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What is MCP3008?

This electronic component, produced by the manufacturer "Microchip Technology", performs the same function as "2.7V 4-Channel/8-Channel 10-Bit A/D Converters".


MCP3008 Datasheet PDF - Microchip Technology

Part Number MCP3008
Description 2.7V 4-Channel/8-Channel 10-Bit A/D Converters
Manufacturers Microchip Technology 
Logo Microchip Technology Logo 


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MCP3004/3008
2.7V 4-Channel/8-Channel 10-Bit A/D Converters
with SPI Serial Interface
Features
• 10-bit resolution
• ± 1 LSB max DNL
• ± 1 LSB max INL
• 4 (MCP3004) or 8 (MCP3008) input channels
• Analog inputs programmable as single-ended or
pseudo-differential pairs
• On-chip sample and hold
• SPI serial interface (modes 0,0 and 1,1)
• Single supply operation: 2.7V - 5.5V
• 200 ksps max. sampling rate at VDD = 5V
• 75 ksps max. sampling rate at VDD = 2.7V
• Low power CMOS technology
• 5 nA typical standby current, 2 µA max.
• 500 µA max. active current at 5V
• Industrial temp range: -40°C to +85°C
• Available in PDIP, SOIC and TSSOP packages
Applications
• Sensor Interface
• Process Control
• Data Acquisition
• Battery Operated Systems
Functional Block Diagram
VREF
VDD VSS
CH0
CH1
CH7*
Input
Channel
Max
Sample
and
Hold
DAC
Comparator
10-Bit SAR
Control Logic
Shift
Register
CS/SHDN DIN CLK
DOUT
* Note: Channels 4-7 are available on MCP3008 Only
Description
The Microchip Technology Inc. MCP3004/3008
devices are successive approximation 10-bit Analog-
to-Digital (A/D) converters with on-board sample and
hold circuitry. The MCP3004 is programmable to
provide two pseudo-differential input pairs or four
single-ended inputs. The MCP3008 is programmable
to provide four pseudo-differential input pairs or eight
single-ended inputs. Differential Nonlinearity (DNL)
and Integral Nonlinearity (INL) are specified at ±1 LSB.
Communication with the devices is accomplished using
a simple serial interface compatible with the SPI
protocol. The devices are capable of conversion rates
of up to 200 ksps. The MCP3004/3008 devices operate
over a broad voltage range (2.7V - 5.5V). Low-current
design permits operation with typical standby currents
of only 5 nA and typical active currents of 320 µA. The
MCP3004 is offered in 14-pin PDIP, 150 mil SOIC and
TSSOP packages, while the MCP3008 is offered in 16-
pin PDIP and SOIC packages.
Package Types
PDIP, SOIC, TSSOP
CH0
CH1
CH2
CH3
NC
NC
DGND
1
2
3
4
5
6
7
14 VDD
13 VREF
12 AGND
11 CLK
10 DOUT
9 DIN
8 CS/SHDN
PDIP, SOIC
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
1
2
3
4
5
6
7
8
16 VDD
15 VREF
14 AGND
13 CLK
12 DOUT
11 DIN
10 CS/SHDN
9 DGND
© 2008 Microchip Technology Inc.
DS21295D-page 1

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MCP3008 equivalent
MCP3004/3008
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise noted, all parameters apply at VDD = 5V, VREF = 5V,
TA = -40°C to +85°C, fSAMPLE = 200 ksps and fCLK = 18*fSAMPLE. Unless otherwise noted, typical values apply for
VDD = 5V, TA = +25°C.
Parameter
Sym
Min
Typ
Max Units
Conditions
Power Requirements
Operating Voltage
VDD 2.7
5.5
V
Operating Current
IDD — 425 550 µA VDD = VREF = 5V,
225 DOUT unloaded
VDD = VREF = 2.7V,
DOUT unloaded
Standby Current
IDDS
— 0.005
2
µA CS = VDD = 5.0V
Note 1: This parameter is established by characterization and not 100% tested.
2: See graphs that relate linearity performance to VREF levels.
3: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures. See Section 6.2 “Maintaining Minimum Clock
Speed”, “Maintaining Minimum Clock Speed”, for more information.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS = GND.
Parameters
Sym Min Typ Max Units
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, 14L-PDIP
Thermal Resistance, 14L-SOIC
Thermal Resistance, 14L-TSSOP
Thermal Resistance, 16L-PDIP
Thermal Resistance, 16L-SOIC
TA -40 — +85 °C
TA -40 — +85 °C
TA -65 — +150 °C
θJA — 70 — °C/W
θJA — 108 — °C/W
θJA — 100 — °C/W
θJA — 70 — °C/W
θJA — 90 — °C/W
Conditions
TCSH
CS
CLK
DIN
DOUT
TSUCS
TSU THD
MSB IN
THI TLO
TEN
TDO
NULL BIT
TR
MSB OUT
TF TDIS
LSB
FIGURE 1-1:
Serial Interface Timing.
© 2008 Microchip Technology Inc.
DS21295D-page 5


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