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PDF 74LVQ374 Data sheet ( Hoja de datos )
| Número de pieza | 74LVQ374 | |
| Descripción | Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs | |
| Fabricantes | Fairchild Semiconductor | |
| Logotipo |  |
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May 1998
74LVQ374
Low Voltage Octal D-Type Flip-Flop with 3-STATE
Outputs
General Description
The LVQ374 is a high-speed, low-power octal D-type flip-flop
featuring separate D-type inputs for each flip-flop and
3-STATE outputs for bus-oriented applications. A buffered
Clock (CP) and Output Enable (OE) are common to all
flip-flops.
Features
n Ideal for low power/low noise 3.3V applications
n Implements patented EMI reduction circuitry
n Available in SOIC JEDEC, SOIC EIAJ and QSOP
packages
n Guaranteed simultaneous switching noise level and
dynamic threshold performance
n Improved latch-up immunity
n Guaranteed incident wave switching into 75Ω
n 4 kV minimum ESD immunity
n Buffered positive edge-triggered clock
n 3-STATE outputs drive bus lines or buffer memory
address registers
Ordering Code:
Order Number
74LVQ374SC
74LVQ374SJ
74LVQ374QSC
Package Number
M20B
M20D
MQA20
Package Description
20-Lead (0.300" Wide) Molded Small Outline Package, SOIC JEDEC
20-Lead Molded Shrink Small Outline Package, SOIC EIAJ
20-Lead (0.150" Wide) Molded Shrink Small Outline Package, SOIC JEDEC
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbols
Connection Diagram
Pin Assignment for
SOIC and QSOP
IEEE/IEC
DS011360-1
DS011360-3
DS011360-2
© 1998 Fairchild Semiconductor Corporation DS011360
www.fairchildsemi.com
1 page  
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead (0.300" Wide) Molded Small Outline Package, SOIC JEDEC
Package Number M20B
20-Lead Molded Shrink Small Outline Package, SOIC EIAJ
Package Number M20D
5
www.fairchildsemi.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet 74LVQ374.PDF ] | |
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