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Número de pieza | MC-45D16CB641 | |
Descripción | 16 M-WORD BY 64-BIT DDR SYNCHRONOUS DYNAMIC RAM MODULE UNBUFFERED TYPE | |
Fabricantes | NEC | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de MC-45D16CB641 (archivo pdf) en la parte inferior de esta página. Total 16 Páginas | ||
No Preview Available ! PRELIMINARY DATA SHEET
MOS INTEGRATED CIRCUIT
MC-45D16CB641
16 M-WORD BY 64-BIT DDR SYNCHRONOUS DYNAMIC RAM MODULE
UNBUFFERED TYPE
Description
The MC-45D16CB641 is a 16,777,216 words by 64 bits DDR synchronous dynamic RAM module on which 8 pieces
of 128M DDR SDRAM: µPD45D128842 are assembled.
These modules provide high density and large quantities of memory in a small space without utilizing the surface-
mounting technology on the printed circuit board.
Decoupling capacitors are mounted on power supply line for noise reduction.
Features
• 16,777,216 words by 64 bits organization
• Clock frequency
Part number
/CAS latency
Clock frequency
(MAX.)
Module type
MC-45D16CB641KF-C75
CL = 2.5
133 MHz
DDR SDRAM
CL = 2
100 MHz
Unbuffered DIMM
MC-45D16CB641KF-C80
CL = 2.5
125 MHz
Design specification
CL = 2
100 MHz
Rev.0.9 compliant
• Fully Synchronous Dynamic RAM with all signals except DM, DQS and DQ referenced to a positive clock edge
• Double Data Rate interface
Differential CLK (/CLK) input
Data inputs and DM are synchronized with both edges of DQS
Data outputs and DQS are synchronized with a cross point of CLK and /CLK
• Quad internal banks operation
• Possible to assert random column address in every clock cycle
• Programmable Mode register set
/CAS latency (2, 2.5)
Burst length (2, 4, 8)
Wrap sequence (Sequential / Interleave)
• Automatic precharge and controlled precharge
• CBR (Auto) refresh and self refresh
• 2.5 V ± 0.2 V Power supply for VDD
• 2.5 V ± 0.2 V Power supply for VDDQ
• SSTL_2 compatible with all signals
• 4,096 refresh cycles / 64 ms
• Burst termination by Precharge command and Burst stop command
• 184-pin dual in-line memory module (Pin pitch = 1.27 mm)
• Unbuffered type
• Serial PD
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. M14897EJ2V0DS00 (2nd edition)
Date Published June 2000 NS CP(K)
Printed in Japan
The mark 5 shows major revised points.
©
2000
1 page MC-45D16CB641
Electrical Specifications
• All voltages are referenced to VSS (GND).
• After power up, wait more than 1 ms and then, execute Power on sequence and CBR (auto) refresh before
proper device operation is achieved.
Absolute Maximum Ratings
Parameter
Voltage on power supply pin relative to VSS
Voltage on input pin relative to VSS
Short circuit output current
Power dissipation
Storage temperature
Symbol
VDD, VDDQ
VT
IO
PD
Tstg
Condition
Rating
–0.5 to +3.6
–0.5 to +3.6
50
12
–55 to +125
Unit
V
V
mA
W
°C
Caution
Exposing the device to stress above those listed in Absolute Maximum Ratings could cause
permanent damage. The device is not meant to be operated under conditions outside the limits
described in the operational section of this specification. Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
Recommended Operating Conditions
Parameter
Symbol
Supply voltage
VDD
Supply voltage for DQ, DQS
VDDQ
Input reference voltage
VREF
Termination voltage
VTT
High level dc input voltage
VIH (DC)
Low level dc input voltage
VIL (DC)
Input differential voltage (CLK and /CLK)
VID (DC)
Input crossing point voltage (CLK and /CLK)
VIX
Operating ambient temperature
TA
Condition
MIN.
2.3
2.3
0.49 × VDDQ
VREF − 0.04
VREF + 0.15
−0.3
0.36
0.5 × VDDQ–0.2
0
TYP.
2.5
2.5
VREF
MAX.
Unit
2.7 V
2.7 V
0.51 × VDDQ
V
VREF + 0.04
V
VDD + 0.3
V
VREF − 0.15
V
VDDQ + 0.6
V
0.5 × VDDQ+0.2
70
V
°C
Capacitance (TA = 25 °C, f = 100 MHz)
Parameter
Input capacitance
Data input/output capacitance
Symbol
Test condition
CI1 A0 - A11, BA0, BA1, /RAS,
/CAS, /WE
CI2 CK0 - CK2, /CK0 - /CK2
CI3 CKE0
CI4 /S0
CI/O1
CI/O2
DM(0-7)/DQS(9-16),
DQS0 - DQS7
DQ0 - DQ63
MIN.
TBD
TYP.
MAX.
TBD
Unit
pF
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
pF
TBD
TBD
Preliminary Data Sheet M14897EJ2V0DS00
5
5 Page MC-45D16CB641
Byte No.
Function Described
32 Command and address signal
input setup time
33 Command and address signal
input hold time
34 Data signal input setup time
35 Data signal input hold time
36-61
62
63
SPD revision
Checksum for bytes 0 - 62
64-71 Manufacture’s JEDEC ID code
72 Manufacturing location
73-90 Manufacture’s P/N
91 Revision Code
93-94 Manufacturing date
95-99 Assembly serial number
100-127 Mfg specific
-C75
-C80
-C75
-C80
-C75
-C80
-C75
-C80
-C75
-C80
(2/2)
Hex Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Notes
90H 1 0 0 1 0 0 0 0 0.9 ns
B0H 1 0 1 1 0 0 0 0 1.1 ns
90H 1 0 0 1 0 0 0 0 0.9 ns
B0H 1 0 1 1 0 0 0 0 1.1 ns
50H 0 1 0 1 0 0 0 0 0.5 ns
60H 0 1 1 0 0 0 0 0 0.6 ns
50H 0 1 0 1 0 0 0 0 0.5 ns
60H 0 1 1 0 0 0 0 0 0.6 ns
00H 0 0 0 0 0 0 0 0
9CH 1 0 0 1 1 1 0 0
22H 0 0 1 0 0 0 1 0
00H 0 0 0 0 0 0 0 0
Timing Chart
Refer to the µPD45D128442, 45D128842, 45D128164 Data sheet (M13852E).
Preliminary Data Sheet M14897EJ2V0DS00
11
11 Page |
Páginas | Total 16 Páginas | |
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Número de pieza | Descripción | Fabricantes |
MC-45D16CB641 | 16 M-WORD BY 64-BIT DDR SYNCHRONOUS DYNAMIC RAM MODULE UNBUFFERED TYPE | NEC |
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