(PDF) APD032 Datasheet - PACKAGE MECHANICAL SPECIFICATIONS AND PARAMETERS

Número de pieza	APD032
Descripción	PACKAGE MECHANICAL SPECIFICATIONS AND PARAMETERS
Fabricantes	Etc
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No Preview Available ! INTRODUCTION PACKAGE MECHANICAL SPECIFICATIONS AND PARAMETERS 1. Parameter Definitions: A = Distance from top of chip to top of glass. a = Photodiode Anode. B = Distance from top of glass to bottom of case. c = Photodiode Cathode (Note: cathode is common to case in metal package products unless otherwise noted). W = Window Diameter. F.O.V. = Filed of View (see definition below). 2. Dimensions are in inches (1 inch = 25.4 mm). 3. Pin diameters are 0.018 ± 0.001" unless otherwise specified. 4. Tolerances (unless otherwise noted) General: 0.XX ± 0.01" 0.XXX ± 0.005" Chip Centering: ± 0.010" Dimension `A': ± 0.015" 5. Windows All `UV' Enhanced products are provided with QUARTZ glass windows, 0.027 ± 0.002" thick. All `XUV' products are provided with removable windows. All `DLS' PSD products are provided with A/R coated glass windows. All `FIL' photoconductive and photovoltaic products are epoxy filled instead of glass windows. W F .O .V . A F.O .V. = tan-1 [W /2A] UDT Sensors Inc. Phone: 310-978-0516 Fax: 310-644-1727 http:\\www.udt.com 59 1 page

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Número de pieza	Descripción	Fabricantes
SLA6805M	High Voltage 3 phase Motor Driver IC.	Sanken
SDC1742	12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters.	Analog Devices

PDF APD032 Data sheet ( Hoja de datos )