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PDF MH16S72DCFA-6 Data sheet ( Hoja de datos )

Número de pieza MH16S72DCFA-6
Descripción 1 /207 /959 /552-BIT ( 16 /777 /216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Fabricantes Mitsubishi 
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Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72DCFA-6
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
DESCRIPTION
The MH16S72DCFA is 16777216 - word x 72-bit Sy nchronous
DRAM module. This consist of eighteen industry standard
16M x 4 Sy nchronous DRAMs in TSOP.
The TSOP on a card edge dual in-line package prov ides any
application where high densities and large of quantities memory
are required.
This is a socket-ty pe memory module ,suitable f or easy
interchange or addition of module.
FEATURES
Type name
Max.
Frequency
Access Time from CLK
[component level]
MH16S72DCFA-6
133MHz
5.4ns
(CL = 4 at Latch mode)
Utilizes industry standard 16M X 4 Synchronous DRAMs in
TSOP package , industrystandard Resistered buffer in TSSOP
package,industrystandard PLL in TSSOP package
Single 3.3V +/- 0.3V supply
Max.Clock frequency 133MHz
Fullysynchronous operation referenced to clock rising edge
4-bank operation controlled byBA0,BA1(Bank Address)
/CAS latency-2/3(programmable,at buffer mode)
LVTTL Interface
Burst length 1/2/4/8/Full Page(programmable)
Burst type- Sequential and interleave burst (programmable)
Random column access
Burst W rite / Single W rite(programmable)
Auto precharge / All bank precharge controlled by A10
Auto refresh and Self refresh
4096 refresh cycles every 64ms
Discrete IC and module design conform to
PC133 specification.
APPLICATION
Main memoryor graphic memoryin computer systems
85pin 1pin
94pin
95pin
10pin
11pin
124pin 40pin
125pin 41pin
168pin 84pin
MIT-DS-0349-0.1
MITSUBISHI
ELECTRIC
15/Oct. /1999 1

1 page




MH16S72DCFA-6 pdf
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72DCFA-6
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
BASIC FUNCTIONS
The MH16S72DCFA provides basic functions,bank(row)activate,burst read / write,
bank(row)precharge,and auto / self refresh.
Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge. In
addition to 3 signals,/S,CKE and A10 are used as chip select,refresh option,and precharge
option,respectively.
To know the detailed definition of commands please see the command truth table.
CK
/S
/RAS
/CAS
/WE
CKE
A10
Chip Select : L=select, H=deselect
Command
Command def ine basic commands
Command
Ref resh Option @ref resh command
Precharge Option @precharge or read/write command
Activate(ACT) [/RAS =L, /CAS = /WE =H]
ACT command activates a row in an idle bank indicated by BA.
Read(READ) [/RAS =H,/CAS =L, /WE =H]
READ command starts burst read from the active bank indicated by BA.First output
data appears after /CAS latency. When A10 =H at this command,the bank is
deactivated after the burst read(auto-precharge,READA).
Write(WRITE) [/RAS =H, /CAS = /WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data
length to be written is set by burst length. When A10 =H at this command, the bank
is deactivated after the burst write(auto-precharge,WRITEA).
Precharge(PRE) [/RAS =L, /CAS =H,/WE =L]
PRE command deactivates the active bank indicated by BA. This command also
terminates burst read / write operation. When A10 =H at this command, both banks
are deactivated(precharge all, PREA).
Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H]
PEFA command starts auto-refresh cycle. Refresh address including bank address
are generated internally. After this command, the banks are precharged automatically.
MIT-DS-0349-0.1
MITSUBISHI
ELECTRIC
15/Oct. /1999 5

5 Page





MH16S72DCFA-6 arduino
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72DCFA-6
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE FOR CKE
CKE CKE
Current State n-1 n
SELF -
HX
REFRESH*1 L H
LH
LH
LH
LH
LL
POWER
DOWN
HX
LH
LL
ALL BANKS H H
IDLE*2
HL
HL
HL
HL
HL
HL
ANY STATE
other than
L
H
H
X
H
L
listed above
L
L
H
L
/S /RAS /CAS /WE Add
Action
X X X X X INVALID
H X X X X Exit Self-Refresh(Idle after tRC)
L H H H X Exit Self-Refresh(Idle after tRC)
L H H L X ILLEGAL
L H L X X ILLEGAL
L L X X X ILLEGAL
X X X X X NOP(Maintain Self-Refresh)
X X X X X INVALID
X X X X X Exit Power Down to Idle
X X X X X NOP(Maintain Self-Refresh)
X X X X X Refer to Function Truth Table
L L L H X Enter Self-Refresh
H X X X X Enter Power Down
L H H H X Enter Power Down
L H H L X ILLEGAL
L H L X X ILLEGAL
L L X X X ILLEGAL
X X X X X Refer to Current State = Power Down
X X X X X Refer to Function Truth Table
X X X X X Begin CK0 Suspend at Next Cycle*3
X X X X X Exit CK0 Suspend at Next Cycle*3
X X X X X Maintain CK0 Suspend
ABBREVIATIONS:
H = High Level, L = Low Level, X = Don't Care
NOTES:
1. CKE Low to High transition will re-enable CK and other inputs asynchronously.
A minimum setup time must be satisfied before any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only form the All banks idle State.
3. Must be legal command.
MIT-DS-0349-0.1
MITSUBISHI
ELECTRIC
15/Oct. /1999 11

11 Page







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