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PDF MM74HC273N Data sheet ( Hoja de datos )

Número de pieza MM74HC273N
Descripción Octal D-Type Flip-Flops with Clear
Fabricantes Fairchild 
Logotipo Fairchild Logotipo



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No Preview Available ! MM74HC273N Hoja de datos, Descripción, Manual

September 1983
Revised February 1999
MM74HC273
Octal D-Type Flip-Flops with Clear
General Description
The MM74HC273 edge triggered flip-flops utilize advanced
silicon-gate CMOS technology to implement D-type flip-
flops. They possess high noise immunity, low power, and
speeds comparable to low power Schottky TTL circuits.
This device contains 8 master-slave flip-flops with a com-
mon clock and common clear. Data on the D input having
the specified setup and hold times is transferred to the Q
output on the LOW-to-HIGH transition of the CLOCK input.
The CLEAR input when LOW, sets all outputs to a low
state.
Each output can drive 10 low power Schottky TTL equiva-
lent loads. The MM74HC273 is functionally as well as pin
compatible to the 74LS273. All inputs are protected from
damage due to static discharge by diodes to VCC and
ground.
Features
s Typical propagation delay: 18 ns
s Wide operating voltage range
s Low input current: 1 µA maximum
s Low quiescent current: 80 µA (74 Series)
s Output drive: 10 LS-TTL loads
Ordering Code:
Order Number Package Number
Package Description
MM74HC273M
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-153, 0.300” Wide
MM74HC273SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC273MTC
MTC20
20-Lead thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MM74HC273N
N20A
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagram
Pin Assignments for DIP, SOIC, SOP and TSSOP
Top View
© 1999 Fairchild Semiconductor Corporation DS005331.prf
www.fairchildsemi.com

1 page




MM74HC273N pdf
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide
Package Number M20B
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
5 www.fairchildsemi.com

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