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74VHC125 Schematic ( PDF Datasheet ) - Fairchild Semiconductor

Teilenummer 74VHC125
Beschreibung Quad Buffer with 3-STATE Outputs
Hersteller Fairchild Semiconductor
Logo Fairchild Semiconductor Logo 




Gesamt 9 Seiten
74VHC125 Datasheet, Funktion
74VHC125
Quad Buffer with 3-STATE Outputs
December 2007
Features
High Speed: tPD = 3.8ns (Typ.) at VCC = 5V
Lower power dissipation: ICC = 4 µA (Max.) at
TA = 25°C
High noise immunity: VNIH = VNIL = 28% VCC (Min.)
Power down protection is provided on all inputs
Low noise: VOLP = 0.8V (Max.)
Pin and function compatible with 74HC125
General Description
The VHC125 contains four independent non-inverting
buffers with 3-STATE outputs. It is an advanced high-
speed CMOS device fabricated with silicon gate CMOS
technology and achieves the high-speed operation simi-
lar to equivalent Bipolar Schottky TTL while maintaining
the CMOS low power dissipation.
An input protection circuit insures that 0V to 7V can be
applied to the input pins without regard to the supply
voltage. This device can be used to interface 5V to 3V
systems and two supply systems such as battery
backup. This circuit prevents device destruction due to
mismatched supply and input voltages.
Ordering Information
Order Number
74VHC125M
74VHC125SJ
74VHC125MTC
Package
Number
M14A
M14D
MTC14
Package Description
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150"
Narrow
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
©1993 Fairchild Semiconductor Corporation
74VHC125 Rev. 1.4.0
www.fairchildsemi.com






74VHC125 Datasheet, Funktion
Physical Dimensions
8.75
8.50
7.62
14
6.00
A
8
B
4.00
3.80
0.65
5.60
PIN ONE
INDICATOR
1
1.27
(0.33)
7
0.51
0.35
1.70 1.27
LAND PATTERN RECOMMENDATION
0.25 M C B A
1.75 MAX
1.50
1.25
R0.10
R0.10
8°
0°
SEE DETAIL A
0.25
0.10 C
0.10 C
0.25
0.19
NOTES: UNLESS OTHERWISE SPECIFIED
0.50
0.25
A) THIS PACKAGE CONFORMS TO JEDEC
X 45°
MS-012, VARIATION AB, ISSUE C,
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
GAGE PLANE FLASH OR BURRS.
D) LANDPATTERN STANDARD:
0.36
SOIC127P600X145-14M
E) DRAWING CONFORMS TO ASME Y14.5M-1994
F) DRAWING FILE NAME: M14AREV13
0.90
0.50
(1.04)
SEATING PLANE
DETAIL A
SCALE: 20:1
Figure 1. 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1993 Fairchild Semiconductor Corporation
74VHC125 Rev. 1.4.0
6
www.fairchildsemi.com

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