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PDF MC100EP33 Data sheet ( Hoja de datos )
| Número de pieza | MC100EP33 | |
| Descripción | 3.3V 5VECL / 4 Divider | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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MC10EP33, MC100EP33
3.3 V/5 V ECL B4 Divider
Description
The MC10/100EP33 is an integrated B4 divider. The differential
clock inputs.
The VBB pin, an internally generated voltage supply, is available to
this device only. For single-ended input conditions, the unused
differential input is connected to VBB as a switching reference voltage.
VBB may also rebias AC coupled inputs. When used, decouple VBB
and VCC via a 0.01 mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, VBB should be left open.
The reset pin is asynchronous and is asserted on the rising edge.
Upon powerup, the internal flip-flops will attain a random state; the
reset allows for the synchronization of multiple EP33’s in a system.
The 100 Series contains temperature compensation.
Features
• 320 ps Propagation Delay
• Maximum Frequency = > 4 GHz Typical
• PECL Mode Operating Range:
VCC = 3.0 V to 5.5 V with VEE = 0 V
• NECL Mode Operating Range:
VCC = 0 V with VEE = −3.0 V to −5.5 V
• Open Input Default State
• Safety Clamp on Inputs
• Q Output Will Default LOW with Inputs Open or at VEE
• VBB Output
• These Devices are Pb-Free, Halogen Free and are RoHS Compliant
www.onsemi.com
8
1
8
1
SOIC−8 NB
TSSOP−8
DFN8
D SUFFIX
DT SUFFIX MN SUFFIX
CASE 751−07 CASE 948R−02 CASE 506AA
MARKING DIAGRAMS*
8
HEP64
ALYW
G
1
8
HP64
ALYWG
G
1
14
8
KEP64
ALYW
G
1
SOIC−8 NB
8
KP64
ALYWG
G
1
TSSOP−8
14
DFN8
H = MC10 A = Assembly Location
K = MC100 L = Wafer Lot
5Q = MC10 Y = Year
3L = MC100 W = Work Week
M = Date Code
G = Pb-Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
August, 2016 − Rev. 11
1
Publication Order Number:
MC10EP33/D
1 page  
MC10EP33, MC100EP33
Table 8. 100EP DC CHARACTERISTICS, PECL (VCC = 3.3 V, VEE = 0 V (Note 1))
−40°C
25°C
85°C
Symbol
IEE
VOH
VOL
VIH
VIL
VBB
VIHCMR
Characteristic
Power Supply Current
Output HIGH Voltage (Note 2)
Output LOW Voltage (Note 2)
Input HIGH Voltage (Single-Ended)
Input LOW Voltage (Single-Ended)
Output Voltage Reference
Input HIGH Voltage Common Mode
Range (Differential Configuration) (Note 3)
Min
18
2155
1355
2075
1355
1775
2.0
Typ
26
2280
1480
1875
Max
40
2405
1605
2420
1675
1975
3.3
Min
23
2155
1355
2075
1355
1775
2.0
Typ
26
2280
1480
1875
Max
45
2405
1605
2420
1675
1975
3.3
Min
23
2155
1355
2075
1355
1775
2.0
Typ
26
2280
1480
1875
Max
45
2405
1605
2420
1675
1975
3.3
Unit
mA
mV
mV
mV
mV
mV
V
IIH Input HIGH Current
150 150 150 mA
IIL Input LOW Current
0.5 0.5 0.5 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V.
2. All loading with 50 W to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 9. 100EP DC CHARACTERISTICS, PECL (VCC = 5.0 V, VEE = 0 V (Note 1))
−40°C
25°C
85°C
Symbol
Characteristic
Min Typ Max Min Typ Max Min Typ Max Unit
IEE
VOH
VOL
VIH
VIL
VBB
VIHCMR
Power Supply Current
Output HIGH Voltage (Note 2)
Output LOW Voltage (Note 2)
Input HIGH Voltage (Single-Ended)
Input LOW Voltage (Single-Ended)
Output Voltage Reference
Input HIGH Voltage Common Mode
Range (Differential Configuration) (Note 3)
18
3855
3055
3775
3055
3475
2.0
26
3980
3180
3575
40
4105
3305
4120
3375
3675
5.0
23
3855
3055
3775
3055
3475
2.0
26
3980
3180
3575
45
4105
3305
4120
3375
3675
5.0
23
3855
3055
3775
3055
3475
2.0
26
3980
3180
3575
45
4105
3305
4120
3375
3675
5.0
mA
mV
mV
mV
mV
mV
V
IIH Input HIGH Current
150 150 150 mA
IIL Input LOW Current
0.5 0.5 0.5 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V.
2. All loading with 50 W to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
www.onsemi.com
5
5 Page 
MC10EP33, MC100EP33
PACKAGE DIMENSIONS
DFN8 2x2, 0.5 P
MN SUFFIX
CASE 506AA
ISSUE F
DA
B
PIN ONE
REFERENCE
ÇÇÇÇ2X 0.10 C
E
2X 0.10 C TOP VIEW
0.10 C
DETAIL B
0.08 C
NOTE 4
(A3)
A1
SIDE VIEW
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
L1
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
DETAIL A
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
OPTIONAL
CONSTRUCTIONS
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
EXPOSED Cu
MOLD CMPD
ÉÉÇÉÉÇ ÉÇÇÉÇÇA A1
A3
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.20 0.30
D 2.00 BSC
D2 1.10 1.30
E 2.00 BSC
E2 0.70 0.90
DETAIL B
ALTERNATE
CONSTRUCTIONS
e 0.50 BSC
K 0.30 REF
L 0.25 0.35
L1 −−− 0.10
C
SEATING
PLANE
DETAIL A
D2
14
8X L
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
1.30
8X
0.50
E2
K8
e/2
e
5 8X b
0.10 C A B
0.05 C NOTE 3
BOTTOM VIEW
0.90 2.30
1
8X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
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www.onsemi.com
11
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC10EP33/D
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet MC100EP33.PDF ] | |
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