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PDF MMBD1005LT1 Data sheet ( Hoja de datos )

Número de pieza MMBD1005LT1
Descripción Switching Diode
Fabricantes Motorola Semiconductors 
Logotipo Motorola Semiconductors Logotipo



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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Switching Diode
Part of the GreenLinePortfolio of devices with energy–conserving traits.
This switching diode has the following features:
Very Low Leakage (500 pA) promotes extended battery life by decreas-
ing energy waste. Guaranteed leakage limit is for each diode in the pair
contingent upon the other diode being in a non–forward–biased condition.
Offered in four Surface Mount package types
Available in 8 mm Tape and Reel in quantities of 3,000
Applications
ESD Protection
Reverse Polarity Protection
Steering Logic
Medium–Speed Switching
ANODE
3
CATHODE
1
2
CATHODE
Order this document
by MMBD1005LT1/D
MMBD1005LT1
MMBD2005T1
MMBD3005T1
Motorola Preferred Devices
MMBD1005LT1
3
1
2
CASE 318-07, STYLE 12
SOT-23 (TO-236AB)
MAXIMUM RATINGS
Rating
Symbol
Value
Continuous Reverse Voltage
Peak Forward Current
Peak Forward Surge Current
DEVICE MARKING
VR
IF
IFM
(surge)
30
200
500
MMBD1005LT1 = A3
MMBD2005T1 = DI
MMBD3005T1 = XQ
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR-4 Board (1)
TA = 25°C
MMBD1005LT1, MMBD3005T1
MMBD2005T1
Derate above 25°C MMBD1005LT1, MMBD3005T1
MMBD2005T1
Symbol
PD
Max
225
150
1.8
1.2
Thermal Resistance Junction to Ambient
MMBD1005LT1, MMBD3005T1
MMBD2005T1
RθJA
556
833
Junction and Storage Temperature
TJ, Tstg – 55 to +150
(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum
recommended footprint.
GreenLine is a trademark of Motorola, Inc.
Thermal Clad is a registered trademark of the Berquist Company.
Preferred devices are Motorola recommended choices for future use and best overall value.
Unit
Vdc
mAdc
mA
Unit
mW
mW/°C
°C/W
°C
MMBD2005T1
1
2
3
CASE 419-02, STYLE 4
SC–70/SOT–323
MMBD3005T1
2
1
3
CASE 318D-03, STYLE 5
SC–59
©MMotootorroollaa, SInmc. 1a9ll95Signal Transistors, FETs and Diodes Device Data
1

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MMBD1005LT1 pdf
MMBD1005LT1 MMBD2005T1 MMBD3005T1
200°C
150°C
100°C
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK”
STEP 3
HEATING
ZONES 2 & 5
“RAMP”
STEP 4
STEP 5
HEATING HEATING
ZONES 3 & 6 ZONES 4 & 7
“SOAK”
“SPIKE”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
170°C
150°C
STEP 6 STEP 7
VENT COOLING
205° TO
219°C
PEAK AT
SOLDER
JOINT
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 2. Typical Solder Heating Profile
Motorola Small–Signal Transistors, FETs and Diodes Device Data
5

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