSIENT VOLTAGE SUPPRESSOR 5.6 VOLTS | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MMQA5V6T1/D
5.6 Volt SCĆ59 Quad Monolithic
Common Anode
Transient Voltage Suppressor
for ESD Protection
This quad monolithic silicon voltage suppressor is designed for applications
requiring transient overvoltage protection capability. It is intended for use in
voltage and ESD sensitive equipment such as computers, printers, business
machines, communication systems, medical equipment, and other applica-
tions. Its quad junction common anode design protects four separate lines
using only one package. These devices are ideal for situations where board
space is at a premium.
Specification Features:
• SC-59 Package Allows Four Separate Unidirectional Configurations
• Peak Power — 24 Watts @ 1.0 ms (Unidirectional), per Figure 7 Waveform
• Maximum Clamping Voltage @ Peak Pulse Current
• Low Leakage < 2.0 µA
• ESD Rating of Class N (exceeding 16 kV) per the Human Body Model
Mechanical Characteristics:
• Void Free, Transfer-Molded, Thermosetting Plastic Case
• Corrosion Resistant Finish, Easily Solderable
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• Available in 8 mm Tape and Reel
Use the Device Number to order the 7 inch/3,000 unit reel. Replace
with “T3” in the Device Number to order the 13 inch/10,000 unit reel.
THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Peak Power Dissipation @ 1.0 ms (1)
@ TA ≤ 25°C
Total Power Dissipation on FR-5 Board (2) @ TA = 25°C
Derate above 25°C
Ppk
°PD°
Thermal Resistance Junction to Ambient
Total Power Dissipation on Alumina Substrate (3) @ TA = 25°C
Derate above 25°C
RθJA
°PD°
Thermal Resistance Junction to Ambient
RθJA
Junction and Storage Temperature Range
TJ
Tstg
Lead Solder Temperature — Maximum (10 Second Duration)
1. Non-repetitive current pulse per Figure 7 and derate above TA = 25°C per Figure 8.
2. FR-5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
4. Other voltages are available
TL
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
MMQA5V6T1
MMQA20VT1
Motorola Preferred Devices
SC-59 QUAD
TRANSIENT VOLTAGE
SUPPRESSOR
5.6 VOLTS (4)
24 WATTS PEAK POWER
65
4
12
3
CASE 318F-01
STYLE 1
SC-59 PLASTIC
1
32
45
6
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
Value
24
°225
1.8
556
°300
2.4
417
°– 55 to +150°
260
Unit
Watts
°mW°
mW/°C
°C/W
°mW
mW/°C
°C/W
°C
°C
Rev 3
©MMMotQoroAla5,VIn6c.T1199M6 MQA20VT1
MOTOROLA
1
1 page  
INFORMATION FOR USING THE SC-59 6 LEAD SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
pad geometry, the packages will self-align when subjected to
a solder reflow process.
0.094
2.4
0.037
0.95
0.074
1.9
0.037
0.95
0.039
1.0
SC-59 6 LEAD
0.028
0.7
inches
mm
SC-59 6 LEAD POWER DISSIPATION
The power dissipation of the SC-59 6 Lead is a function of
the pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined
by TJ(max), the maximum rated junction temperature of the
die, RθJA, the thermal resistance from the device junction to
ambient, and the operating temperature, TA. Using the
values provided on the data sheet for the SC-59 6 Lead
package, PD can be calculated as follows:
PD =
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this
case is 225 milliwatts.
PD = 150°C – 25°C = 225 milliwatts
556°C/W
The 556°C/W for the SC-59 6 Lead package assumes the
use of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 225 milliwatts.
There are other alternatives to achieving higher power
dissipation from the SC-59 6 Lead package. Another alterna-
tive would be to use a ceramic substrate or an aluminum
core board such as Thermal Clad™. Using a board material
such as Thermal Clad, an aluminum core board, the power
dissipation can be doubled using the same footprint.
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads.
Solder stencils are used to screen the optimum amount.
These stencils are typically 0.008 inches thick and may be
made of brass or stainless steel. For packages such as the
SC-59, SC-59 6 Lead, SC-70/SOT-323, SOD-123, SOT-23,
SOT-143, SOT-223, SO-8, SO-14, SO-16, and SMB/SMC
diode packages, the stencil opening should be the same as
the pad size or a 1:1 registration.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to mini-
mize the thermal stress to which the devices are subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
MMQA5V6T1 MMQA20VT1
MOTOROLA
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet MMQA20VT1.PDF ] | |
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