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MC14020B Schematic ( PDF Datasheet ) - ON Semiconductor

Teilenummer MC14020B
Beschreibung 14-Bit Binary Counter
Hersteller ON Semiconductor
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Gesamt 7 Seiten
MC14020B Datasheet, Funktion
MC14020B
14-Bit Binary Counter
The MC14020B 14−stage binary counter is constructed with MOS
P−Channel and N−Channel enhancement mode devices in a single
monolithic structure. This part is designed with an input wave shaping
circuit and 14 stages of ripple−carry binary counter. The device
advances the count on the negative−going edge of the clock pulse.
Applications include time delay circuits, counter controls, and
frequency−dividing circuits.
Features
Fully Static Operation
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low−power TTL Loads or One Low−power
Schottky TTL Load Over the Rated Temperature Range
Buffered Outputs Available from stages 1 and 4 thru 14
Common Reset Line
Pin−for−Pin Replacement for CD4020B
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol
Parameter
Value
Unit
VDD
Vin, Vout
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
−0.5 to +18.0
−0.5 to VDD + 0.5
V
V
Iin, Iout
Input or Output Current
(DC or Transient) per Pin
±10 mA
PD Power Dissipation, per Package
(Note 1)
500 mW
TA Ambient Temperature Range
Tstg Storage Temperature Range
TL Lead Temperature
(8−Second Soldering)
−55 to +125
−65 to +150
260
°C
°C
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Temperature Derating: “D/DW” Packages: –7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS (Vin or Vout) VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
http://onsemi.com
SOIC−16
D SUFFIX
CASE 751B
TSSOP−16
DT SUFFIX
CASE 948F
PIN ASSIGNMENT
Q12 1
Q13 2
Q14 3
Q6 4
Q5 5
Q7 6
Q4 7
VSS 8
16 VDD
15 Q11
14 Q10
13 Q8
12 Q9
11 R
10 C
9 Q1
MARKING DIAGRAMS
16
14020BG
AWLYWW
1
SOIC−16
16
14
020B
ALYWG
G
1
TSSOP−16
A
WL, L
YY, Y
WW, W
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Indicator
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 9
1
Publication Order Number:
MC14020B/D






MC14020B Datasheet, Funktion
MC14020B
PACKAGE DIMENSIONS
0.15 (0.006) T U S
16
2X L/2
L
PIN 1
IDENT.
1
0.15 (0.006) T U S
0.10 (0.004)
−T− SEATING
PLANE
D
C
TSSOP−16
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F
ISSUE B
16X K REF
0.10 (0.004) M T U S V S
9 J1
B
−U− J
N
8
K
ÇÇÉÉÇÇÉÉK1ÇÇÉÉ
SECTION N−N
0.25 (0.010)
M
NOTES:
  1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
  2. CONTROLLING DIMENSION: MILLIMETER.
  3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
  4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER
SIDE.
  5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL CONDITION.
  6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
  7. DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE -W-.
A
−V−
G
N
F
DETAIL E
H DETAIL E
−W−
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC
0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC
0.252 BSC
M 0_ 8_ 0_ 8_
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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