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PDF MHPM7A5S120DC3 Data sheet ( Hoja de datos )

Número de pieza MHPM7A5S120DC3
Descripción Hybrid Power Module
Fabricantes Motorola Semiconductors 
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Product Preview
Hybrid Power Module
Integrated Power Stage for 1.0 hp
460 VAC Motor Drive
This module integrates a 3–phase inverter, 3–phase rectifier,
brake, and temperature sense in a single convenient package. It is
designed for 1.0 hp general purpose 3–phase induction motor drive
applications. The inverter incorporates advanced insulated gate
bipolar transistors (IGBT) matched with fast soft free–wheeling
diodes to give optimum performance. The solderable top connector
pins are designed for easy interfacing to the user’s control board.
Short Circuit Rated 10 µs @ 125°C, 720 V
Pin-to-Baseplate Isolation Exceeds 2500 Vac (rms)
Compact Package Outline
Access to Positive and Negative DC Bus
Independent Brake Circuit Connections
UL Recognition Pending
Device
PHPM7A5S120DC3
ORDERING INFORMATION
Voltage
Rating
Current
Rating
1200
5.0
Equivalent
Horsepower
1.0
Order this document
by MHPM7A5S120DC3/D
MHPM7A5S120DC3
Motorola Preferred Device
5.0 AMP, 1200 VOLT
HYBRID POWER MODULE
CASE 464D–01
ISSUE O
MAXIMUM DEVICE RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Repetitive Peak Input Rectifier Reverse Voltage (TJ = 25°C to 150°C)
Non–Repetitive Peak Input Rectifier Reverse Voltage (1)
(TJ = 25°C to 150°C)
VRRM
VRSM
900
1600
IGBT Reverse Voltage
Gate-Emitter Voltage
Continuous IGBT Collector Current (TC = 25°C)
Repetitive Peak IGBT Collector Current (2)
Continuous Free–Wheeling Diode Current (TC = 80°C)
Repetitive Peak Free–Wheeling Diode Current (2)
Average Converter Output Current (Peak–to–Average ratio of 10, TC = 95°C)
IGBT Power Dissipation per die (TC = 95°C)
Free–Wheeling Diode Power Dissipation per die (TC = 95°C)
Junction Temperature Range
Short Circuit Duration (VCE = 720 V, TJ = 125°C)
Isolation Voltage, pin to baseplate
Operating Case Temperature Range
Storage Temperature Range
Mounting Torque — Heat Sink Mounting Holes
VCES
VGES
ICmax
IC(pk)
IF80
IF(pk)
IOmax
PD
PD
TJ
tsc
VISO
TC
Tstg
1200
± 20
5.0
10
5.0
10
16
19
8.0
– 40 to +150
10
2500
– 40 to +95
– 40 to +150
12
(1) Half–Sine 60 Hz, maximum reverse voltage capability decreases by 0.1% per °C at lower temperature
(2) 1.0 ms = 1.0% duty cycle
Preferred devices are Motorola recommended choices for future use and best overall value.
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Unit
V
V
V
V
A
A
A
A
A
W
W
°C
ms
Vac
°C
°C
lb–in
©MMoottoorroollaa, IInGc.B1T998Device Data
1

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MHPM7A5S120DC3 pdf
0.175
0.585
0.250
0.450
0.925
0.270
0.066
MHPM7A5S120DC3
KEEP–OUT ZONES (x4)
1.850
0.140
NON–PLATED
THRU–HOLE
PLATED THRU–HOLES (x24)
OPTIONAL NON–PLATED
THRU–HOLES FOR ACCESS
TO HEAT SINK MOUNTING
SCREWS (x2)
NOTES:
1. Package is symmetrical, except for a polarizing plastic post near pin 1,
indicated by a non–plated thru–hole in the footprint.
2. Dimension of plated thru–holes indicates finished hole size after plating.
3. Access holes for mounting screws may or may not be necessary depending on
assembly plan for finished product.
Figure 9. Package Footprint (Dimensions in Inches)
Motorola IGBT Device Data
5

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