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PDF MJD3055 Data sheet ( Hoja de datos )
| Número de pieza | MJD3055 | |
| Descripción | Complementary Power Transistors | |
| Fabricantes | ON | |
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MJD2955 (PNP)
MJD3055 (NPN)
Complementary Power
Transistors
DPAK For Surface Mount Applications
Designed for general purpose amplifier and low speed switching
applications.
Features
• Lead Formed for Surface Mount Applications in Plastic Sleeves
(No Suffix)
• Straight Lead Version in Plastic Sleeves (“−1” Suffix)
• Electrically Similar to MJE2955 and MJE3055
• DC Current Gain Specified to 10 Amperes
• High Current Gain−Bandwidth Product − fT = 2.0 MHz (Min) @ IC
= 500 mAdc
• Epoxy Meets UL 94 V−0 @ 0.125 in
• ESD Ratings: Human Body Model, 3B u 8000 V
Machine Model, C u 400 V
• Pb−Free Packages are Available
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector Current
Base Current
Total Power Dissipation @ TC = 25°C
Derate above 25°C
Total Power Dissipation (Note1)
@ TA = 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
VCEO
VCB
VEB
IC
IB
PD{
PD
TJ, Tstg
60 Vdc
70 Vdc
5 Vdc
10 Adc
6 Adc
20 W
0.16 W/°C
1.75
0.014
W
W/°C
−55 to +150 °C
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction−to−Case
RqJC
6.25 °C/W
Thermal Resistance, Junction−to−Ambient RqJA
(Note1)
71.4 °C/W
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
†Safe Area Curves are indicated by Figure 1. Both limits are applicable and must
be observed.
1. These ratings are applicable when surface mounted on the minimum pad
sizes recommended.
http://onsemi.com
SILICON
POWER TRANSISTORS
10 AMPERES
60 VOLTS, 20 WATTS
12
3
4
DPAK
CASE 369C
STYLE 1
MARKING
DIAGRAMS
YWW
J
xx55G
4
1
2
3
DPAK−3
CASE 369D
STYLE 1
YWW
J
xx55G
Y = Year
WW = Work Week
Jxx55 = Device Code
x = 29 or 30
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
January, 2006 − Rev. 8
1
Publication Order Number:
MJD2955/D
1 page  
MJD2955 (PNP) MJD3055 (NPN)
PACKAGE DIMENSIONS
DPAK
CASE 369C−01
ISSUE O
B
VR
−T−
SEATING
PLANE
C
E
S
F
4
1 23
A
K
J
LH
D 2 PL
G 0.13 (0.005) M T
U
Z
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.235 0.245
B 0.250 0.265
C 0.086 0.094
D 0.027 0.035
E 0.018 0.023
F 0.037 0.045
G 0.180 BSC
H 0.034 0.040
J 0.018 0.023
K 0.102 0.114
L 0.090 BSC
R 0.180 0.215
S 0.025 0.040
U 0.020 −−−
V 0.035 0.050
Z 0.155 −−−
MILLIMETERS
MIN MAX
5.97 6.22
6.35 6.73
2.19 2.38
0.69 0.88
0.46 0.58
0.94 1.14
4.58 BSC
0.87 1.01
0.46 0.58
2.60 2.89
2.29 BSC
4.57 5.45
0.63 1.01
0.51 −−−
0.89 1.27
3.93 −−−
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.101
3.0
0.118
5.80
0.228
1.6 6.172
0.063 0.243
ǒ ǓSCALE 3:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet MJD3055.PDF ] | |
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